KR920006677B1 - 자동납땜방법 및 장치 - Google Patents

자동납땜방법 및 장치 Download PDF

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Publication number
KR920006677B1
KR920006677B1 KR1019870015357A KR870015357A KR920006677B1 KR 920006677 B1 KR920006677 B1 KR 920006677B1 KR 1019870015357 A KR1019870015357 A KR 1019870015357A KR 870015357 A KR870015357 A KR 870015357A KR 920006677 B1 KR920006677 B1 KR 920006677B1
Authority
KR
South Korea
Prior art keywords
substrate
molten solder
soldering
solder
small nozzles
Prior art date
Application number
KR1019870015357A
Other languages
English (en)
Korean (ko)
Other versions
KR890009521A (ko
Inventor
센이치 요코다
Original Assignee
요코다 기카이 가부시기가이샤
센이치 요코다
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 요코다 기카이 가부시기가이샤, 센이치 요코다 filed Critical 요코다 기카이 가부시기가이샤
Publication of KR890009521A publication Critical patent/KR890009521A/ko
Application granted granted Critical
Publication of KR920006677B1 publication Critical patent/KR920006677B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1019870015357A 1987-12-14 1987-12-30 자동납땜방법 및 장치 KR920006677B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62-315837 1987-12-14
JP62315837A JPH01157764A (ja) 1987-12-14 1987-12-14 自動半田付け方法及び装置

Publications (2)

Publication Number Publication Date
KR890009521A KR890009521A (ko) 1989-08-02
KR920006677B1 true KR920006677B1 (ko) 1992-08-14

Family

ID=18070171

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870015357A KR920006677B1 (ko) 1987-12-14 1987-12-30 자동납땜방법 및 장치

Country Status (2)

Country Link
JP (1) JPH01157764A (ja)
KR (1) KR920006677B1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3547377B2 (ja) * 1999-11-01 2004-07-28 松下電器産業株式会社 半田噴流装置および半田付け方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5858795A (ja) * 1981-10-03 1983-04-07 石井　銀弥 プリント基板のはんだ付け方法
JP2549618B2 (ja) * 1985-05-18 1996-10-30 株式会社東芝 噴流式半田付け装置
JPH0168163U (ja) * 1987-10-22 1989-05-02

Also Published As

Publication number Publication date
JPH01157764A (ja) 1989-06-21
KR890009521A (ko) 1989-08-02
JPH0469510B2 (ja) 1992-11-06

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A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
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