KR940004323U - 웨이퍼의 테이프 부착장치 - Google Patents
웨이퍼의 테이프 부착장치Info
- Publication number
- KR940004323U KR940004323U KR2019920012784U KR920012784U KR940004323U KR 940004323 U KR940004323 U KR 940004323U KR 2019920012784 U KR2019920012784 U KR 2019920012784U KR 920012784 U KR920012784 U KR 920012784U KR 940004323 U KR940004323 U KR 940004323U
- Authority
- KR
- South Korea
- Prior art keywords
- attachment device
- wafer tape
- tape attachment
- wafer
- tape
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019920012784U KR0124966Y1 (ko) | 1992-07-11 | 1992-07-11 | 웨이퍼의 테이프 부착장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019920012784U KR0124966Y1 (ko) | 1992-07-11 | 1992-07-11 | 웨이퍼의 테이프 부착장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940004323U true KR940004323U (ko) | 1994-02-24 |
KR0124966Y1 KR0124966Y1 (ko) | 1999-02-18 |
Family
ID=19336524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019920012784U KR0124966Y1 (ko) | 1992-07-11 | 1992-07-11 | 웨이퍼의 테이프 부착장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0124966Y1 (ko) |
-
1992
- 1992-07-11 KR KR2019920012784U patent/KR0124966Y1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0124966Y1 (ko) | 1999-02-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20040331 Year of fee payment: 7 |
|
LAPS | Lapse due to unpaid annual fee |