JPS5739170A - Method for forming film of alloy or compound - Google Patents

Method for forming film of alloy or compound

Info

Publication number
JPS5739170A
JPS5739170A JP11152780A JP11152780A JPS5739170A JP S5739170 A JPS5739170 A JP S5739170A JP 11152780 A JP11152780 A JP 11152780A JP 11152780 A JP11152780 A JP 11152780A JP S5739170 A JPS5739170 A JP S5739170A
Authority
JP
Japan
Prior art keywords
high frequency
electric current
evaporation sources
alloy
evaporation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11152780A
Other languages
Japanese (ja)
Other versions
JPH0146587B2 (en
Inventor
Noboru Taguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP11152780A priority Critical patent/JPS5739170A/en
Publication of JPS5739170A publication Critical patent/JPS5739170A/en
Publication of JPH0146587B2 publication Critical patent/JPH0146587B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/548—Controlling the composition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To form a film with a predetermined component in good reproducibility, in the ion plating process of an alloy or a compound formed from two or more of evaporation sources, by arranging a probe electrode in the vicinity of said evaporation sources and monitoring an evaporation amount by probe electric current. CONSTITUTION:A coil like high frequency electrode 4 is placed in a vacuum tank 1 and high frequency electric current is flowed from a power source 3 to generate high frequency plasma. Further, Pd is put in a boat 8 made of W and Ti in an electronic beam heating and evaporating source 9 and Pd and Ti are evaporated to be ionized by the high frequency plasma and heated by a heater 5 and the resultant ionized vapor is accelerated and impinged to a substrate plate 6 applied to voltage of 500- 1,000V by an accelerating power source 7 to form a Pd-Ti alloy film. In this time, probes 12, 14 to which positive voltage is applied are provided in front of the evaporation sources 8, 9 and electric current passed therethrough is monitored by ammeters 15, 13 to control voltage so as to adjust said electric current to a predetermined value. The evaporation amount of Pd and Ti from each evaporation sources 8, 9 is appropriately controlled and a Pd-Ti alloy film with a predetermined component is formed on the substrate plate 6 in good reproducibility.
JP11152780A 1980-08-14 1980-08-14 Method for forming film of alloy or compound Granted JPS5739170A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11152780A JPS5739170A (en) 1980-08-14 1980-08-14 Method for forming film of alloy or compound

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11152780A JPS5739170A (en) 1980-08-14 1980-08-14 Method for forming film of alloy or compound

Publications (2)

Publication Number Publication Date
JPS5739170A true JPS5739170A (en) 1982-03-04
JPH0146587B2 JPH0146587B2 (en) 1989-10-09

Family

ID=14563588

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11152780A Granted JPS5739170A (en) 1980-08-14 1980-08-14 Method for forming film of alloy or compound

Country Status (1)

Country Link
JP (1) JPS5739170A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60193026A (en) * 1984-02-17 1985-10-01 テイーアイ（グループ　サービシーズ） Controller for current density
JP2009041098A (en) * 2007-08-11 2009-02-26 Sumitomo Electric Ind Ltd Film deposition method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4965825A (en) * 1981-11-03 1990-10-23 The Personalized Mass Media Corporation Signal processing apparatus and methods

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60193026A (en) * 1984-02-17 1985-10-01 テイーアイ（グループ　サービシーズ） Controller for current density
JP2009041098A (en) * 2007-08-11 2009-02-26 Sumitomo Electric Ind Ltd Film deposition method

Also Published As

Publication number Publication date
JPH0146587B2 (en) 1989-10-09

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