Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
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Filing date
Publication date
Application filed by Hitachi Chemical Co LtdfiledCriticalHitachi Chemical Co Ltd
Priority to JP19144287ApriorityCriticalpatent/JPS6436618A/en
Publication of JPS6436618ApublicationCriticalpatent/JPS6436618A/en
PURPOSE:To obtain the titled composition, containing an epoxy polymer and specific curing agent, having excellent rapid curability, heat and moisture resistance and useful as sealing media, laminated boards, molded products, coatings, etc. CONSTITUTION:The aimed composition containing (A) an epoxy polymer having at least two epoxy groups in the molecule (e.g. bisphenol A diglycidyl ether) and (B) preferably >=30wt.% curing agent consisting essentially of a condensation product of 2,4,6-trimethylol with other phenols (preferably phenol, o-, m- or p-cresol).