KR920004536B1 - Lsi system including a plurality of lsi circuit chips mounted on a board - Google Patents

Lsi system including a plurality of lsi circuit chips mounted on a board

Info

Publication number
KR920004536B1
KR920004536B1 KR8906733A KR890006733A KR920004536B1 KR 920004536 B1 KR920004536 B1 KR 920004536B1 KR 8906733 A KR8906733 A KR 8906733A KR 890006733 A KR890006733 A KR 890006733A KR 920004536 B1 KR920004536 B1 KR 920004536B1
Authority
KR
South Korea
Prior art keywords
lsi
board
system including
circuit chips
chips mounted
Prior art date
Application number
KR8906733A
Other languages
English (en)
Other versions
KR900019186A (ko
Inventor
Dakeshi Gono
Dazro Yomura
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of KR900019186A publication Critical patent/KR900019186A/ko
Application granted granted Critical
Publication of KR920004536B1 publication Critical patent/KR920004536B1/ko

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/316—Testing of analog circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR8906733A 1988-05-19 1989-05-19 Lsi system including a plurality of lsi circuit chips mounted on a board KR920004536B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63123405A JPH0746130B2 (ja) 1988-05-19 1988-05-19 Ｌｓｉシステム
JP63-123405 1988-05-19

Publications (2)

Publication Number Publication Date
KR900019186A KR900019186A (ko) 1990-12-24
KR920004536B1 true KR920004536B1 (en) 1992-06-08

Family

ID=14859743

Family Applications (1)

Application Number Title Priority Date Filing Date
KR8906733A KR920004536B1 (en) 1988-05-19 1989-05-19 Lsi system including a plurality of lsi circuit chips mounted on a board

Country Status (7)

Country Link
US (1) US4949033A (ko)
EP (1) EP0343828B1 (ko)
JP (1) JPH0746130B2 (ko)
KR (1) KR920004536B1 (ko)
AU (1) AU596767B2 (ko)
CA (1) CA1301950C (ko)
DE (1) DE68911374T2 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0394183A (ja) * 1989-05-19 1991-04-18 Fujitsu Ltd 半導体集積回路の試験方法及び回路
JP2760157B2 (ja) * 1991-01-23 1998-05-28 日本電気株式会社 Ｌｓｉテスト方法
WO1992019052A1 (en) * 1991-04-19 1992-10-29 Vlsi Technology, Inc. Mappable test structure for gate array circuit and method for testing the same
JPH05307619A (ja) * 1991-05-16 1993-11-19 Nec Corp マイクロプロセッサのａｃ特性測定方法
JP2936807B2 (ja) * 1991-07-12 1999-08-23 日本電気株式会社 集積回路
TWI269223B (en) * 2005-04-25 2006-12-21 Via Tech Inc Method and related apparatus for calibrating signal driving parameters between chips
JP6003129B2 (ja) * 2012-03-19 2016-10-05 富士通株式会社 描画装置、描画方法および描画プログラム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833853A (en) * 1973-04-13 1974-09-03 Honeywell Inf Systems Method and apparatus for testing printed wiring boards having integrated circuits
DE2437673C3 (de) * 1974-08-05 1978-04-27 Siemens Ag, 1000 Berlin Und 8000 Muenchen Vorrichtung zum Prüfen von Innenlagen mehrlagiger Leiterplatten
JPS53125771A (en) * 1977-04-08 1978-11-02 Toshiba Corp Measuring unit for semiconductor
US4443278A (en) * 1981-05-26 1984-04-17 International Business Machines Corporation Inspection of multilayer ceramic circuit modules by electrical inspection of green specimens
GB2104669A (en) * 1981-08-06 1983-03-09 Int Computers Ltd Apparatus for testing electronic devices
FR2557701B1 (fr) * 1983-12-28 1986-04-11 Crouzet Sa Dispositif de controle de continuite des circuits imprimes
JPS6173075A (ja) * 1984-09-19 1986-04-15 Hitachi Ltd Ｌｓｉ論理状態抽出方式
US4748403A (en) * 1986-02-05 1988-05-31 Hewlett-Packard Company Apparatus for measuring circuit element characteristics with VHF signal
JPS63133072A (ja) * 1986-11-26 1988-06-04 Fujitsu Ltd Ｌｓｉシステムテスト方式

Also Published As

Publication number Publication date
KR900019186A (ko) 1990-12-24
JPH0746130B2 (ja) 1995-05-17
EP0343828A1 (en) 1989-11-29
AU596767B2 (en) 1990-05-10
EP0343828B1 (en) 1993-12-15
CA1301950C (en) 1992-05-26
DE68911374T2 (de) 1994-04-14
US4949033A (en) 1990-08-14
JPH01292272A (ja) 1989-11-24
DE68911374D1 (de) 1994-01-27
AU3486289A (en) 1989-11-23

Similar Documents

Publication Publication Date Title
HK76395A (en) Multiple computer interface circuit board
EP0244699A3 (en) Substrate for a printed circuit board
EP0249688A3 (en) Printed circuit board
GB2187334B (en) Mounting structure for a printed circuit board
GB2226712B (en) Printed circuit board unit
GB2224464B (en) Printed wiring board
EP0335697A3 (en) Integrated circuit device comprising interconnection wiring
GB8620904D0 (en) Forming circuits on base board
KR920004536B1 (en) Lsi system including a plurality of lsi circuit chips mounted on a board
EP0308576A3 (en) A printed wiring board
EP0363074A3 (en) Circuit board manufacture
EP0268497A3 (en) Printed circuit board
GB2191046B (en) Circuit board mounting devices
DE3472332D1 (en) Mounting of semiconductor components on a circuit board
GB2215121B (en) Multi-layer integrated circuit devices
EP0349161A3 (en) Printed wiring board fabrication method
GB2221100B (en) An improved circuit board
GB8903375D0 (en) An improved circuit board
GB2224164B (en) An improved circuit board
GB2220304B (en) A printed circuit board
GB8628972D0 (en) Wiring printed circuit board
KR910001786B1 (en) Circuit board
SG135194G (en) Multiple computer interface circuit board
GB8816902D0 (en) Screened circuit board module
AU104312S (en) A circuit board

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20000531

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee