TWI354520B - - Google Patents

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Publication number
TWI354520B
TWI354520B TW94118335A TW94118335A TWI354520B TW I354520 B TWI354520 B TW I354520B TW 94118335 A TW94118335 A TW 94118335A TW 94118335 A TW94118335 A TW 94118335A TW I354520 B TWI354520 B TW I354520B
Authority
TW
Taiwan
Prior art keywords
solder
jet
nozzle
pump
tin
Prior art date
Application number
TW94118335A
Other languages
English (en)
Chinese (zh)
Other versions
TW200603699A (en
Inventor
Issaku Sato
Akira Takaguchi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW200603699A publication Critical patent/TW200603699A/zh
Application granted granted Critical
Publication of TWI354520B publication Critical patent/TWI354520B/zh

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Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW094118335A 2004-06-09 2005-06-03 Wave soldering tub (the 1st case) TW200603699A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004170876A JP3992149B2 (ja) 2004-06-09 2004-06-09 噴流はんだ槽

Publications (2)

Publication Number Publication Date
TW200603699A TW200603699A (en) 2006-01-16
TWI354520B true TWI354520B (ja) 2011-12-11

Family

ID=35587947

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094118335A TW200603699A (en) 2004-06-09 2005-06-03 Wave soldering tub (the 1st case)

Country Status (2)

Country Link
JP (1) JP3992149B2 (ja)
TW (1) TW200603699A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102365910B (zh) * 2009-03-24 2013-06-05 千住金属工业株式会社 局部喷流锡焊装置及局部喷流锡焊方法
JP6590232B1 (ja) 2019-04-22 2019-10-16 千住金属工業株式会社 はんだ付け装置及びはんだ付け方法

Also Published As

Publication number Publication date
JP2005353719A (ja) 2005-12-22
TW200603699A (en) 2006-01-16
JP3992149B2 (ja) 2007-10-17

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees