KR930010067B1 - 박막형성방법 및 그 장치 - Google Patents
박막형성방법 및 그 장치 Download PDFInfo
- Publication number
- KR930010067B1 KR930010067B1 KR1019850002484A KR850002484A KR930010067B1 KR 930010067 B1 KR930010067 B1 KR 930010067B1 KR 1019850002484 A KR1019850002484 A KR 1019850002484A KR 850002484 A KR850002484 A KR 850002484A KR 930010067 B1 KR930010067 B1 KR 930010067B1
- Authority
- KR
- South Korea
- Prior art keywords
- molecular
- thin film
- molecular beam
- beams
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H01L21/203—
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/544—Controlling the film thickness or evaporation rate using measurement in the gas phase
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Toxicology (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP81121 | 1984-04-24 | ||
| JP59081121A JPS60225422A (ja) | 1984-04-24 | 1984-04-24 | 薄膜形成方法およびその装置 |
| JP59-81121 | 1984-04-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR850007894A KR850007894A (ko) | 1985-12-09 |
| KR930010067B1 true KR930010067B1 (ko) | 1993-10-14 |
Family
ID=13737548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019850002484A Expired - Fee Related KR930010067B1 (ko) | 1984-04-24 | 1985-04-13 | 박막형성방법 및 그 장치 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4639377A (enExample) |
| EP (1) | EP0160479B1 (enExample) |
| JP (1) | JPS60225422A (enExample) |
| KR (1) | KR930010067B1 (enExample) |
| DE (1) | DE3585048D1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2578095B1 (fr) * | 1985-02-28 | 1988-04-15 | Avitaya Francois D | Procede et dispositif de depot par croissance epitaxiale d'un materiau dope |
| US4800840A (en) * | 1986-09-24 | 1989-01-31 | Rockwell International Corporation | Method and apparatus for vapor stream discrimination |
| JP3214505B2 (ja) * | 1991-09-13 | 2001-10-02 | 株式会社デンソー | 半導体装置の製造方法 |
| DE4204650C1 (enExample) * | 1992-02-15 | 1993-07-08 | Hoffmeister, Helmut, Dr., 4400 Muenster, De | |
| US5400739A (en) * | 1992-10-09 | 1995-03-28 | Texas Instruments Incorporated | Method for controlling thin film growth of compound semiconductors using mass spectrometer detectors |
| US5330610A (en) * | 1993-05-28 | 1994-07-19 | Martin Marietta Energy Systems, Inc. | Method of digital epilaxy by externally controlled closed-loop feedback |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2341827A (en) * | 1944-02-15 | Optical unit | ||
| US3168418A (en) * | 1962-03-27 | 1965-02-02 | Alloyd Electronics | Device for monitoring and controlling evaporation rate in vacuum deposition |
| GB1010456A (en) * | 1962-10-02 | 1965-11-17 | G V Planer Ltd | Means for measuring and/or controlling the evaporation rate in vacuum evaporation processes |
| US3347701A (en) * | 1963-02-05 | 1967-10-17 | Fujitsu Ltd | Method and apparatus for vapor deposition employing an electron beam |
| DE1521247C3 (de) * | 1965-03-10 | 1975-04-30 | Fujitsu Ltd., Communications And Electronics, Tokio | Vakuumbedampfungseinrichking mit einem lonenstrommeßfiihler zur Regelung der Verdampfungsgeschwindigkeit |
| US3419718A (en) * | 1965-12-15 | 1968-12-31 | Gulf General Atomic Inc | Apparatus for measuring the flow of electrically neutral particles |
| CH490678A (fr) * | 1967-04-21 | 1970-05-15 | Battelle Development Corp | Jauge de mesure de la vitesse d'évaporation sous vide |
| JPS5123950B1 (enExample) * | 1970-01-30 | 1976-07-20 | ||
| JPS5141546B2 (enExample) * | 1972-01-21 | 1976-11-10 | ||
| US4024399A (en) * | 1975-01-06 | 1977-05-17 | Jersey Nuclear-Avco Isotopes, Inc. | Method and apparatus for measuring vapor flow in isotope separation |
| FR2370320A1 (fr) * | 1976-11-05 | 1978-06-02 | Thomson Csf | Systeme de regulation de flux moleculaires, et son application aux techniques de co-evaporation |
| CH651592A5 (de) * | 1982-10-26 | 1985-09-30 | Balzers Hochvakuum | Dampfquelle fuer vakuumbedampfungsanlagen. |
-
1984
- 1984-04-24 JP JP59081121A patent/JPS60225422A/ja active Granted
-
1985
- 1985-04-13 KR KR1019850002484A patent/KR930010067B1/ko not_active Expired - Fee Related
- 1985-04-22 DE DE8585302794T patent/DE3585048D1/de not_active Expired - Lifetime
- 1985-04-22 US US06/725,793 patent/US4639377A/en not_active Expired - Fee Related
- 1985-04-22 EP EP85302794A patent/EP0160479B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0458684B2 (enExample) | 1992-09-18 |
| US4639377A (en) | 1987-01-27 |
| JPS60225422A (ja) | 1985-11-09 |
| DE3585048D1 (de) | 1992-02-13 |
| EP0160479A3 (en) | 1988-03-30 |
| EP0160479A2 (en) | 1985-11-06 |
| EP0160479B1 (en) | 1992-01-02 |
| KR850007894A (ko) | 1985-12-09 |
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| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
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| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
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| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| G160 | Decision to publish patent application | ||
| PG1605 | Publication of application before grant of patent |
St.27 status event code: A-2-2-Q10-Q13-nap-PG1605 |
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| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
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| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
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| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
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| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 19961015 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
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| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 19961015 |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
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| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
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| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |