KR940013671U - 열방출 반도체 패키지 - Google Patents

열방출 반도체 패키지

Info

Publication number
KR940013671U
KR940013671U KR2019920021329U KR920021329U KR940013671U KR 940013671 U KR940013671 U KR 940013671U KR 2019920021329 U KR2019920021329 U KR 2019920021329U KR 920021329 U KR920021329 U KR 920021329U KR 940013671 U KR940013671 U KR 940013671U
Authority
KR
South Korea
Prior art keywords
heat dissipation
semiconductor package
dissipation semiconductor
package
heat
Prior art date
Application number
KR2019920021329U
Other languages
English (en)
Other versions
KR0132905Y1 (ko
Inventor
노길섭
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019920021329U priority Critical patent/KR0132905Y1/ko
Publication of KR940013671U publication Critical patent/KR940013671U/ko
Application granted granted Critical
Publication of KR0132905Y1 publication Critical patent/KR0132905Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019920021329U 1992-11-02 1992-11-02 열방출 반도체 패키지 KR0132905Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019920021329U KR0132905Y1 (ko) 1992-11-02 1992-11-02 열방출 반도체 패키지

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019920021329U KR0132905Y1 (ko) 1992-11-02 1992-11-02 열방출 반도체 패키지

Publications (2)

Publication Number Publication Date
KR940013671U true KR940013671U (ko) 1994-06-25
KR0132905Y1 KR0132905Y1 (ko) 1998-12-01

Family

ID=19343088

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019920021329U KR0132905Y1 (ko) 1992-11-02 1992-11-02 열방출 반도체 패키지

Country Status (1)

Country Link
KR (1) KR0132905Y1 (ko)

Also Published As

Publication number Publication date
KR0132905Y1 (ko) 1998-12-01

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