KR920011310A - 전자 밀봉체 및 그 제조공정 - Google Patents

전자 밀봉체 및 그 제조공정 Download PDF

Info

Publication number
KR920011310A
KR920011310A KR1019910019834A KR910019834A KR920011310A KR 920011310 A KR920011310 A KR 920011310A KR 1019910019834 A KR1019910019834 A KR 1019910019834A KR 910019834 A KR910019834 A KR 910019834A KR 920011310 A KR920011310 A KR 920011310A
Authority
KR
South Korea
Prior art keywords
seal
electronic
card
component
pulp
Prior art date
Application number
KR1019910019834A
Other languages
English (en)
Inventor
베쌍제 미셸
Original Assignee
뤼쉬앙 블랑
메를렝 게렝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 뤼쉬앙 블랑, 메를렝 게렝 filed Critical 뤼쉬앙 블랑
Publication of KR920011310A publication Critical patent/KR920011310A/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Telephone Set Structure (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

내용 없음

Description

전자 밀봉체 및 그 제조공정
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 전자 밀봉체의 개략 단면도, 제2도는 제1도의 일부에 대한 확대도, 제5도는 프린트회로 카드상에 히트싱크를 설치하는 여러단계를 나타낸다.

Claims (9)

  1. 적어도 일면과 가장자리들을 갖고 프린트회로와 전자부품(13)이 상기 면에 배치되어 있는 절연기판(10)을 수용하기 위한 전자밀봉체에 있어서, 상기 밀봉체는 카드로 부터의 맞은편에 부품으로 부터 떨어진채 부품(13)상에 위치된 히트 싱크를 형성하는 금속판(15), 공기보다 더 높은 열전도성을 갖고 카드(10)와 판(15)사이의 간격을 채우는 펄프(16), 및 부품(13)에 의해 방출된 열을 밀봉부(11)에 전달하기 위하여 판(15)과 밀봉부(11)사이의 열 커넥터(18, 19)를 구비하고 있는 것을 특징으로 하는 전자 밀봉체.
  2. 제1항에 있어서, 가소성 절연막(20)이 상기 펄프(16)와 전자부품(13)을 갖는 카드(10)사이에 위치됨을 특징으로 하는 전자 밀봉체
  3. 제1항에 있어서, 상기 열 커넥터(18, 19)는 판(15)의 가장자리들(17)이 양호한 열 접촉으로 결합되는 지지홈(18)을 구비함을 특징으로 하는 전자 밀봉체.
  4. 제1항에 있어서, 상기 펄프(16)는 10 내지 80% 사이에서 구성된 질화 알루미늄 중량 퍼센티지의 질화알루미늄, 혹은 50 내지 80% 사이에서 구성된 수화된 산화 알루미늄으로 채워진 실리콘 수지임을 특징으로 하는 전자 밀봉체.
  5. 제1항에 있어서, 동일한 히트 싱크판(15)은 한쪽 혹은 양쪽면에 상기 열 연결 펌프(16)를 경유하여 판과 양호한 열 접촉하는 하나 이상의 카드(10)를 구비함을 특징으로 하는 전자 밀봉체.
  6. 제1항에 있어서, 상기 밀봉체는 금속벽(12)과 단상 서모시폰(22, 24)대류에 의한 열 연결에 의해 상기 벽에 연결된 냉원(23)을 구비하여 상기 밀봉부를 냉각시킴을 특징으로 하는 전자 밀봉체
  7. 부품(13)을 갖는 카드(10)가 가소성막에 의해 형성된 포장체(25)로 활주되고, 다음 가소성막이 포장체 안에 형성되는 진공으로 부품위로 압압되며, 그리고 양호한 열 전도 펌프(16)가 가소성 막위로 성형되고 마지막으로 금속판(15)이 상기 펄프(16)에 공급되어 상기 히트 싱크를 구성함을 특징으로 하는 제1항에 따른 전자부품(13)과 히트싱크(15)를 구비하는 밀봉체 제조공정.
  8. 제7항에 있어서, 모올드(26)는 카드상에 위치되고 상기 냉 망상조직 펄프(16)는 망상조직후 제거도는 모올드 내로 액체 형태(27)로 부어짐을 특징으로 하는 밀봉체 제조공정.
  9. 제7항에 있어서, 상기 펄프(16)에 의해 덮혀지지 않은 가소성막 부분이 카드의 전기 커넥터(14)로의 접속이 가능토록 제거됨을 특징으로 하는 밀봉체 제조공정.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910019834A 1990-11-09 1991-11-08 전자 밀봉체 및 그 제조공정 KR920011310A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9014016 1990-11-09
FR9014016A FR2669178B1 (fr) 1990-11-09 1990-11-09 Coffre et carte electronique a drain thermique et procede de fabrication d'une telle carte.

Publications (1)

Publication Number Publication Date
KR920011310A true KR920011310A (ko) 1992-06-27

Family

ID=9402086

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910019834A KR920011310A (ko) 1990-11-09 1991-11-08 전자 밀봉체 및 그 제조공정

Country Status (9)

Country Link
US (1) US5208733A (ko)
EP (1) EP0485308B1 (ko)
JP (1) JPH04299600A (ko)
KR (1) KR920011310A (ko)
AU (1) AU645371B2 (ko)
CA (1) CA2054926A1 (ko)
DE (1) DE69109624T2 (ko)
ES (1) ES2074684T3 (ko)
FR (1) FR2669178B1 (ko)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05327283A (ja) * 1992-02-18 1993-12-10 Samsung Electron Co Ltd 半導体パッケージの垂直実装装置及びその実装方法
EP0722200B1 (en) * 1995-01-10 2001-03-21 Sumitomo Wiring Systems, Ltd. Junction box
USD379174S (en) * 1996-02-20 1997-05-13 Pacific Scientific Company Motor control housing
USD382539S (en) * 1996-02-20 1997-08-19 Pacific Scientific Company Motor control housing
US5826643A (en) 1996-06-07 1998-10-27 International Business Machines Corporation Method of cooling electronic devices using a tube in plate heat sink
US5812374A (en) * 1996-10-28 1998-09-22 Shuff; Gregg Douglas Electrical circuit cooling device
US6269866B1 (en) * 1997-02-13 2001-08-07 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
FR2766967A1 (fr) * 1997-07-31 1999-02-05 Scps Dispositif de dissipation thermique et/ou protection electromagnetique pour cartes et composants electroniques
US6088228A (en) * 1998-12-16 2000-07-11 3M Innovative Properties Company Protective enclosure for a multi-chip module
DE19905869C1 (de) * 1999-02-12 2000-10-26 Peters Research Gmbh & Co Kg Bindemittel enthaltende Masse für die Beschichtung von Leiterplatten , Verwendung als Leiterplatten und Verfahren zur Herstellung
JP2001144403A (ja) 1999-11-11 2001-05-25 Yazaki Corp 電気部品の放熱実装構造及び電気部品の実装方法
US6239972B1 (en) 1999-12-13 2001-05-29 Honeywell International Inc. Integrated convection and conduction heat sink for multiple mounting positions
US6201700B1 (en) * 2000-01-06 2001-03-13 Ford Motor Company Box design for maximum heat dissipation
BRPI0100051B1 (pt) * 2001-01-11 2016-11-29 Brasil Compressores Sa gabinete de dispositivo eletrônico
US20030056940A1 (en) 2001-09-27 2003-03-27 International Business Machines Corporation Transpiration cooled heat sink and a self contained coolant supply for same
DE10235047A1 (de) * 2002-07-31 2004-02-12 Endress + Hauser Gmbh + Co. Kg Elektronikgehäuse mit integriertem Wärmeverteiler
JP4096711B2 (ja) * 2002-11-20 2008-06-04 松下電器産業株式会社 回路基板の製造方法
US6963490B2 (en) * 2003-11-10 2005-11-08 Honeywell International Inc. Methods and apparatus for conductive cooling of electronic units
US20100229394A1 (en) * 2004-12-31 2010-09-16 Industrial Technology Research Institute Method for fabricating wick microstructures in heat pipes
KR100677620B1 (ko) * 2005-11-22 2007-02-02 삼성전자주식회사 전자기기의 냉각 방법 및 냉각 효율이 향상된 전자기기
US20070177356A1 (en) * 2006-02-01 2007-08-02 Jeffrey Panek Three-dimensional cold plate and method of manufacturing same
US7450387B2 (en) * 2006-03-02 2008-11-11 Tdk Innoveta Technologies, Inc. System for cooling electronic components
DE102007041419B4 (de) * 2007-08-31 2022-03-31 Sew-Eurodrive Gmbh & Co Kg Anordnung zum Kühlen von elektrischen Bauelementen sowie Umrichter und Kompaktantrieb damit
US8879263B2 (en) * 2009-08-17 2014-11-04 Seagate Technology Llc Conducting heat away from a printed circuit board assembly in an enclosure
US9317079B2 (en) * 2011-03-29 2016-04-19 Echostar Uk Holdings Limited Media content device with customized panel
US8587945B1 (en) * 2012-07-27 2013-11-19 Outlast Technologies Llc Systems structures and materials for electronic device cooling
JP2015018971A (ja) * 2013-07-11 2015-01-29 富士通株式会社 放熱板、及び海中機器
US11191186B2 (en) 2014-06-24 2021-11-30 David Lane Smith System and method for fluid cooling of electronic devices installed in an enclosure
US9560789B2 (en) * 2014-06-24 2017-01-31 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US11744041B2 (en) 2014-06-24 2023-08-29 David Lane Smith System and method for fluid cooling of electronic devices installed in an enclosure
BR202014032719Y1 (pt) * 2014-12-26 2020-04-07 Embraco Ind De Compressores E Solucoes Em Refrigeracao Ltda gabinete de dispositivo eletrônico
US9575523B2 (en) * 2015-01-22 2017-02-21 Microsoft Technology Licensing, Llc Device sandwich structured composite housing
JP6693706B2 (ja) * 2015-04-06 2020-05-13 株式会社デンソー 電子制御装置
US10264710B2 (en) 2015-08-20 2019-04-16 Microsoft Technology Licensing, Llc Thermal material within a device
JP2017188597A (ja) * 2016-04-07 2017-10-12 アズビル株式会社 基板ユニットおよび基板ユニットの製造方法
US10645840B2 (en) 2018-04-23 2020-05-05 Avl Technologies, Inc. Active electronically steered array with waveguide manifold thermocoupled to ICS as a heatsink
CN110733644B (zh) * 2019-09-12 2021-08-10 北京安达维尔航空设备有限公司 一种加强型板卡支架
US11357130B2 (en) * 2020-06-29 2022-06-07 Microsoft Technology Licensing, Llc Scalable thermal ride-through for immersion-cooled server systems

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1913679B2 (de) * 1969-03-18 1971-03-25 Waermeleitvorrichtung fuer elektrische baugruppen
GB1258488A (ko) * 1969-10-18 1971-12-30
US4315300A (en) * 1979-01-29 1982-02-09 The United States Of America As Represented By The Secretary Of The Navy Cooling arrangement for plug-in module assembly
US4603374A (en) * 1984-07-03 1986-07-29 Motorola, Inc. Packaging module for a semiconductor wafer
US4768286A (en) * 1986-10-01 1988-09-06 Eastman Christensen Co. Printed circuit packaging for high vibration and temperature environments
ATE83116T1 (de) * 1988-05-05 1992-12-15 Siemens Nixdorf Inf Syst Anordnung zur konvektiven kuehlung von elektronischen bauelementen, insbesondere von integrierten halbleiterschaltungen.

Also Published As

Publication number Publication date
CA2054926A1 (en) 1992-05-10
EP0485308B1 (fr) 1995-05-10
DE69109624D1 (de) 1995-06-14
DE69109624T2 (de) 1996-01-04
EP0485308A1 (fr) 1992-05-13
AU8773291A (en) 1992-05-14
JPH04299600A (ja) 1992-10-22
AU645371B2 (en) 1994-01-13
US5208733A (en) 1993-05-04
FR2669178B1 (fr) 1996-07-26
ES2074684T3 (es) 1995-09-16
FR2669178A1 (fr) 1992-05-15

Similar Documents

Publication Publication Date Title
KR920011310A (ko) 전자 밀봉체 및 그 제조공정
US7576988B2 (en) Electronic device
US5444909A (en) Method of making a drop-in heat sink
KR100418148B1 (ko) 2개이상의케이싱부분으로형성되는제어장치
US3930114A (en) Integrated circuit package utilizing novel heat sink structure
US5428246A (en) Highly integrated electronic component with heat-conductive plate
KR980006193A (ko) 열적 개량된 플립 칩 패키지 및 그 제조 방법
KR920019530A (ko) 열전도성 접착 필름, 열전도성 접착제 층을 포함하는 라미네이트 및 이의 용도
MY112191A (en) Integrated circuit packages with heat dissipation for high current load
KR20020093999A (ko) 차량 전자 제어모듈
JP2008199022A (ja) パワー半導体モジュールおよびその製造方法
KR910008854A (ko) 전기 또는 전자회로의 성형에 사용되는 세라믹기판
KR840007483A (ko) 반도체 장치와 그 제조방법
EP0548496B1 (en) A mold and a method for manufacturing semiconductor devices of plastics incorporating an exposed heat sink of metal for inspecting the soldered joint
JPH10261847A (ja) 電子部品搭載用放熱基板
WO2005013358A3 (de) Anordnung eines elektrischen bauelements auf einem substrat und verfahren zur herstellung der anordnung
JPH08111482A (ja) 電子パワーデバイスのヒートシンクを電気的に絶縁するための方法および装置
JPH11354958A (ja) 車両用コントロールユニット
JPS5885555A (ja) セラミツクヒ−トシンク
JPH0394455A (ja) 半導体装置
JPS6314466Y2 (ko)
JP2798656B2 (ja) 回路基板
JPS6350866Y2 (ko)
FR2691604A1 (fr) Carte électronique à refroidissement par conduction thermique et son procédé de réalisation.
JPH0364049A (ja) 混成集積回路装置

Legal Events

Date Code Title Description
A201 Request for examination
N231 Notification of change of applicant
E902 Notification of reason for refusal
E601 Decision to refuse application