KR940000743B1 - 반도체 부품의 패턴검출방법 및 본딩방법 - Google Patents

반도체 부품의 패턴검출방법 및 본딩방법 Download PDF

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Publication number
KR940000743B1
KR940000743B1 KR1019900013381A KR900013381A KR940000743B1 KR 940000743 B1 KR940000743 B1 KR 940000743B1 KR 1019900013381 A KR1019900013381 A KR 1019900013381A KR 900013381 A KR900013381 A KR 900013381A KR 940000743 B1 KR940000743 B1 KR 940000743B1
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KR
South Korea
Prior art keywords
chip
pattern
collet
rays
bonding
Prior art date
Application number
KR1019900013381A
Other languages
English (en)
Korean (ko)
Other versions
KR910007108A (ko
Inventor
노부또 야마자끼
간지 오자와
Original Assignee
가부시끼가이샤 신가와
아라이 가즈오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 신가와, 아라이 가즈오 filed Critical 가부시끼가이샤 신가와
Publication of KR910007108A publication Critical patent/KR910007108A/ko
Application granted granted Critical
Publication of KR940000743B1 publication Critical patent/KR940000743B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
KR1019900013381A 1989-09-06 1990-08-29 반도체 부품의 패턴검출방법 및 본딩방법 KR940000743B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1-229361 1989-09-06
JP1229361A JP2757037B2 (ja) 1989-09-06 1989-09-06 ボンディング装置

Publications (2)

Publication Number Publication Date
KR910007108A KR910007108A (ko) 1991-04-30
KR940000743B1 true KR940000743B1 (ko) 1994-01-28

Family

ID=16890964

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900013381A KR940000743B1 (ko) 1989-09-06 1990-08-29 반도체 부품의 패턴검출방법 및 본딩방법

Country Status (2)

Country Link
JP (1) JP2757037B2 (ja)
KR (1) KR940000743B1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190051481A (ko) 2017-11-07 2019-05-15 (주)비엠웍스 초음파에너지 집속 시스템

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002043376A (ja) * 2000-07-19 2002-02-08 Shinkawa Ltd 電子部品の検査方法および電子部品組立装置
JP2008098384A (ja) 2006-10-11 2008-04-24 Denso Corp 半導体パッケージの製造装置及び半導体パッケージの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5259752A (en) * 1975-11-08 1977-05-17 Matsuya Tekkosho Kk Method of knitting crotch of fingers of glove
JPS5746601Y2 (ja) * 1977-05-11 1982-10-14
JPS57173952A (en) * 1981-04-20 1982-10-26 Hitachi Ltd Positioning method of semiconductor chip
JPS5972145A (ja) * 1982-10-19 1984-04-24 Shinkawa Ltd フリップチップボンディング装置及び方法
JPS6410636A (en) * 1987-07-02 1989-01-13 Nec Corp Manufacture of hybrid integrated circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190051481A (ko) 2017-11-07 2019-05-15 (주)비엠웍스 초음파에너지 집속 시스템

Also Published As

Publication number Publication date
JP2757037B2 (ja) 1998-05-25
JPH0393244A (ja) 1991-04-18
KR910007108A (ko) 1991-04-30

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