JPS55104345A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS55104345A JPS55104345A JP1240279A JP1240279A JPS55104345A JP S55104345 A JPS55104345 A JP S55104345A JP 1240279 A JP1240279 A JP 1240279A JP 1240279 A JP1240279 A JP 1240279A JP S55104345 A JPS55104345 A JP S55104345A
- Authority
- JP
- Japan
- Prior art keywords
- cocondensate
- phenylphenol
- diphenyl ether
- type
- imide ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
Abstract
PURPOSE: Title composition with excellent heat resistance, electrical properties, mechanical strength and cure properties which is useful as a laminate resin material, etc., and is prepared by mixing a diphenyl ether/phenylphnol cocondensate type resol resin with an imide ring-containing epoxy resin.
CONSTITUTION: The thermosetting composition is produced by mixing (A) 40W 70wt% of a diphenyl ether/phenylphenol cocondensate type resol resin prepared by cocondensing a diphenyl ether derivative of formula I, wherein X is halogen, hydroxy, 1W4C alkoxy and m+n in the substitution isomers has an average of 1.8W 2.2 with p-phenylphenol or o-phenylphenol to produce a novolak type cocondensate and converting the novolak into the resol type cocondensate, with (B) 60W80wt% of an imide ring-containing epoxy resin prepared by reacting an imide ring-containing dicarboxylic acid compound of formula II, wherein R is a bivalent hydrocarbon radical such as alkylene, cycloalkylene, mono- or polynuclear arylene, with an epoxy compound having at least two epoxy groups per molecule, and optionally (C) a curing catalyst.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1240279A JPS5952890B2 (en) | 1979-02-05 | 1979-02-05 | thermosetting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1240279A JPS5952890B2 (en) | 1979-02-05 | 1979-02-05 | thermosetting resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55104345A true JPS55104345A (en) | 1980-08-09 |
JPS5952890B2 JPS5952890B2 (en) | 1984-12-21 |
Family
ID=11804260
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1240279A Expired JPS5952890B2 (en) | 1979-02-05 | 1979-02-05 | thermosetting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5952890B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021117686A1 (en) * | 2019-12-10 | 2021-06-17 | ユニチカ株式会社 | Imide-group-containing compound, imide-group-containing curing agent, and epoxy resin cured material and electrically insulating material using said epoxy resin cured material |
JP2023059232A (en) * | 2021-10-14 | 2023-04-26 | 財團法人工業技術研究院 | Oligomer, composition, and packaging structure |
-
1979
- 1979-02-05 JP JP1240279A patent/JPS5952890B2/en not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021117686A1 (en) * | 2019-12-10 | 2021-06-17 | ユニチカ株式会社 | Imide-group-containing compound, imide-group-containing curing agent, and epoxy resin cured material and electrically insulating material using said epoxy resin cured material |
JP6960705B1 (en) * | 2019-12-10 | 2021-11-05 | ユニチカ株式会社 | Electrically insulating epoxy resin cured product and electrically insulating material using it |
CN114728903A (en) * | 2019-12-10 | 2022-07-08 | 尤尼吉可株式会社 | Compound containing imide group, curing agent containing imide group, cured epoxy resin, and electrical insulating material using same |
CN114728903B (en) * | 2019-12-10 | 2023-04-28 | 尤尼吉可株式会社 | Imide group-containing compound, imide group-containing curing agent, epoxy resin cured product, and electrical insulating material using same |
TWI829983B (en) * | 2019-12-10 | 2024-01-21 | 日商尤尼吉可股份有限公司 | Imide group-containing compound, imide group-containing curing agent, and epoxy resin cured product and electrical insulating material using the same |
JP2023059232A (en) * | 2021-10-14 | 2023-04-26 | 財團法人工業技術研究院 | Oligomer, composition, and packaging structure |
Also Published As
Publication number | Publication date |
---|---|
JPS5952890B2 (en) | 1984-12-21 |
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