KR940001716B1 - 경화성 수지조성물 및 이 조성물로 피복 및 밀봉한 반도체장치 - Google Patents

경화성 수지조성물 및 이 조성물로 피복 및 밀봉한 반도체장치 Download PDF

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Publication number
KR940001716B1
KR940001716B1 KR1019870001666A KR870001666A KR940001716B1 KR 940001716 B1 KR940001716 B1 KR 940001716B1 KR 1019870001666 A KR1019870001666 A KR 1019870001666A KR 870001666 A KR870001666 A KR 870001666A KR 940001716 B1 KR940001716 B1 KR 940001716B1
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South Korea
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weight
represented
general formula
resin composition
epoxy
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Expired - Fee Related
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KR1019870001666A
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English (en)
Korean (ko)
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KR870008949A (ko
Inventor
아끼오 니시까와
도오루 고야마
지까시 간노
노부오 시바다
모또요 와지마
리쯔로 디다
도시가즈 나라하라
Original Assignee
가부시기가이샤 히다찌 세이사꾸쇼
미다 가쓰시게
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Publication of KR870008949A publication Critical patent/KR870008949A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C08G59/5086—Triazines; Melamines; Guanamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
KR1019870001666A 1986-03-07 1987-02-26 경화성 수지조성물 및 이 조성물로 피복 및 밀봉한 반도체장치 Expired - Fee Related KR940001716B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP48348 1986-03-07
JP61-48348 1986-03-07
JP61048348A JPS62207320A (ja) 1986-03-07 1986-03-07 熱硬化性樹脂組成物で封止してなる半導体装置

Publications (2)

Publication Number Publication Date
KR870008949A KR870008949A (ko) 1987-10-22
KR940001716B1 true KR940001716B1 (ko) 1994-03-05

Family

ID=12800875

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870001666A Expired - Fee Related KR940001716B1 (ko) 1986-03-07 1987-02-26 경화성 수지조성물 및 이 조성물로 피복 및 밀봉한 반도체장치

Country Status (3)

Country Link
EP (2) EP0503744A3 (https=)
JP (1) JPS62207320A (https=)
KR (1) KR940001716B1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100591976B1 (ko) * 1998-07-02 2006-06-20 내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션 알릴화 아미드 화합물로부터 제조되는 언더필 밀봉제
US7903230B2 (en) 2002-02-04 2011-03-08 Mitsui Chemicals, Inc. Method for producing liquid crystal display cell and sealing agent for liquid crystal display cell

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH064814B2 (ja) * 1986-03-19 1994-01-19 東芝ケミカル株式会社 半導体ペレット搭載用ペースト
JPH02298510A (ja) * 1989-05-12 1990-12-10 Daicel Chem Ind Ltd エポキシ化合物
DE4330684A1 (de) * 1993-09-10 1995-03-16 Ruetgerswerke Ag Härtbare Bindemittel
US5618891A (en) * 1995-03-29 1997-04-08 General Electric Co. Solventless resin composition having minimal reactivity at room temperature
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
EP0954553B2 (en) * 1997-01-21 2008-12-10 Dow Global Technologies Inc. Latent catalysts for epoxy curing systems
KR100557610B1 (ko) * 1999-10-11 2006-03-10 주식회사 하이닉스반도체 신규한 포토레지스트 단량체, 그의 중합체 및 이를 함유하는 포토레지스트 조성물
JP4451214B2 (ja) * 2004-05-21 2010-04-14 シャープ株式会社 半導体装置
JP6507506B2 (ja) * 2014-07-16 2019-05-08 住友ベークライト株式会社 封止用樹脂組成物及び半導体装置
CN110330648B (zh) * 2019-07-30 2021-06-18 苏州大学 可重塑双马来酰亚胺树脂用预聚体及其应用
CN110330647B (zh) * 2019-07-30 2021-06-18 苏州大学 可重塑形状记忆双马来酰亚胺树脂及其应用
CN110330649B (zh) * 2019-07-30 2021-04-27 苏州大学 可重塑双马来酰亚胺树脂及其应用
CN110330650B (zh) * 2019-07-30 2021-07-09 苏州大学 双马来酰亚胺树脂预聚体及其应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB904549A (en) * 1959-05-06 1962-08-29 British Celanese Preparation of epoxy ethers and formation of cured resinous products therefrom
US4273916A (en) * 1979-02-14 1981-06-16 Trw Inc. Curable cycloaliphatic epoxy-polyimide compositions
JPS5949225A (ja) * 1982-09-16 1984-03-21 Hitachi Ltd 耐熱性難燃性樹脂組成物
US4565859A (en) * 1984-01-30 1986-01-21 Daicel Chemical Industries, Ltd. Polyether compounds, epoxy resins, epoxy resin compositions, and processes for production thereof
JPS60170620A (ja) * 1984-02-16 1985-09-04 Daicel Chem Ind Ltd 新規なエポキシ樹脂組成物
JPS61197621A (ja) * 1985-02-27 1986-09-01 Daicel Chem Ind Ltd 封止剤
JPS61233012A (ja) * 1985-04-10 1986-10-17 Daicel Chem Ind Ltd 繊維強化プラスチツクス

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100591976B1 (ko) * 1998-07-02 2006-06-20 내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션 알릴화 아미드 화합물로부터 제조되는 언더필 밀봉제
US7903230B2 (en) 2002-02-04 2011-03-08 Mitsui Chemicals, Inc. Method for producing liquid crystal display cell and sealing agent for liquid crystal display cell

Also Published As

Publication number Publication date
JPS62207320A (ja) 1987-09-11
KR870008949A (ko) 1987-10-22
EP0503744A2 (en) 1992-09-16
EP0237255A3 (en) 1990-05-30
JPH045041B2 (https=) 1992-01-30
EP0503744A3 (en) 1992-12-09
EP0237255A2 (en) 1987-09-16

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