TW200608847A - Jet solder tank (2) - Google Patents

Jet solder tank (2)

Info

Publication number
TW200608847A
TW200608847A TW094118337A TW94118337A TW200608847A TW 200608847 A TW200608847 A TW 200608847A TW 094118337 A TW094118337 A TW 094118337A TW 94118337 A TW94118337 A TW 94118337A TW 200608847 A TW200608847 A TW 200608847A
Authority
TW
Taiwan
Prior art keywords
solder tank
jet solder
duct
divided
tank
Prior art date
Application number
TW094118337A
Other languages
Chinese (zh)
Other versions
TWI371236B (en
Inventor
Akira Takaguchi
Original Assignee
Senju System Technology Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju System Technology Kk filed Critical Senju System Technology Kk
Publication of TW200608847A publication Critical patent/TW200608847A/en
Application granted granted Critical
Publication of TWI371236B publication Critical patent/TWI371236B/zh

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Since the main component of lead-free soldering is tin, the stainless steel that forms the solder tank may be seriously corroded. Further, because a duct is employed in the conventional jet solder tank, it requires a propeller pump, a storage tank and a rectification plate, which also produce corrosion. In the jet solder tank of the present invention, the body is divided into upper and lower two chambers with a horizontal diaphragm. Further, the lower chamber is divided into a primary chamber and a secondary chamber with a vertical diaphragm, and a duct is not used.
TW094118337A 2004-08-24 2005-06-03 Jet solder tank (2) TW200608847A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004243056A JP4467000B2 (en) 2004-08-24 2004-08-24 Jet solder bath

Publications (2)

Publication Number Publication Date
TW200608847A true TW200608847A (en) 2006-03-01
TWI371236B TWI371236B (en) 2012-08-21

Family

ID=36103816

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094118337A TW200608847A (en) 2004-08-24 2005-06-03 Jet solder tank (2)

Country Status (2)

Country Link
JP (1) JP4467000B2 (en)
TW (1) TW200608847A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010047787A (en) * 2008-08-19 2010-03-04 Mitsubishi Materials Corp Method for producing solder-impregnated sheet material and production device therefor
CN102365910B (en) * 2009-03-24 2013-06-05 千住金属工业株式会社 Localized jet soldering device and partial jet soldering method
WO2014086954A1 (en) * 2012-12-07 2014-06-12 Seho Systemtechnik Gmbh Method and soldering device for selective soldering with at least one solder nozzle and another functional element which are moved synchronously by a movement device
CN106862704A (en) * 2017-04-21 2017-06-20 曾庆明 Horizontal tin jet device and tin-spraying machine and its method

Also Published As

Publication number Publication date
JP2006055904A (en) 2006-03-02
JP4467000B2 (en) 2010-05-26
TWI371236B (en) 2012-08-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees