JPS55104345A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS55104345A
JPS55104345A JP1240279A JP1240279A JPS55104345A JP S55104345 A JPS55104345 A JP S55104345A JP 1240279 A JP1240279 A JP 1240279A JP 1240279 A JP1240279 A JP 1240279A JP S55104345 A JPS55104345 A JP S55104345A
Authority
JP
Japan
Prior art keywords
cocondensate
phenylphenol
diphenyl ether
type
imide ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1240279A
Other languages
Japanese (ja)
Other versions
JPS5952890B2 (en
Inventor
Akira Fukami
Shohei Eto
Yasushi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1240279A priority Critical patent/JPS5952890B2/en
Publication of JPS55104345A publication Critical patent/JPS55104345A/en
Publication of JPS5952890B2 publication Critical patent/JPS5952890B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)

Abstract

PURPOSE: Title composition with excellent heat resistance, electrical properties, mechanical strength and cure properties which is useful as a laminate resin material, etc., and is prepared by mixing a diphenyl ether/phenylphnol cocondensate type resol resin with an imide ring-containing epoxy resin.
CONSTITUTION: The thermosetting composition is produced by mixing (A) 40W 70wt% of a diphenyl ether/phenylphenol cocondensate type resol resin prepared by cocondensing a diphenyl ether derivative of formula I, wherein X is halogen, hydroxy, 1W4C alkoxy and m+n in the substitution isomers has an average of 1.8W 2.2 with p-phenylphenol or o-phenylphenol to produce a novolak type cocondensate and converting the novolak into the resol type cocondensate, with (B) 60W80wt% of an imide ring-containing epoxy resin prepared by reacting an imide ring-containing dicarboxylic acid compound of formula II, wherein R is a bivalent hydrocarbon radical such as alkylene, cycloalkylene, mono- or polynuclear arylene, with an epoxy compound having at least two epoxy groups per molecule, and optionally (C) a curing catalyst.
COPYRIGHT: (C)1980,JPO&Japio
JP1240279A 1979-02-05 1979-02-05 thermosetting resin composition Expired JPS5952890B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1240279A JPS5952890B2 (en) 1979-02-05 1979-02-05 thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1240279A JPS5952890B2 (en) 1979-02-05 1979-02-05 thermosetting resin composition

Publications (2)

Publication Number Publication Date
JPS55104345A true JPS55104345A (en) 1980-08-09
JPS5952890B2 JPS5952890B2 (en) 1984-12-21

Family

ID=11804260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1240279A Expired JPS5952890B2 (en) 1979-02-05 1979-02-05 thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS5952890B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021117686A1 (en) * 2019-12-10 2021-06-17 ユニチカ株式会社 Imide-group-containing compound, imide-group-containing curing agent, and epoxy resin cured material and electrically insulating material using said epoxy resin cured material
JP2023059232A (en) * 2021-10-14 2023-04-26 財團法人工業技術研究院 Oligomer, composition, and packaging structure

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021117686A1 (en) * 2019-12-10 2021-06-17 ユニチカ株式会社 Imide-group-containing compound, imide-group-containing curing agent, and epoxy resin cured material and electrically insulating material using said epoxy resin cured material
JP6960705B1 (en) * 2019-12-10 2021-11-05 ユニチカ株式会社 Electrically insulating epoxy resin cured product and electrically insulating material using it
CN114728903A (en) * 2019-12-10 2022-07-08 尤尼吉可株式会社 Compound containing imide group, curing agent containing imide group, cured epoxy resin, and electrical insulating material using same
CN114728903B (en) * 2019-12-10 2023-04-28 尤尼吉可株式会社 Imide group-containing compound, imide group-containing curing agent, epoxy resin cured product, and electrical insulating material using same
TWI829983B (en) * 2019-12-10 2024-01-21 日商尤尼吉可股份有限公司 Imide group-containing compound, imide group-containing curing agent, and epoxy resin cured product and electrical insulating material using the same
JP2023059232A (en) * 2021-10-14 2023-04-26 財團法人工業技術研究院 Oligomer, composition, and packaging structure

Also Published As

Publication number Publication date
JPS5952890B2 (en) 1984-12-21

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