KR920007107A - 형상 시뮬레이션(Simulation)방법 - Google Patents

형상 시뮬레이션(Simulation)방법 Download PDF

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Publication number
KR920007107A
KR920007107A KR1019910016481A KR910016481A KR920007107A KR 920007107 A KR920007107 A KR 920007107A KR 1019910016481 A KR1019910016481 A KR 1019910016481A KR 910016481 A KR910016481 A KR 910016481A KR 920007107 A KR920007107 A KR 920007107A
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South Korea
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simulation method
cell
calculated
substance
volume ratio
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KR1019910016481A
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KR940010503B1 (ko
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마사히또 후지나가
오소히꼬 고다니
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시기 모리야
미쓰비시 뎅끼 가부시끼가이샤
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Publication of KR940010503B1 publication Critical patent/KR940010503B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)

Abstract

내용 없음

Description

형상 시뮬레이션(Simulation)방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 이 발명의 1실시예에 관한 형상 시뮬레이션 방법을 표시한 플로챠트도,
제2도는 디포지션 계산의 흐름을 표시한 플로챠트도,
제3A~3C도는 제2도의 프롤챠트에 관하여 구체적으로 물질의 체적율을 계산한 예를 표시한 도.

Claims (2)

  1. 해석영역을 복수의 셀로 분할하여, 각 셀마다에 물질의 초기의 체적율을 정의하여, 각 셀에 있어서 물질입자의 유입량 및 유출량을 미소 시간경과마다로 산출하여, 산출된 유입량 및 유출량에 의하여 각 셀에 있어서 물질의 체적율을 미소시간경과마다로 산출하여, 소정값의 체적율을 가진 등체적율면에 의한 물질의 형상을 시뮬레이트하는 것을 특징으로 하는 형상 시뮬레이션방법.
  2. 제1항에 있어서, 각 셀마다로 산출된 체적율을 보간근사하는 것을 특징으로 하는 시뮬레이션방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910016481A 1990-09-26 1991-09-20 형상 시뮬레이션(Simulation)방법 KR940010503B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1990-254113 1990-09-26
JP2254113A JP2507696B2 (ja) 1990-09-26 1990-09-26 形状シミュレ―ション方法

Publications (2)

Publication Number Publication Date
KR920007107A true KR920007107A (ko) 1992-04-28
KR940010503B1 KR940010503B1 (ko) 1994-10-24

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KR1019910016481A KR940010503B1 (ko) 1990-09-26 1991-09-20 형상 시뮬레이션(Simulation)방법

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Country Link
US (1) US5293557A (ko)
JP (1) JP2507696B2 (ko)
KR (1) KR940010503B1 (ko)
CN (1) CN1034699C (ko)
DE (1) DE4132102A1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2851447B2 (ja) * 1991-03-08 1999-01-27 三菱電機株式会社 形状シミュレーション方法
US5812435A (en) * 1993-09-21 1998-09-22 Mitsubishi Denki Kabushiki Kaisha Shape simulation method allowing simulation of processed shape during steps of manufacturing a semiconductor device in a short period of time
JP3526909B2 (ja) * 1993-09-21 2004-05-17 株式会社ルネサステクノロジ 形状シミュレーション方法
US6138052A (en) * 1997-02-10 2000-10-24 Betalaser Mike, Inc. Product forming apparatus having computer-based device for non-contact gauging of a product size
JPH1187197A (ja) * 1997-09-14 1999-03-30 Toshiba Corp シミュレーション方法及びこの方法を実施するシミュレーション装置
US6091845A (en) 1998-02-24 2000-07-18 Micron Technology, Inc. Inspection technique of photomask
KR100280555B1 (ko) * 1999-01-27 2001-01-15 김영환 모디파이드 셀 모델을 이용한 식각 및 증착 모사방법
SE0101984D0 (sv) 2001-05-31 2001-05-31 Skf Ab A device, computer program product and method for indicating a function deviation of one or more details of manufacturing equipment using frequency component analyses
EP1670615B1 (en) * 2003-08-26 2011-05-25 Ormond LLC Cnc abrasive fluid-jet milling
WO2006098034A1 (ja) 2005-03-17 2006-09-21 Fujitsu Limited シミュレーション装置，シミュレーション方法，シミュレーション用プログラムおよび同プログラムを記録したコンピュータ読取可能な記録媒体
JP6089590B2 (ja) * 2012-10-30 2017-03-08 大日本印刷株式会社 形状変化シミュレーション装置および方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
UST944007I4 (ko) * 1973-08-27 1976-03-02
US4534003A (en) * 1981-08-24 1985-08-06 At&T Bell Laboratories Optimized reaction injection molding
US4463380A (en) * 1981-09-25 1984-07-31 Vought Corporation Image processing system
US4882763A (en) * 1984-12-31 1989-11-21 The Standard Oil Company Method of making a rock-pore micromodel involving generation of an accurate and reliable template image of an actual reservoir rock pore system
US4821214A (en) * 1986-04-17 1989-04-11 Brigham Young University Computer graphics method for changing the shape of a geometric model using free-form deformation
US4785399A (en) * 1987-03-03 1988-11-15 International Business Machines Corporation Shaping geometric objects by cumulative translational sweeps
JPH0616475B2 (ja) * 1987-04-03 1994-03-02 三菱電機株式会社 物品の製造システム及び物品の製造方法
DE3830570A1 (de) * 1987-09-08 1989-03-16 Toshiba Machine Co Ltd Berechnungsverfahren fuer die stroemungsanalyse beim spritzgiessen
JPH01141021A (ja) * 1987-11-27 1989-06-02 Toshiba Mach Co Ltd 溶融材料の金型成形における流動解析結果の表示方法
US5031127A (en) * 1987-11-27 1991-07-09 Toshiba Machine Co., Ltd. Molten injection-molding method
US5067101A (en) * 1988-11-29 1991-11-19 Mitsubishi Denki Kabushiki Kaisha Topography simulation method
US5070469A (en) * 1988-11-29 1991-12-03 Mitsubishi Denki Kabushiki Kaisha Topography simulation method
US5071597A (en) * 1989-06-02 1991-12-10 American Bank Note Holographics, Inc. Plastic molding of articles including a hologram or other microstructure

Also Published As

Publication number Publication date
JPH04133326A (ja) 1992-05-07
KR940010503B1 (ko) 1994-10-24
DE4132102A1 (de) 1992-04-09
CN1060167A (zh) 1992-04-08
JP2507696B2 (ja) 1996-06-12
CN1034699C (zh) 1997-04-23
US5293557A (en) 1994-03-08

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