KR960025495U - 칩온보드 열방출 반도체 패키지 - Google Patents

칩온보드 열방출 반도체 패키지

Info

Publication number
KR960025495U
KR960025495U KR2019940039490U KR19940039490U KR960025495U KR 960025495 U KR960025495 U KR 960025495U KR 2019940039490 U KR2019940039490 U KR 2019940039490U KR 19940039490 U KR19940039490 U KR 19940039490U KR 960025495 U KR960025495 U KR 960025495U
Authority
KR
South Korea
Prior art keywords
chip
heat dissipation
semiconductor package
board heat
dissipation semiconductor
Prior art date
Application number
KR2019940039490U
Other languages
English (en)
Other versions
KR200159004Y1 (ko
Inventor
노길섭
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019940039490U priority Critical patent/KR200159004Y1/ko
Publication of KR960025495U publication Critical patent/KR960025495U/ko
Application granted granted Critical
Publication of KR200159004Y1 publication Critical patent/KR200159004Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR2019940039490U 1994-12-31 1994-12-31 칩온보드 열방출 반도체 패키지 KR200159004Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940039490U KR200159004Y1 (ko) 1994-12-31 1994-12-31 칩온보드 열방출 반도체 패키지

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940039490U KR200159004Y1 (ko) 1994-12-31 1994-12-31 칩온보드 열방출 반도체 패키지

Publications (2)

Publication Number Publication Date
KR960025495U true KR960025495U (ko) 1996-07-22
KR200159004Y1 KR200159004Y1 (ko) 1999-10-15

Family

ID=19405573

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940039490U KR200159004Y1 (ko) 1994-12-31 1994-12-31 칩온보드 열방출 반도체 패키지

Country Status (1)

Country Link
KR (1) KR200159004Y1 (ko)

Also Published As

Publication number Publication date
KR200159004Y1 (ko) 1999-10-15

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