JP4467000B2 - 噴流はんだ槽 - Google Patents
噴流はんだ槽 Download PDFInfo
- Publication number
- JP4467000B2 JP4467000B2 JP2004243056A JP2004243056A JP4467000B2 JP 4467000 B2 JP4467000 B2 JP 4467000B2 JP 2004243056 A JP2004243056 A JP 2004243056A JP 2004243056 A JP2004243056 A JP 2004243056A JP 4467000 B2 JP4467000 B2 JP 4467000B2
- Authority
- JP
- Japan
- Prior art keywords
- jet nozzle
- chamber
- solder
- primary
- jet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 119
- 238000005192 partition Methods 0.000 claims description 18
- 238000003825 pressing Methods 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 14
- 238000005476 soldering Methods 0.000 description 10
- 230000003628 erosive effect Effects 0.000 description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- 239000000470 constituent Substances 0.000 description 7
- 229910052742 iron Inorganic materials 0.000 description 7
- 230000005496 eutectics Effects 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910020220 Pb—Sn Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
Images
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
2 一次噴流ノズル
3 二次噴流ノズル
16 横方仕切り板
17 上質
18 下室
19 縦方仕切り板
20 一次室
21 二次室
23 シリンダ
24 圧力ポンプ
Claims (1)
- 本体内に一次噴流ノズルと二次噴流ノズルが設置された噴流はんだ槽において、
本体内を上室と下室の上下二室に分ける横方仕切り板と、
前記下室を一次室と二次室の左右二室に分ける縦方仕切り板と、
前記横方仕切り板の一次室の上部に設けられ一次室と連通した一次噴流ノズルと、
前記一次室と前記上室とを連通するように前記横方仕切り板を貫通して設けられた一次噴流ノズル側の孔と、
該一次噴流ノズル側の孔に取り付けられたシリンダーと、
該一次噴流ノズル側の孔に取り付けられたシリンダーに設置され下方に圧力をかけ溶融はんだを噴流させる一次室の圧力ポンプと、
前記横方仕切り板の二次室の上部に設けられ二次室と連通した二次噴流ノズルと、
前記二次室と前記上室とを連通するように前記横方仕切り板を貫通して設けられた二次噴流ノズル側の孔と、
該二次噴流ノズル側の孔に取り付けられたシリンダーと、
該二次噴流ノズル側の孔に取り付けられたシリンダーに設置され下方に圧力をかけ溶融はんだを噴流させる二次室の圧力ポンプとからなることを特徴とする鉛フリー用噴流はんだ槽。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004243056A JP4467000B2 (ja) | 2004-08-24 | 2004-08-24 | 噴流はんだ槽 |
TW094118337A TW200608847A (en) | 2004-08-24 | 2005-06-03 | Jet solder tank (2) |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004243056A JP4467000B2 (ja) | 2004-08-24 | 2004-08-24 | 噴流はんだ槽 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006055904A JP2006055904A (ja) | 2006-03-02 |
JP4467000B2 true JP4467000B2 (ja) | 2010-05-26 |
Family
ID=36103816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004243056A Expired - Lifetime JP4467000B2 (ja) | 2004-08-24 | 2004-08-24 | 噴流はんだ槽 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4467000B2 (ja) |
TW (1) | TW200608847A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010047787A (ja) * | 2008-08-19 | 2010-03-04 | Mitsubishi Materials Corp | はんだ含浸シート材の製造方法及び製造装置 |
WO2010110341A1 (ja) * | 2009-03-24 | 2010-09-30 | 千住金属工業株式会社 | 部分噴流はんだ付け装置及び部分噴流はんだ付け方法 |
EP2928634B1 (de) * | 2012-12-07 | 2018-02-21 | SEHO Systemtechnik GmbH | Verfahren und lötvorrichtung zum selektivlöten mit mindestens einer lötdüse und einem anderen funktionselement, die durch eine bewegungseinrichtung synchron bewegt werden |
CN106862704A (zh) * | 2017-04-21 | 2017-06-20 | 曾庆明 | 水平式喷锡装置和喷锡机及其方法 |
-
2004
- 2004-08-24 JP JP2004243056A patent/JP4467000B2/ja not_active Expired - Lifetime
-
2005
- 2005-06-03 TW TW094118337A patent/TW200608847A/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200608847A (en) | 2006-03-01 |
JP2006055904A (ja) | 2006-03-02 |
TWI371236B (ja) | 2012-08-21 |
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