JP2006055904A - 噴流はんだ槽 - Google Patents
噴流はんだ槽 Download PDFInfo
- Publication number
- JP2006055904A JP2006055904A JP2004243056A JP2004243056A JP2006055904A JP 2006055904 A JP2006055904 A JP 2006055904A JP 2004243056 A JP2004243056 A JP 2004243056A JP 2004243056 A JP2004243056 A JP 2004243056A JP 2006055904 A JP2006055904 A JP 2006055904A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- jet
- jet nozzle
- chamber
- primary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
【解決手段】本発明の噴流はんだ槽は、本体を横方仕切り板で上室と下室の上下二室に分けるとともに、下室を縦方仕切り板で一次室と二次室に分けて、ダクトを使用しないようにした。
【選択図】図1
Description
2 一次噴流ノズル
3 二次噴流ノズル
16 横方仕切り板
17 上質
18 下室
19 縦方仕切り板
20 一次室
21 二次室
23 シリンダ
24 圧力ポンプ
Claims (2)
- 本体内に一次噴流ノズルと二次噴流ノズルが設置された噴流はんだ槽において、本体は横方仕切り板で上室と下室の上下二室に分けられているとともに、下室は縦方仕切り板で一次噴流ノズルが設置された一次室と二次噴流ノズルが設置された二次室に分けられていることを特徴とする噴流はんだ槽。
- 横方仕切り板の一次室と二次室となるところには、シリンダーが設置されており、該シリンダー内には圧力ポンプが設置されていることを特徴とする請求項1記載の噴流はんだ槽。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004243056A JP4467000B2 (ja) | 2004-08-24 | 2004-08-24 | 噴流はんだ槽 |
TW094118337A TW200608847A (en) | 2004-08-24 | 2005-06-03 | Jet solder tank (2) |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004243056A JP4467000B2 (ja) | 2004-08-24 | 2004-08-24 | 噴流はんだ槽 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006055904A true JP2006055904A (ja) | 2006-03-02 |
JP4467000B2 JP4467000B2 (ja) | 2010-05-26 |
Family
ID=36103816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004243056A Expired - Lifetime JP4467000B2 (ja) | 2004-08-24 | 2004-08-24 | 噴流はんだ槽 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4467000B2 (ja) |
TW (1) | TW200608847A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010047787A (ja) * | 2008-08-19 | 2010-03-04 | Mitsubishi Materials Corp | はんだ含浸シート材の製造方法及び製造装置 |
US20120006886A1 (en) * | 2009-03-24 | 2012-01-12 | Senju Metal Industry Co., Ltd. | Localized jet soldering device and partial jet soldering method |
WO2014086954A1 (de) * | 2012-12-07 | 2014-06-12 | Seho Systemtechnik Gmbh | Verfahren und lötvorrichtung zum selektivlöten mit mindestens einer lötdüse und einem anderen funktionselement, die durch eine bewegungseinrichtung synchron bewegen werden |
CN106862704A (zh) * | 2017-04-21 | 2017-06-20 | 曾庆明 | 水平式喷锡装置和喷锡机及其方法 |
-
2004
- 2004-08-24 JP JP2004243056A patent/JP4467000B2/ja not_active Expired - Lifetime
-
2005
- 2005-06-03 TW TW094118337A patent/TW200608847A/zh not_active IP Right Cessation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010047787A (ja) * | 2008-08-19 | 2010-03-04 | Mitsubishi Materials Corp | はんだ含浸シート材の製造方法及び製造装置 |
US20120006886A1 (en) * | 2009-03-24 | 2012-01-12 | Senju Metal Industry Co., Ltd. | Localized jet soldering device and partial jet soldering method |
US8403199B2 (en) * | 2009-03-24 | 2013-03-26 | Senju Metal Industry Co., Ltd. | Localized jet soldering device and partial jet soldering method |
WO2014086954A1 (de) * | 2012-12-07 | 2014-06-12 | Seho Systemtechnik Gmbh | Verfahren und lötvorrichtung zum selektivlöten mit mindestens einer lötdüse und einem anderen funktionselement, die durch eine bewegungseinrichtung synchron bewegen werden |
US10201866B2 (en) | 2012-12-07 | 2019-02-12 | Seho Systemtechnik Gmbh | Method and soldering device for selective soldering with at least one solder nozzle and another functional element which are moved synchronously by a movement device |
CN106862704A (zh) * | 2017-04-21 | 2017-06-20 | 曾庆明 | 水平式喷锡装置和喷锡机及其方法 |
Also Published As
Publication number | Publication date |
---|---|
TW200608847A (en) | 2006-03-01 |
JP4467000B2 (ja) | 2010-05-26 |
TWI371236B (ja) | 2012-08-21 |
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