KR910016649A - 전자부품용 세라믹 복합체 - Google Patents

전자부품용 세라믹 복합체 Download PDF

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Publication number
KR910016649A
KR910016649A KR1019910004677A KR910004677A KR910016649A KR 910016649 A KR910016649 A KR 910016649A KR 1019910004677 A KR1019910004677 A KR 1019910004677A KR 910004677 A KR910004677 A KR 910004677A KR 910016649 A KR910016649 A KR 910016649A
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KR
South Korea
Prior art keywords
composite
ceramic
bubbles
matrix
ceramic matrix
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KR1019910004677A
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English (en)
Inventor
경화모
데이비드 호일 챨스
에드워드 보이어 3세 챨스
Original Assignee
게리 리 그리스올드
미네소타 마이닝 앤드 매뉴팩추어링 컴패니
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Application filed by 게리 리 그리스올드, 미네소타 마이닝 앤드 매뉴팩추어링 컴패니 filed Critical 게리 리 그리스올드
Publication of KR910016649A publication Critical patent/KR910016649A/ko

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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/16—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Porous Artificial Stone Or Porous Ceramic Products (AREA)
  • Inorganic Insulating Materials (AREA)

Abstract

내용 없음

Description

전자부품용 세라믹 복합체
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (17)

  1. 유전상수가 9이하이며, 중공부가 있고, 얇은 벽이 있고, 내화성인 세라믹 버블들을 포함하는 복합체로서, 상기 버블들이 균일하게 세라믹 매트릭스의 전체에 균일하게 분산되어 있는 복합체.
  2. 제1항에 있어서, 상기 복합체가 아직 소성되지 않은 복합체.
  3. 제1항에 있어서, 상기 복합체가 소성된 복합체.
  4. 상기 세라믹 매트릭스가 알루미늄 포스페이트, 알루미나, 멀라이트, 스테아타이트, 포스테라트, 코오디어 라이트 및 그 혼합물들로 이루어진 군으로 부터 선택된 물질로 부터 제조된 복합체.
  5. 제1항에 있어서, 상기 세라믹 버블들이 봉소화 규산 알루미늄, 멀라이트 및 그 혼합물들로 이루어진 군으로 부터 선택되는 복합체.
  6. 제1항에 있어서, 유전상수가 0.1 내지 20 GHZ 에서 측정시, 약 1.5내지 6.5이고 1MHz에서 측정시 약 1.5 내지 6.5이며, 상기 유전 손실인자( ')가 0.1 내지 20 GHz에서는 약 0.001 내지 1.0이며, 유전정접 또는 손실 탄젠트가 1MHz 에서 약 0.001 내지 1.0 인 복합체.
  7. 제1항에 있어서, 상기 버블들이 붕소화규산알루미늄, 멀라이트 및 그 혼합물의 비소성 또는 불완전하게 소성된 버블들로 이루어진 군으로 부터 선택된 버블 복합체.
  8. 제3항에 있어서, 금속층을 추가로 포함하는 복합체.
  9. 제1항에 있어서, 상기 버블대 매트릭스의 비율이 0.6:1.0 내지 1.5:1.0 인 복합체.
  10. 제1항에 있어서, 상기 세라믹 버블들이 10 내지 90부피 퍼센트 농도에서, 상기 세라믹 매트릭스와 혼합되는 복합체.
  11. 제10항에 있어서 상기 세라믹 버블들이 40 내지 70 부피 퍼센트 농도에서 상기 세라믹 매트릭스와 혼합되는 복합체.
  12. 제11항에 있어서, 상기 세라믹 버블들이 50 내지 60부피 퍼센트 농도에서, 상기 세라믹 매트릭스와 혼합되는 복합체.
  13. 금속층을 갖고 있는 제1항에 의한 상기 세라믹 복합체를 포함하는 기재.
  14. 회로를 포함하는 제1항에 의한 상기 세라믹 복합체를 포함하느 기재.
  15. 제1항에 의한 상기 세라믹 복합체를 포함하며, 마이크로파 및 밀리미터파에 투과되는 물품.
  16. 제1항에 있어서, 열 팽창계수가 실은(25℃) 내지 400℃ 에서 약 4.0×10-6/℃인 복합체.
  17. (1) 세라믹 매트릭스 및 세라믹 버블들을 제공하는 단계; (2)단계(1)의 상기 세라믹 매트릭스를 단계(1)의 상기 세라믹 버블들과 혼합하는 단계; (3)단계(2)의 혼합물을 건조하는 단계; (4)단계(3)의 혼합물을 성형하는 단계;및 (5)단계(4)의 혼합물을 소성하여 상기복합체를 형성하는 단계를 포함하는 제1항의 복합체의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910004677A 1990-03-23 1991-03-22 전자부품용 세라믹 복합체 KR910016649A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US498,350 1990-03-23
US07/498,350 US5108958A (en) 1990-03-23 1990-03-23 Ceramic composite for electronic applications

Publications (1)

Publication Number Publication Date
KR910016649A true KR910016649A (ko) 1991-11-05

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ID=23980712

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Country Status (5)

Country Link
US (1) US5108958A (ko)
EP (1) EP0450773A3 (ko)
JP (1) JPH05279145A (ko)
KR (1) KR910016649A (ko)
IL (1) IL97461A0 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5346751A (en) * 1988-12-19 1994-09-13 W. R. Grace & Co.-Conn. Electronic package using closed pore composites
US5204289A (en) * 1991-10-18 1993-04-20 Minnesota Mining And Manufacturing Company Glass-based and glass-ceramic-based composites
US5284706A (en) * 1991-12-23 1994-02-08 Olin Corporation Sealing glass composite
US5691059A (en) * 1995-11-21 1997-11-25 Minnesota Mining And Manfacturing Company Glass and glass-ceramic bubbles having an aluminum nitride coating
US20030236335A1 (en) * 2002-05-13 2003-12-25 Miller James D. Thermally-conductive plastic substrates for electronic circuits and methods of manufacturing same
KR20040039906A (ko) * 2002-11-05 2004-05-12 마이크로코어텍(주) 졸 전구체의 세라믹 버블 및 졸 전구체의 분무건조에 의한세라믹 버블 제조방법
DE102004057804B4 (de) * 2004-11-30 2010-04-08 Osram Opto Semiconductors Gmbh Gehäusekörper für einen Halbleiterchip aus gegossener Keramik mit reflektierender Wirkung und Verfahren zu dessen Herstellung
DE102007020888A1 (de) * 2007-05-04 2008-11-06 Micro Systems Engineering Gmbh & Co. Kg Keramisches Substratmaterial, Verfahren zur Herstellung und Verwendung desselben sowie Antenne oder Antennenarray
DE102007049172A1 (de) * 2007-10-13 2009-04-16 Micro Systems Engineering Gmbh & Co. Kg Mikroreaktor und Verfahren zur Herstellung eines solchen sowie Verfahren zur Herstellung eines Substrats für einen Mikroreaktor
DE102007051318B4 (de) * 2007-10-26 2012-03-22 Astyx Gmbh Herstellungsverfahren für einen Radarsensor
EP2088134B1 (en) * 2007-12-19 2016-09-07 Imerys Kiln Furniture Hungary Ltd. Lightweight ceramic material
DE102008043352A1 (de) * 2008-10-31 2010-05-06 Micro Systems Engineering Gmbh Keramisches Substratmaterial, Verfahren zur Herstellung und Verwendung desselben sowie Antenne oder Antennenarray

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3795524A (en) * 1971-03-01 1974-03-05 Minnesota Mining & Mfg Aluminum borate and aluminum borosilicate articles
US4349456A (en) * 1976-04-22 1982-09-14 Minnesota Mining And Manufacturing Company Non-vitreous ceramic metal oxide microcapsules and process for making same
US4358772A (en) * 1980-04-30 1982-11-09 Hughes Aircraft Company Ceramic broadband radome
US4654324A (en) * 1981-08-27 1987-03-31 Eli Lilly And Company Human proinsulin pharmaceutical formulations
JPS59111345A (ja) * 1982-12-17 1984-06-27 Fujitsu Ltd 低誘電率回路基板
US4752531A (en) * 1985-03-25 1988-06-21 E. I. Du Pont De Nemours And Company Dielectric composition
US4642299A (en) * 1985-04-08 1987-02-10 Gte Products Corporation Silicon nitride having low dielectric loss
JPS62148365A (ja) * 1985-12-20 1987-07-02 富士通株式会社 低誘電性セラミツク板
US4781968A (en) * 1986-02-28 1988-11-01 Digital Equipment Corporation Micro-electronics devices and methods of manufacturing same
JPS62206861A (ja) * 1986-03-07 1987-09-11 Hitachi Ltd セラミツクス多層回路板及び半導体実装構造
US4711860A (en) * 1986-03-12 1987-12-08 Corning Glass Works Modified cordierite glass ceramic composite
US4777153A (en) * 1986-05-06 1988-10-11 Washington Research Foundation Process for the production of porous ceramics using decomposable polymeric microspheres and the resultant product
US4714687A (en) * 1986-10-27 1987-12-22 Corning Glass Works Glass-ceramics suitable for dielectric substrates
US4780435A (en) * 1987-04-15 1988-10-25 Tam, Ceramics, Inc. Dielectric ceramic compositions with linear temperature coefficient characteristics and low dissipation factors
US4867935A (en) * 1988-02-26 1989-09-19 E. I. Du Pont De Nemours And Company Method for preparing ceramic tape compositions

Also Published As

Publication number Publication date
IL97461A0 (en) 1992-06-21
JPH05279145A (ja) 1993-10-26
EP0450773A3 (en) 1992-06-03
EP0450773A2 (en) 1991-10-09
US5108958A (en) 1992-04-28

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