KR950004803U - 테이프 마운팅 장치 - Google Patents

테이프 마운팅 장치

Info

Publication number
KR950004803U
KR950004803U KR2019930014564U KR930014564U KR950004803U KR 950004803 U KR950004803 U KR 950004803U KR 2019930014564 U KR2019930014564 U KR 2019930014564U KR 930014564 U KR930014564 U KR 930014564U KR 950004803 U KR950004803 U KR 950004803U
Authority
KR
South Korea
Prior art keywords
mounting device
tape mounting
tape
mounting
Prior art date
Application number
KR2019930014564U
Other languages
English (en)
Other versions
KR960005389Y1 (ko
Inventor
윤태갑
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019930014564U priority Critical patent/KR960005389Y1/ko
Publication of KR950004803U publication Critical patent/KR950004803U/ko
Application granted granted Critical
Publication of KR960005389Y1 publication Critical patent/KR960005389Y1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
KR2019930014564U 1993-07-30 1993-07-30 테이프 마운팅 장치 KR960005389Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930014564U KR960005389Y1 (ko) 1993-07-30 1993-07-30 테이프 마운팅 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930014564U KR960005389Y1 (ko) 1993-07-30 1993-07-30 테이프 마운팅 장치

Publications (2)

Publication Number Publication Date
KR950004803U true KR950004803U (ko) 1995-02-18
KR960005389Y1 KR960005389Y1 (ko) 1996-06-28

Family

ID=19360349

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930014564U KR960005389Y1 (ko) 1993-07-30 1993-07-30 테이프 마운팅 장치

Country Status (1)

Country Link
KR (1) KR960005389Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100793823B1 (ko) * 2006-07-04 2008-01-10 (주)엔마이크론 대형 피디피(pdp) 패널 제조용 노즐 가공장치의 이송장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100793823B1 (ko) * 2006-07-04 2008-01-10 (주)엔마이크론 대형 피디피(pdp) 패널 제조용 노즐 가공장치의 이송장치

Also Published As

Publication number Publication date
KR960005389Y1 (ko) 1996-06-28

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
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FPAY Annual fee payment

Payment date: 20040331

Year of fee payment: 9

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