KR930026523U - 고 발열용 반도체 패키지 - Google Patents

고 발열용 반도체 패키지

Info

Publication number
KR930026523U
KR930026523U KR2019920007675U KR920007675U KR930026523U KR 930026523 U KR930026523 U KR 930026523U KR 2019920007675 U KR2019920007675 U KR 2019920007675U KR 920007675 U KR920007675 U KR 920007675U KR 930026523 U KR930026523 U KR 930026523U
Authority
KR
South Korea
Prior art keywords
semiconductor package
heat generation
high heat
generation semiconductor
package
Prior art date
Application number
KR2019920007675U
Other languages
English (en)
Other versions
KR950006441Y1 (ko
Inventor
윤종상
안상호
박종영
남시백
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Priority to KR92007675U priority Critical patent/KR950006441Y1/ko
Publication of KR930026523U publication Critical patent/KR930026523U/ko
Application granted granted Critical
Publication of KR950006441Y1 publication Critical patent/KR950006441Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR92007675U 1992-05-07 1992-05-07 고 발열용 반도체 패키지 KR950006441Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR92007675U KR950006441Y1 (ko) 1992-05-07 1992-05-07 고 발열용 반도체 패키지

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR92007675U KR950006441Y1 (ko) 1992-05-07 1992-05-07 고 발열용 반도체 패키지

Publications (2)

Publication Number Publication Date
KR930026523U true KR930026523U (ko) 1993-12-28
KR950006441Y1 KR950006441Y1 (ko) 1995-08-10

Family

ID=19332770

Family Applications (1)

Application Number Title Priority Date Filing Date
KR92007675U KR950006441Y1 (ko) 1992-05-07 1992-05-07 고 발열용 반도체 패키지

Country Status (1)

Country Link
KR (1) KR950006441Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190059756A (ko) 2017-11-23 2019-05-31 이주혁 적재화물 자동중량 표시기

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101370445B1 (ko) * 2012-02-13 2014-03-06 엘지이노텍 주식회사 방열성을 향상시킨 칩 온 필름 패키지

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190059756A (ko) 2017-11-23 2019-05-31 이주혁 적재화물 자동중량 표시기

Also Published As

Publication number Publication date
KR950006441Y1 (ko) 1995-08-10

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Payment date: 20060728

Year of fee payment: 12

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