1354520 九、發明說明： 【發明所屬之技術領域】 本發明是關於印刷電路板鑛焊錫的喷流焊錫槽，特 別是關於使用無錯焊錫的鑛烊錫的喷流焊錫槽。 【先前技術】1354520 IX. Description of the Invention: [Technical Field] The present invention relates to a jet solder bath for printed circuit board ore solder, and more particularly to a jet solder bath using tin-free tin for error-free soldering. [Prior Art]
眾所周知，印刷電路板鍍焊錫的方法，係為將印刷 電路板與熔融焊錫接觸的鍍焊錫浸泡法◊該浸泡法是以 鍍焊錫裝置上所設置的助熔劑器，而在印刷電路板上塗 佈助熔劑，以預熱器進行預熱，在喷流焊錫槽中附著熔 融焊錫，以冷却裝置進行冷却等製程的鍍焊錫方法。喷 流焊錫槽上設置的鍍烊錫裝置，具有讓該熔融焊錫噴流 接觸印刷電路板的喷流幫浦。喷流幫浦由幫浦、軸、鏈 齒輪、馬達等所構成，幫浦固定在軸的下部，鏈齒輪固 定在軸的上部。鏈齒輪本體的外部與馬達的鏈齒輪和皮 帶遠接。As is well known, a method of soldering a printed circuit board is a soldering immersion method in which a printed circuit board is in contact with molten solder. The immersion method is a fluxing device provided on a soldering device, and is coated on a printed circuit board. The flux is preheated by a preheater, and the molten solder is adhered to the jet solder bath, and the soldering method is performed by a cooling device to perform cooling and the like. The tin-plated tin-plating device provided on the jet solder bath has a jet pump that allows the molten solder jet to contact the printed circuit board. The jet pump is composed of a pump, a shaft, a chain gear, a motor, etc., the pump is fixed to the lower part of the shaft, and the chain gear is fixed to the upper part of the shaft. The outside of the sprocket body is remote from the sprocket and belt of the motor.
喷流焊錫槽中喷流幫浦是以馬達運轉，馬達運轉由 馬達的鏈齒輪和軸的鏈齒輪連動帶動幫浦運轉。藉由幫 浦將幫浦附近的熔融焊錫吸入，並藉由幫浦的壓力將熔 融烊錫由噴嘴喷流。 傳統印刷電路板鍍焊錫所用的焊錫為錫（Sn)和 紹（Pb)所構成的含鉛（Pb)焊錫。當使用含鉛（⑻ ，錫的電子產品魏或轉讀，由贿法提升功能或 是修理便會丢棄C»電子產品中所使_材料，例如外殼 塑膠’顯示器的玻璃，外框金屬等回收再使用，由於印 6 1354520 刷電路板的焊錫為金屬附著，因此無法完全將焊錫和印 刷電路板分離再使用，只能掩埋處理。掩埋處理的印刷 電路板接觸酸雨之後，焊錫中的鉛（Pb)成份會溶出， 含錯（Pb)成份的酸雨混入地下水中。含紹（pb)成份 的地下水被人或家畜長時間飲用之後，會有鉛中毒的疑 慮，因此全世界開始規範鉛（pb)的使用。因此開始以 無鉛焊錫取代含錯（Pb)焊錫，目前應用的範圍已經很 廣泛。 無鉛焊錫的主成份為錫（Sn)，其他添加銀（Ag)， 銅（Cu)，鉍（Bi)，銦（in)，鋅（Zn),鉻（Cr)， 鐵（Fe) ’鎳（Ni) ’鈷（c〇)，磷（p)等元素。目 前電子產品業界所使用的無鉛焊錫主要為錫_35銀 (Sn-3. 5Ag)(熔點：21〇°c)、錫-〇. 7銅（Sn-0. 7Cu)(熔 點：220。〇 ’ 錫-3A9-0· 5銅（Sn-3A9-0. 5Cu)(熔點：217 C)。使用無鉛焊錫的喷流焊錫槽，熔融焊錫的温度約 為240 C以上的高温。 在喷闕槽中，由於焊錫氧化會產生很多的氧化 物。產生氧化物的原因是高温炫融的焊錫由喷嘴喷法， 喷流的炫融轉落下舰轉錫驗面上時，會造成炫 融焊錫，造成乾淨的金屬與空氣_。所產生的氧 化物’由於比重比炫融燁錫小，因此會浮在炫融谭錫的 液面上’當·噴嘴職生的氧化齡喷流幫浦的方向 f動時’會隨著熔轉錫—起被幫浦吸人。吸入幫浦的 ^匕物’會赠轉錫—起，时対流附著在印刷電 上。附著在印刷電路板上的氧化物，如果太大時， 7 1354520 除了會造成相鄰線路間短路或絕緣電阻下降之外，也會 造成外觀不良，使產品價值變低。 傳統使用含鉛（Pb)焊錫（63錫（Sn)-錯（Pb)焊 錫：炫點為183。〇的喷流焊錫槽時，鍍焊錫時熔融焊錫 的溫度約220°C，雖然會產生氧化，但是由於容易氧化 的錫（Sn)含量較小’因此，產生的氧化物量不多。但 是，使用無鉛焊錫的喷流焊錫槽進行喷流時，由於無鉛 焊錫的熔點較高，鍍焊錫時約25〇°c以上比錫-鉛 (Sn_Pb)焊錫的溫度高’因此相較含錯（pb)谭錫產 生的氧化物很多。而且無鉛焊錫中容易氧化的錫（Sn) 含量高達90質量％以上，因此更容易產生氧化物。 防止傳統喷流焊錫槽中所產生的氧化物由喷流喷 嘴移向噴流幫浦的裝置提案报多（專利文獻丨〜3)。防止 氧化物移動的裝置為隔板。該隔板位於喷流喷嘴和喷流 幫浦之間，隔板的上部突出熔融焊錫的液面，下部位於 熔融焊錫的液面下。設置隔板的喷流焊錫槽，當噴流喷 嘴所產生的氧化物會浮在嫁融焊踢的液面，並往喷流幫 浦的方向移動，而設置在熔融焊錫液面的隔板會阻止氧 化物的移動。 [專利文獻1]實開昭55-171473號公報 [專利文獻2 ]實開昭58-76375號公報 [專利文獻1 ]實開平6-66863號公報 以喷流焊錫槽進行大量印刷電路板的链焊锡時，印 刷電路板的銅箔會溶入噴流焊錫槽的溶融焊锡中，產生 錫（Sn)和銅（Cu)的針狀金屬間化合物。該金屬間化 8 合物在喷流焊__轉錫中大量產生時，針狀金屬 間化合物會_在_電路板上相_線路間造成短 路。當產生的金屬間化合物，麟轉錫—_著在印 刷電路板的銅箔上時，焊錫中的錫（Sn)和銅箔的銅(Cu) 產生合金化’由於鋼（Cu)合金的熔點下降，造成銅（cu) 溶入熔融焊錫中。因此熔融焊錫中的銅（Cu)溶解量變 多，並析出銅錫（CuSn)的金屬間化合物。總之焊錫中 的錫（Sn)含量增多時，炫融焊錫的溫度會變高，由印 刷電路板溶入焊鎖中的銅（Cu)溶解量也變多。主成份 為錫（Sn)的高温無鉛焊錫，當熔融焊錫中的銅（Cu) 溶量變多時’會產生大量的金屬間化合物造成短路的不 銅錫（CuSn)金屬間化合物的比重比含鉛（pb)焊 錫低，因此使用含鉛（Pb)焊錫的噴流焊錫槽時，會浮 遊在熔融焊錫的表面’但是使用無鉛焊錫的喷流焊錫槽 時’比重比無鉛焊錫大，因此，會沈到熔融焊錫下方。 因此金屬間化合物無法以隔板阻止由喷流噴嘴往喷流 幫浦的方向移動，而被喷流幫浦吸入，由喷嘴喷流出， 並附著在印刷電路板上。 【發明内容】 雖然’無法阻止噴流焊錫槽中產生氧化物和金屬間 化合物。但是使用無鉛焊錫的噴流焊錫槽時，除了產生 大量的氧化物和金屬間化合物之外，由於金屬間化合物 比無鉛焊錫的比重大，因此會沈到熔融焊錫的下方，造 成除去的困難ο前述隔板可以阻止氧化物由喷流喷嘴往 嘴流幫浦的方向移動，但是無法阻止金屬間化合物的移 動。本發明乃提出一種可以阻止氧化物和金屬間化合物 由噴流噴嘴往喷流幫浦的方向移動，避免附著在鍵焊錫 的部份上的喷流焊錫槽。 又，所產生的氧化物大多集中在喷流喷嘴附近，而 金屬間化合物則是印刷電路板接觸到由喷嘴喷流的熔 融焊錫時，銅箔溶入熔融焊錫中，而產生在喷流喷嘴附 近。當氧化物和金屬間化合物由噴流喷嘴往喷流幫浦的 方向移動時，會隨著熔融焊錫被噴流幫浦吸入，再由噴 嘴噴流_著在印織路板上。接下來為了方便說明起 見，设置喷流喷嘴的位置稱為喷嘴側，設置喷流幫浦的 位置稱為幫浦側❶ 、 本發明人針對比重比焊錫輕的氧化物和比重較重 的金屬間彳b合物’⑥合存在時’如何㈤時阻止兩者的移動 而提出本發明。 本發明林體内具有魏幫浦和喷流喷嘴的喷流 =錫槽，本體利用基板分成上室和，該基板上具有 t流噴嘴和噴流幫浦，而且，上室的喷嘴側和繁浦侧以 :沒入細焊錫中_板分離，而且，與該堪板連接 、嘴側具有上部突皱面，而下部沒人液面的隔板。 本發明的喷流焊騎在倾姆^齡彳之間，具 „融焊錫的液面，下部沒人液面中的隔板和 ^炫雖鎖的液面下，下部由本體基板突出的堪 〜隔板可以阻止氧化物由喷嘴側往幫_的方向移 動，而堰板和隔板的組合可以阻止金屬間化合物往熔融 烊錫下方，以及由喷嘴侧往幫浦侧的移動。因此，本發 明的喷流焊錫槽可以避免氧化物和金屬間化合物吸入 噴流幫浦中，以及，附著在印刷電路板上，提高鍍焊錫 的可靠度。 【實施方式】 在喷流焊錫槽中’由於熔融焊錫由噴嘴側往幫浦 側流動，氧化物和金屬間化合物會隨著熔融焊錫一起由 噴嘴側往幫浦側流動。但是，本發明的喷流焊錫槽在喷 嘴側和幫浦侧間之間具有具有隔板和堰板 ，因此，可以 用隔板阻止氧化物的移動，以堰板阻止金屬間化合物的 流動。因此，隔板附近會有大量的氧化物必須以網子或 長勺拾取，再放入廢棄物罐清除。 而喷流焊錫槽使用無鉛焊錫時所產生的金屬間化 合物，由於比重比無鉛焊錫大，如果沒有對流的話會沈 入炫融焊錫的下部《但是，喷流焊錫槽如果產生對流 時不會直接沈入溶融焊錫的下方。因此’喷流喷嘴所 產生的金屬間化合物有可能隨著熔融焊錫的流動，越過 堰板上方。本發明即在堰板的前方設有隔板，該隔板可 以強制讓金屬間化合物往下方移動。因此金屬間化合物 由於隔板所造成的往下移動和比重較重的緣故 ，會沈到 熔融焊錫的下方。留在熔融焊錫的下部的金屬間化合物 無法以網子或長勺清除。因此最好係在金屬間化合物沈 下的本體位置，設置有排放口。因此，當進行大量印刷 1354520 電路板的鍍焊錫後，熔融焊錫下部的金屬間化合物，可 以利用排放口將熔融金屬和金屬間化合物排出槽外。 接下來，根據圖面説明本發明的喷流焊錫槽。第^ 圖為本發明第3圖A-A線的喷流焊錫槽截面斜視圖，第2 圖為本發明第3圖A-A線的喷流焊錫槽橫截面圖，第3圖 為本發明喷流焊錫槽的平面圖。 喷流焊錫槽1的本體2上部為開放的箱狀結構。本 體2内部具有熔融焊錫3，以未圖示的電熱器維持預定的 熔融温度。本體2以橫向延伸的的基板4分為上室5和下 室6 ,上室5具有喷流幫浦7和喷流喷嘴8❶ 上室5的幫浦側9和噴嘴側1〇之間，具有堰板^和 隔板12。堰板11位於幫浦側9和喷嘴側1〇之間，並突出 於基板4上’而固疋在本體對向的側壁η、η間。堰板 Π的上部沒入炫融焊錫3的液面，使炫融谭錫通過該堰 板的上部時無法由喷嘴側1〇流到幫浦側9。 在與該堰板相鄰的噴嘴側1〇具有隔板12。隔板12 的上部突出熔融焊錫3的液面，下部沒入熔融焊錫3的液 面。當熔融焊錫3由喷嘴側1〇流向幫浦側9時，無法通過 隔板12的上方，只能在隔板的下部流動，也就是炫融焊 錫的液面無法獅只能在液面下流動。隔板丨2的兩端具 有接合片15，該接合片15接合壁面a , 14並可以自由拆 卸0 喷流幫浦7由圓柱16、壓力幫浦17、軸18、轴用鏈 齒輪19、A帶2G、馬達μ、馬達用鏈齒輪22等所構成。 在基板4上，具有其内有圓柱形穿孔的圓柱16。圓柱16 12 ⑧ 1354520 孔中具有壓力幫浦17,該壓力幫浦固定在軸18上。軸18 的上部連接著軸用鏈齒輪19，藉由皮帶2〇與馬達21的鏈 齒輪22連動。馬達21固定在L截面的拖架23上，該拖架 以多支的腳柱24固定在圓柱16上。 ' 噴流喷嘴8具有劇烈喷流的一次喷流喷嘴25和穩 定喷流的二次喷流喷嘴26。在下室6的一次喷流噴嘴^ 和二次噴流喷嘴26之間以未圖示的隔板分開。一次噴流 嗜嘴25的喷流幫浦作動時，由於喷流幫浦的壓力讓溶融 鲁焊錫由一次噴流喷嘴喷流出來，二次喷流喷嘴26的喷流 幫浦作動時，由於喷流幫浦的壓力讓熔融焊錫由二次喷 • 流喷嘴喷流蛛。但是，由於上室絲分成-次喷流喷 嘴和二次喷流喷嘴，由個別噴嘴喷流的熔融焊錫在上室 混合在一起。 在上室5的最下面，本體壁面27在基板4的上部位 置具有排放口 28。 接下來說明本發明上述噴流焊錫槽的作動狀態。當 • 4達21驅動時，馬達運轉帶動馬達的鍵齒輪22，皮帶 20 ’軸用鏈齒輪19 ’軸18讓壓力幫浦17運轉。隨著壓力 H7的運轉’上室5幫浦_的躲闕3被壓力幫浦 17吸入’下室6内的炫融焊锡受到壓力。在壓力作用下， 將下室6内的溶融焊錫由噴流喷嘴8喷流。 .由未圖示的傳送褒置所傳送的印刷電路板 ，先接 觸人喷"丨L喷嘴23的劇烈噴流而讓焊錫附著在印刷電 路板，料雜n:㈣料翁進人穿孔和晶 片角落’而不會產生未鱗的問題，但是，卻會產生毛 13 1354520 邊f橋接短路等不良。接下來印刷電路板以二次喷嘴的 穩定喷流修飾毛邊、橋接短路等鍍焊錫的不良。 因為由喷流喷嘴8喷流的熔融焊錫為乾淨狀態，當 與空氣接觸之後，會氧化形成氧化，在喷流喷嘴附 近產生大#的氧化物。由於氧化物s的比重比溶融焊錫 J因此會浮在溶融焊錫3的液面上。而且，在喷流焊 錫槽中由印刷電路板溶出的銅⑽會財錫中^踢 (Sn)形成金屬間化合物κ，沈到熔融焊錫的下部。在 喷流焊錫射由喷嘴喷流的減料會由幫浦側吸 入，再由喷嘴喷流進行鄕，喷嘴_產㈣氧化物和 金屬間化合物，也會由喷嘴娜幫咖流動，而被吸入 喷流幫浦中。但是本發明的喷流麟槽中，由於在幫浦 側9和喷嘴讎間設置堪板狀隔板12，因此，可以用 隔板12阻止浮在、溶融焊錫3液面比重小的氧化物汹流 動’並以堪板11阻止沈到炫融焊錫下部的高比重金屬間 化合物Κ的流動。因此’本發明的噴流焊錫槽可以大幅 減少氧化物和金屬間化合物隨著熔融焊錫吸入幫浦側 9 ’在進行印刷電路板的鍵烊錫時，減少氧化物和金屬 間化合物附著在印刷電路板的鍍焊錫部位。 本發明的噴流焊錫槽對於無热焊錫具有良好的效 果’對於含錯（Pb)焊錫也同樣有防止氧化物和金屬間 化合物附著的效果。 1354520 【圖式簡單說明】 第1圖是本發明喷流焊錫槽第3圖的A-A線截面斜視圖。 第2圖是本發明喷流焊錫槽第3圖的A-A線橫截面圖。 第3圖是本發明喷流焊錫槽的平面圖。 【圖式中元件名稱與符號對照】 1 :喷流焊錫槽 2 :本體 3 :熔融焊錫 4 :基板 5 :上室 6 :下室 7 :喷流幫浦 8 :喷流喷嘴 9 :幫浦側 10 :喷嘴側 11 ’·堪板 12 :隔板 13、14 :側壁 15 :接合片 16 :圓柱 17 :壓力幫浦 18 :軸 ⑧ 1354520 19 :軸用鏈齒輪 20 :皮帶 21 :馬達 22 :馬達用鏈齒輪 23 :拖架 24 :腳柱 25 : —次噴流噴嘴 26 :二次喷流喷嘴 27 :本體壁面 28 :排放口In the jet solder bath, the jet pump is operated by a motor, and the motor is driven by the chain gear of the motor and the chain gear of the shaft to drive the pump. The molten solder near the pump is sucked in by the pump, and the molten tin is sprayed from the nozzle by the pressure of the pump. The solder used for soldering of conventional printed circuit boards is lead (Pb) solder composed of tin (Sn) and bis (Pb). When using electronic products containing lead ((8), tin, or transfer, the function of repair or repair by bribery will discard the materials in the C» electronic products, such as the glass of the outer casing plastic display, the metal of the frame, etc. Recycling and reuse, because the solder of the printed circuit board is metal attached, it is impossible to completely separate the solder and the printed circuit board and can only be buried. The buried printed circuit board is exposed to acid rain and the lead in the solder ( Pb) will dissolve and the acid rain containing the wrong (Pb) component will be mixed into the groundwater. After the groundwater containing the pb component is consumed by humans or livestock for a long time, there will be doubts about lead poisoning, so the world begins to regulate lead (pb). The use of lead-free solder has been replaced by lead-free solder. The current application range is very wide. The main component of lead-free solder is tin (Sn), other added silver (Ag), copper (Cu), bismuth ( Bi), indium (in), zinc (Zn), chromium (Cr), iron (Fe) 'nickel (Ni) 'cobalt (c), phosphorus (p) and other elements. Currently used in the electronics industry, lead-free solder Mainly tin _35 silver (Sn-3. 5A g) (melting point: 21 〇 °c), tin-〇. 7 copper (Sn-0. 7Cu) (melting point: 220. 〇' tin - 3A9-0 · 5 copper (Sn-3A9-0. 5Cu) (melting point :217 C). Using a lead-free solder jet solder bath, the temperature of the molten solder is about 240 C. In the squirting bath, a large amount of oxide is generated due to oxidation of the solder. The molten solder is sprayed by the nozzle. When the spray is turned down and turned down to the tin to test the surface, it will cause the solder to be soldered, resulting in clean metal and air. The oxide produced is due to the specific gravity. Small, so it will float on the liquid surface of Tan Rong Tanxi 'When the nozzle of the oxidative age of the nozzle is in the direction of the pump, the movement will be sucked by the tin. The 匕 ' ' will give the tin to the smear, when the turbulence is attached to the printed electricity. If the oxide attached to the printed circuit board is too large, 7 1354520 will cause short circuit between adjacent lines or decrease the insulation resistance. In addition, it also causes poor appearance and lowers the value of the product. Traditionally used lead (Pb) solder (63 tin (Sn)-wrong (Pb) solder: The point is 183. When the solder bath is sprayed, the temperature of the molten solder is about 220 ° C when soldering, although oxidation occurs, but the amount of tin (Sn) which is easily oxidized is small. Therefore, the amount of oxide generated is small. However, when a jet is used in a solder bath with lead-free solder, the melting point of the lead-free solder is higher, and the solder plating is about 25 〇 ° C or more higher than the tin-lead (Sn_Pb) solder temperature. (pb) Tan tin produces a lot of oxides, and the content of tin (Sn) which is easily oxidized in lead-free solder is as high as 90% by mass or more, so that oxides are more likely to be generated. Preventing oxides generated in conventional jet solder baths by spraying A proposal for a device for moving a nozzle to a jet pump has been reported (Patent Document No. 3). The means for preventing the movement of oxides is a separator. The baffle is located between the jet nozzle and the jet pump, the upper portion of the baffle protrudes from the surface of the molten solder, and the lower portion is located below the surface of the molten solder. The jet solder bath of the baffle is arranged, and the oxide generated by the jet nozzle floats on the liquid surface of the margin welding kick and moves in the direction of the jet pump, and the separator disposed on the molten solder liquid surface blocks The movement of oxides. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. 6-66863. In soldering, the copper foil of the printed circuit board is dissolved in the molten solder of the jet solder bath to produce needle-like intermetallic compounds of tin (Sn) and copper (Cu). When the intermetallic compound 8 is produced in a large amount in the sputter welding __trans tin, the acicular intermetallic compound will cause a short circuit between the phases on the board. When the intermetallic compound is produced, the tin (Sn) in the solder and the copper (Cu) in the copper foil are alloyed on the copper foil of the printed circuit board. 'The melting point of the steel (Cu) alloy decreases. Causes copper (cu) to dissolve into the molten solder. Therefore, the amount of copper (Cu) dissolved in the molten solder is increased, and an intermetallic compound of copper tin (CuSn) is precipitated. In short, when the content of tin (Sn) in the solder is increased, the temperature of the soldering solder is increased, and the amount of copper (Cu) dissolved in the soldering pad by the printed circuit board is also increased. The high-temperature lead-free solder with a main component of tin (Sn), when the amount of copper (Cu) dissolved in the molten solder becomes large, 'a large amount of intermetallic compounds will cause short-circuiting of the non-copper-tin (CuSn) intermetallic compound than the lead-containing (pb) The solder is low. Therefore, when a solder bath containing lead (Pb) solder is used, it floats on the surface of the molten solder. However, when using a solder bath with lead-free solder, the specific gravity is larger than that of lead-free solder, so it sinks to Molten the solder underneath. Therefore, the intermetallic compound cannot be prevented from moving by the jet nozzle toward the jet pump by the separator, but is sucked by the jet pump, ejected from the nozzle, and adhered to the printed circuit board. SUMMARY OF THE INVENTION Although it is not possible to prevent oxides and intermetallic compounds from being generated in the jet solder bath. However, when a solder bath using lead-free solder is used, in addition to generating a large amount of oxides and intermetallic compounds, since the ratio of the intermetallic compound to the lead-free solder is large, it sinks below the molten solder, causing difficulty in removal. The plate prevents the oxide from moving from the jet nozzle to the mouth flow, but does not prevent the movement of intermetallic compounds. SUMMARY OF THE INVENTION The present invention is directed to a jet solder bath that prevents oxide and intermetallic compounds from moving from the jet nozzle to the jet pump to avoid adhering to the portion of the bond solder. Moreover, most of the generated oxides are concentrated in the vicinity of the jet nozzle, and the intermetallic compound is when the printed circuit board contacts the molten solder jetted by the nozzle, and the copper foil is dissolved in the molten solder to be generated near the jet nozzle. . When the oxide and the intermetallic compound are moved from the jet nozzle toward the jet pump, the molten solder is sucked by the jet pump, and then sprayed by the nozzle onto the printed board. Next, for convenience of explanation, the position at which the jet nozzle is set is referred to as the nozzle side, and the position at which the jet pump is disposed is referred to as the pump side 、. The inventors have a lighter specific gravity than the solder and a heavier specific gravity metal. The present invention has been proposed to prevent the movement of both when the bis-b compound '6 is present. In the forest of the invention, there is a jet of Wei Bangpu and a jet nozzle = a tin bath, and the body is divided into an upper chamber by using a substrate, and the substrate has a t-flow nozzle and a jet pump, and the nozzle side and the pulverizing side of the upper chamber To: detached into the fine solder _ plate separation, and, with the slab, the mouth side has an upper wrinkle surface, and the lower part has no liquid level of the partition. The jet welding of the present invention rides between the imperial ages, with the liquid surface of the molten solder, the lower part of the liquid surface in the lower part of the liquid surface, and the lower surface of the liquid surface, the lower part is protruded by the body substrate. The spacer can prevent the oxide from moving from the nozzle side to the gang, and the combination of the raft and the separator can prevent the intermetallic compound from moving below the molten bismuth and from the nozzle side to the pump side. The jet solder bath of the invention can prevent oxides and intermetallic compounds from being sucked into the jet pump, and adhere to the printed circuit board to improve the reliability of the solder plating. [Embodiment] In the jet solder bath, 'due to molten solder From the nozzle side to the pump side, oxides and intermetallic compounds flow from the nozzle side to the pump side along with the molten solder. However, the jet solder bath of the present invention has between the nozzle side and the pump side. It has a partition plate and a seesaw. Therefore, the separator can be used to prevent the movement of the oxide, and the seesaw prevents the flow of the intermetallic compound. Therefore, a large amount of oxide near the separator must be picked up by a net or a long spoon. It is then removed into the waste tank. The intermetallic compound produced by the use of lead-free solder in the jet solder bath is larger than the lead-free solder. If there is no convection, it will sink into the lower part of the solder. However, the solder bath If convection occurs, it does not sink directly under the molten solder. Therefore, the intermetallic compound produced by the jet nozzle may pass over the raft above the molten solder. The present invention provides a partition in front of the raft. a plate that forces the intermetallic compound to move downward. Therefore, the intermetallic compound sinks below the molten solder due to the downward movement and heavy specific gravity caused by the separator. It remains in the lower portion of the molten solder. The intermetallic compound cannot be removed by a net or a long spoon. Therefore, it is preferable to provide a discharge port at the position of the body where the intermetallic compound sinks. Therefore, when a large amount of printed 1354520 circuit board is soldered, the metal portion of the lower portion of the molten solder is melted. The compound can use the discharge port to discharge the molten metal and the intermetallic compound out of the tank. Next, according to the drawing The present invention is a cross-sectional view of a jet solder bath of the third embodiment of the present invention, and a second embodiment of the present invention. The figure is a plan view of the jet solder bath of the present invention. The upper portion of the body 2 of the jet solder bath 1 has an open box-like structure. The body 2 has molten solder 3 therein, and a predetermined melting temperature is maintained by an electric heater (not shown). The substrate 4, which is laterally extended, is divided into an upper chamber 5 and a lower chamber 6, and the upper chamber 5 has a jet pump 7 and a jet nozzle 8a between the pump side 9 and the nozzle side 1 of the upper chamber 5, and has a seesaw ^ and the partition plate 12. The weir 11 is located between the pump side 9 and the nozzle side 1〇, and protrudes from the substrate 4' and is fixed between the opposite side walls η, η of the body. The liquid surface of the solder 3 is slid, so that the tin sulphide can pass through the upper portion of the slab and cannot flow from the nozzle side 1 to the pump side 9. The nozzle side 1 adjacent to the slab has a partition 12. The upper portion of the separator 12 protrudes from the liquid surface of the molten solder 3, and the lower portion does not enter the liquid surface of the molten solder 3. When the molten solder 3 flows from the nozzle side 1 to the pump side 9, it cannot pass above the separator 12, and can only flow in the lower portion of the separator, that is, the liquid surface of the solder can not flow under the liquid surface. . Both ends of the spacer 丨 2 have engaging pieces 15, which engage the wall faces a, 14 and are detachable. 0 The jet pump 7 is composed of a cylinder 16, a pressure pump 17, a shaft 18, a shaft sprocket 19, A The belt 2G, the motor μ, the motor sprocket 22, and the like are formed. On the substrate 4, there is a cylinder 16 having a cylindrical perforation therein. The cylinder 16 12 8 1354520 has a pressure pump 17 in the bore which is fixed to the shaft 18. The shaft sprocket 19 is connected to the upper portion of the shaft 18, and is coupled to the sprocket 22 of the motor 21 via the belt 2''. The motor 21 is fixed to a carriage 23 of an L-section which is fixed to the cylinder 16 by a plurality of legs 24. The jet nozzle 8 has a primary jet nozzle 25 that violently jets and a secondary jet nozzle 26 that stabilizes the jet. The primary jet nozzles ^ and the secondary jet nozzles 26 of the lower chamber 6 are separated by a separator (not shown). When the jet flow pump of the jet flow nozzle 25 is actuated, the molten solder is sprayed out by the one jet nozzle due to the pressure of the jet pump, and the jet flow of the secondary jet nozzle 26 is actuated due to the jet flow. Pu's pressure allows the molten solder to be sprayed by a secondary spray nozzle. However, since the upper chamber filament is divided into a secondary jet nozzle and a secondary jet nozzle, the molten solder jetted from the individual nozzles is mixed together in the upper chamber. At the lowermost portion of the upper chamber 5, the body wall surface 27 has a discharge port 28 at an upper portion of the substrate 4. Next, the operation state of the above-described jet solder bath of the present invention will be described. When the drive is up to 21, the motor operates to drive the key gear 22 of the motor, and the belt 20' shaft uses the sprocket 19' shaft 18 to operate the pressure pump 17. With the operation of the pressure H7, the escaping 3 of the upper chamber 5 is pumped by the pressure pump 17 and the squeezing solder in the lower chamber 6 is under pressure. The molten solder in the lower chamber 6 is jetted by the jet nozzle 8 under pressure. The printed circuit board conveyed by the transport device (not shown) first contacts the violent jet of the human spray nozzle 而L nozzle 23 to cause the solder to adhere to the printed circuit board, and the material is mixed with n: (4) material into the perforation and the wafer The corner ' does not cause the problem of unsquashed, but it will produce defects such as short-circuiting of the hair 13 1354520 side f bridge. Next, the printed circuit board is modified by the stable jet of the secondary nozzle to modify the soldering of the burrs, bridge shorts, and the like. Since the molten solder jetted from the jet nozzle 8 is in a clean state, when it comes into contact with air, it oxidizes to form oxidation, and a large oxide is generated in the vicinity of the jet nozzle. Since the specific gravity of the oxide s is higher than that of the molten solder J, it floats on the liquid surface of the molten solder 3. Further, the copper (10) eluted from the printed circuit board in the jet solder bath forms an intermetallic compound κ, which sinks to the lower portion of the molten solder. In the jet solder, the reduction of the jet from the nozzle will be inhaled by the pump side, and then sprayed by the nozzle jet. The nozzle _ (IV) oxide and intermetallic compound will also be flowed by the nozzle and the inhaled The jet is in the pump. However, in the jet stream tank of the present invention, since the plate-like partition plate 12 is provided between the pump side 9 and the nozzle bowl, the separator 12 can be used to prevent the oxide 汹 floating and molten in the liquid surface of the solder 3 The flow 'and the plate 11 prevents the flow of high-specific intermetallic compound 沉 that sinks into the lower part of the glaze solder. Therefore, the sputter solder bath of the present invention can greatly reduce the adhesion of oxides and intermetallic compounds to printed circuit boards when the oxide and intermetallic compounds are sucked into the pump side 9' by the molten solder during the bonding of the printed circuit board. Solder plating parts. The jet solder bath of the present invention has a good effect on solderless solder. The same applies to the prevention of adhesion of oxides and intermetallic compounds to the (Pb) solder. 1354520 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view, taken along line A-A, of Fig. 3 of the jet solder bath of the present invention. Fig. 2 is a cross-sectional view taken along line A-A of Fig. 3 of the jet solder bath of the present invention. Figure 3 is a plan view of the jet solder bath of the present invention. [Comparison of component names and symbols in the drawing] 1 : Jet solder bath 2: Body 3: Molten solder 4: Substrate 5: Upper chamber 6: Lower chamber 7: Jet pump 8: Jet nozzle 9: Pump side 10: Nozzle side 11 '· 板 12 : Separator 13 , 14 : Side wall 15 : Engagement piece 16 : Cylinder 17 : Pressure pump 18 : Shaft 8 1354520 19 : Shaft sprocket 20 : Belt 21 : Motor 22 : Motor Chain gear 23: Trailer 24: Foot column 25: Secondary jet nozzle 26: Secondary jet nozzle 27: Body wall surface 28: Discharge port