TW200608847A - Jet solder tank (2) - Google Patents
Jet solder tank (2)Info
- Publication number
- TW200608847A TW200608847A TW094118337A TW94118337A TW200608847A TW 200608847 A TW200608847 A TW 200608847A TW 094118337 A TW094118337 A TW 094118337A TW 94118337 A TW94118337 A TW 94118337A TW 200608847 A TW200608847 A TW 200608847A
- Authority
- TW
- Taiwan
- Prior art keywords
- solder tank
- jet solder
- duct
- divided
- tank
- Prior art date
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Since the main component of lead-free soldering is tin, the stainless steel that forms the solder tank may be seriously corroded. Further, because a duct is employed in the conventional jet solder tank, it requires a propeller pump, a storage tank and a rectification plate, which also produce corrosion. In the jet solder tank of the present invention, the body is divided into upper and lower two chambers with a horizontal diaphragm. Further, the lower chamber is divided into a primary chamber and a secondary chamber with a vertical diaphragm, and a duct is not used.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004243056A JP4467000B2 (en) | 2004-08-24 | 2004-08-24 | Jet solder bath |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200608847A true TW200608847A (en) | 2006-03-01 |
TWI371236B TWI371236B (en) | 2012-08-21 |
Family
ID=36103816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094118337A TW200608847A (en) | 2004-08-24 | 2005-06-03 | Jet solder tank (2) |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4467000B2 (en) |
TW (1) | TW200608847A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010047787A (en) * | 2008-08-19 | 2010-03-04 | Mitsubishi Materials Corp | Method for producing solder-impregnated sheet material and production device therefor |
CN102365910B (en) * | 2009-03-24 | 2013-06-05 | 千住金属工业株式会社 | Localized jet soldering device and partial jet soldering method |
WO2014086954A1 (en) * | 2012-12-07 | 2014-06-12 | Seho Systemtechnik Gmbh | Method and soldering device for selective soldering with at least one solder nozzle and another functional element which are moved synchronously by a movement device |
CN106862704A (en) * | 2017-04-21 | 2017-06-20 | 曾庆明 | Horizontal tin jet device and tin-spraying machine and its method |
-
2004
- 2004-08-24 JP JP2004243056A patent/JP4467000B2/en active Active
-
2005
- 2005-06-03 TW TW094118337A patent/TW200608847A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2006055904A (en) | 2006-03-02 |
JP4467000B2 (en) | 2010-05-26 |
TWI371236B (en) | 2012-08-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |