KR920018779A - 도전성 엘라스토머용 조성물 - Google Patents
도전성 엘라스토머용 조성물 Download PDFInfo
- Publication number
- KR920018779A KR920018779A KR1019920004924A KR920004924A KR920018779A KR 920018779 A KR920018779 A KR 920018779A KR 1019920004924 A KR1019920004924 A KR 1019920004924A KR 920004924 A KR920004924 A KR 920004924A KR 920018779 A KR920018779 A KR 920018779A
- Authority
- KR
- South Korea
- Prior art keywords
- composition
- weight
- conductive elastomer
- parts
- standard polystyrene
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (1)
- 표준 폴리스티렌 환상 분자량이 10,000 내지 40,000인 비닐기 함유 폴리디메틸실록산 100중량부, 표준 폴리스티렌 환산 분자량이 10,000 내지 40,000인 히드로실릴기 함유 폴리디메틸실록산 5내지 50중량부 및 도전성 입자 30내지 1,000 중량부를 함유하는 것을 특징으로 하는 도전성 엘라스토머용 조성물.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP91-085725 | 1991-03-27 | ||
JP03085725A JP3134333B2 (ja) | 1991-03-27 | 1991-03-27 | 導電性エラストマー用組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920018779A true KR920018779A (ko) | 1992-10-22 |
KR100199317B1 KR100199317B1 (ko) | 1999-06-15 |
Family
ID=13866825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920004924A KR100199317B1 (ko) | 1991-03-27 | 1992-03-26 | 도전성 엘라스토머용 조성물 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5344593A (ko) |
EP (1) | EP0506272A1 (ko) |
JP (1) | JP3134333B2 (ko) |
KR (1) | KR100199317B1 (ko) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2790592B2 (ja) * | 1993-04-09 | 1998-08-27 | ゼネラル・エレクトリック・カンパニイ | 簡素化された組成の熱硬化性シリコーンゴム組成物 |
DE69407137T2 (de) * | 1993-10-06 | 1998-04-09 | Dow Corning Toray Silicone | Mit Silber gefüllte, elektrisch leitfähige Organosiloxan-Zusammensetzungen |
US5928569A (en) * | 1997-02-26 | 1999-07-27 | Specialty Silicone Products, Inc. | Substantially uniform moldable blends of silver particulate and organopolysiloxane |
US6010646A (en) * | 1997-04-11 | 2000-01-04 | Potters Industries, Inc. | Electroconductive composition and methods for producing such composition |
GB2338713A (en) * | 1998-06-25 | 1999-12-29 | Gentech Int Ltd | Electrically conductive polymeric compositions |
US6533963B1 (en) | 1999-02-12 | 2003-03-18 | Robert A. Schleifstein | Electrically conductive flexible compositions, and materials and methods for making same |
JP3603945B2 (ja) * | 1999-10-06 | 2004-12-22 | 信越化学工業株式会社 | 導電性シリコーンゴム組成物 |
JP3922332B2 (ja) * | 2000-01-17 | 2007-05-30 | 信越化学工業株式会社 | 導電性液状シリコーンゴム組成物 |
JP4623244B2 (ja) | 2000-04-11 | 2011-02-02 | 信越化学工業株式会社 | 電磁波吸収性熱伝導性シリコーンゴム組成物 |
US6838022B2 (en) * | 2002-07-25 | 2005-01-04 | Nexaura Systems, Llc | Anisotropic conductive compound |
JP5132027B2 (ja) * | 2004-05-12 | 2013-01-30 | 株式会社Adeka | ケイ素含有硬化性組成物、及びこれを熱硬化させた硬化物 |
JP4603424B2 (ja) * | 2005-06-08 | 2010-12-22 | 北川工業株式会社 | 衝撃吸収スペーサ |
DE102005028250A1 (de) * | 2005-06-17 | 2006-12-28 | Siemens Ag | Leiterpaste zum Herstellen einer elektrischen Leiterbahn und Herstellungsverfahren der elektrischen Leiterbahn unter Verwendung der Leiterpaste |
JP4943254B2 (ja) * | 2007-07-18 | 2012-05-30 | 太陽ホールディングス株式会社 | 導電性ペースト組成物、および該組成物を用いた透光性導電フィルム並びにその製造方法 |
WO2011145411A1 (ja) * | 2010-05-19 | 2011-11-24 | 東海ゴム工業株式会社 | 導電膜、およびそれを用いたトランスデューサ、フレキシブル配線板 |
EP2599836B1 (en) * | 2010-07-27 | 2015-03-25 | Adeka Corporation | Curable composition for semiconductor encapsulation |
JP5321723B1 (ja) * | 2012-10-29 | 2013-10-23 | 横浜ゴム株式会社 | 導電性組成物および太陽電池セル |
US9365749B2 (en) | 2013-05-31 | 2016-06-14 | Sunray Scientific, Llc | Anisotropic conductive adhesive with reduced migration |
US9777197B2 (en) | 2013-10-23 | 2017-10-03 | Sunray Scientific, Llc | UV-curable anisotropic conductive adhesive |
CN103540138B (zh) * | 2013-10-18 | 2015-07-01 | 中国电子科技集团公司第三十三研究所 | 一种防潮、耐盐雾腐蚀导电橡胶及其制备方法 |
KR102193528B1 (ko) * | 2019-04-17 | 2020-12-23 | 주식회사 아이에스시 | 극저온에서 적용 가능한 검사용 커넥터 |
CN112735673B (zh) * | 2020-12-22 | 2022-10-04 | 江苏晟大元通新材料科技有限公司 | 一种金属基导电聚硅氧烷的制备方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5691302A (en) * | 1979-12-25 | 1981-07-24 | Oki Electric Cable | Pressureesensitive conductive rubber sheet |
JPS5753602A (en) * | 1980-09-18 | 1982-03-30 | Toshiba Corp | Centering device |
JPS59199756A (ja) * | 1983-04-27 | 1984-11-12 | Toshiba Silicone Co Ltd | 導電性シリコ−ンゴム組成物 |
US4547312A (en) * | 1984-08-31 | 1985-10-15 | Dow Corning Corporation | Electrically conductive elastomers from emulsions |
DE3772321D1 (de) * | 1986-09-25 | 1991-09-26 | Wacker Chemie Gmbh | Elektrisch leitfaehiger klebstoff fuer hohen temperaturbereich. |
FR2605326A1 (fr) * | 1986-10-20 | 1988-04-22 | Rhone Poulenc Multi Tech | Composition potentiellement adhesive electriquement conductrice. |
US4777205A (en) * | 1987-07-22 | 1988-10-11 | Wacker Silicones Corporation | Electrically conductive compositions |
US5075038A (en) * | 1988-11-04 | 1991-12-24 | Dow Corning Corporation | Electrically conductive silicone compositions |
CA2000787A1 (en) * | 1988-11-04 | 1990-05-04 | Richard L. Cole | Electrically conductive silicone compositions |
-
1991
- 1991-03-27 JP JP03085725A patent/JP3134333B2/ja not_active Expired - Lifetime
-
1992
- 1992-03-16 EP EP92302224A patent/EP0506272A1/en not_active Withdrawn
- 1992-03-19 US US07/853,813 patent/US5344593A/en not_active Expired - Lifetime
- 1992-03-26 KR KR1019920004924A patent/KR100199317B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100199317B1 (ko) | 1999-06-15 |
US5344593A (en) | 1994-09-06 |
JP3134333B2 (ja) | 2001-02-13 |
JPH05156166A (ja) | 1993-06-22 |
EP0506272A1 (en) | 1992-09-30 |
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