KR920014875A - 전기 적층물용 에폭시 수지 조성물 - Google Patents
전기 적층물용 에폭시 수지 조성물 Download PDFInfo
- Publication number
- KR920014875A KR920014875A KR1019920001171A KR920001171A KR920014875A KR 920014875 A KR920014875 A KR 920014875A KR 1019920001171 A KR1019920001171 A KR 1019920001171A KR 920001171 A KR920001171 A KR 920001171A KR 920014875 A KR920014875 A KR 920014875A
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- resin composition
- bisphenol
- composition according
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000003822 epoxy resin Substances 0.000 title claims 16
- 229920000647 polyepoxide Polymers 0.000 title claims 16
- 239000000203 mixture Substances 0.000 title claims 15
- 229930185605 Bisphenol Natural products 0.000 claims 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 3
- 150000002989 phenols Chemical class 0.000 claims 3
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 125000003700 epoxy group Chemical group 0.000 claims 2
- 229910052736 halogen Inorganic materials 0.000 claims 2
- 150000002367 halogens Chemical class 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 238000006555 catalytic reaction Methods 0.000 claims 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims 1
- VRZVPALEJCLXPR-UHFFFAOYSA-N ethyl 4-methylbenzenesulfonate Chemical compound CCOS(=O)(=O)C1=CC=C(C)C=C1 VRZVPALEJCLXPR-UHFFFAOYSA-N 0.000 claims 1
- VQFKYAZZFFNYQV-UHFFFAOYSA-N methyl 4-chlorobenzenesulfonate Chemical compound COS(=O)(=O)C1=CC=C(Cl)C=C1 VQFKYAZZFFNYQV-UHFFFAOYSA-N 0.000 claims 1
- VUQUOGPMUUJORT-UHFFFAOYSA-N methyl 4-methylbenzenesulfonate Chemical compound COS(=O)(=O)C1=CC=C(C)C=C1 VUQUOGPMUUJORT-UHFFFAOYSA-N 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3027787A JPH05202170A (ja) | 1991-01-30 | 1991-01-30 | 電気積層板用エポキシ樹脂組成物 |
| JP91-027787 | 1991-01-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR920014875A true KR920014875A (ko) | 1992-08-25 |
Family
ID=12230690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019920001171A Withdrawn KR920014875A (ko) | 1991-01-30 | 1992-01-28 | 전기 적층물용 에폭시 수지 조성물 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0497284A3 (cg-RX-API-DMAC7.html) |
| JP (1) | JPH05202170A (cg-RX-API-DMAC7.html) |
| KR (1) | KR920014875A (cg-RX-API-DMAC7.html) |
| BR (1) | BR9200384A (cg-RX-API-DMAC7.html) |
| TW (1) | TW231303B (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5638002B2 (ja) * | 2009-01-06 | 2014-12-10 | ダウ グローバル テクノロジーズ エルエルシー | エポキシ樹脂及び前進プロセスのための金属安定剤 |
| CN115339175B (zh) * | 2022-09-26 | 2023-08-18 | 苏州苏绝电工材料股份有限公司 | 一种有机硅层压玻璃布板及其制备方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2668807A (en) * | 1952-04-08 | 1954-02-09 | Devoe & Raynolds Co | Epoxide compositions |
| US2945004A (en) * | 1956-05-29 | 1960-07-12 | Devoe & Raynolds Co | Epoxide resins reacted with polyhydric phenols |
| US4568735A (en) * | 1984-11-05 | 1986-02-04 | Shell Oil Company | Process for preparing polyepoxides (II) |
-
1991
- 1991-01-30 JP JP3027787A patent/JPH05202170A/ja active Pending
-
1992
- 1992-01-28 KR KR1019920001171A patent/KR920014875A/ko not_active Withdrawn
- 1992-01-28 EP EP19920101367 patent/EP0497284A3/en not_active Withdrawn
- 1992-01-29 BR BR929200384A patent/BR9200384A/pt not_active Application Discontinuation
- 1992-01-29 TW TW081100668A patent/TW231303B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TW231303B (cg-RX-API-DMAC7.html) | 1994-10-01 |
| BR9200384A (pt) | 1992-10-13 |
| EP0497284A2 (en) | 1992-08-05 |
| EP0497284A3 (en) | 1993-01-13 |
| JPH05202170A (ja) | 1993-08-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19920128 |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |