KR910016649A - 전자부품용 세라믹 복합체 - Google Patents
전자부품용 세라믹 복합체 Download PDFInfo
- Publication number
- KR910016649A KR910016649A KR1019910004677A KR910004677A KR910016649A KR 910016649 A KR910016649 A KR 910016649A KR 1019910004677 A KR1019910004677 A KR 1019910004677A KR 910004677 A KR910004677 A KR 910004677A KR 910016649 A KR910016649 A KR 910016649A
- Authority
- KR
- South Korea
- Prior art keywords
- composite
- ceramic
- bubbles
- matrix
- ceramic matrix
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/16—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Porous Artificial Stone Or Porous Ceramic Products (AREA)
- Inorganic Insulating Materials (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (17)
- 유전상수가 9이하이며, 중공부가 있고, 얇은 벽이 있고, 내화성인 세라믹 버블들을 포함하는 복합체로서, 상기 버블들이 균일하게 세라믹 매트릭스의 전체에 균일하게 분산되어 있는 복합체.
- 제1항에 있어서, 상기 복합체가 아직 소성되지 않은 복합체.
- 제1항에 있어서, 상기 복합체가 소성된 복합체.
- 상기 세라믹 매트릭스가 알루미늄 포스페이트, 알루미나, 멀라이트, 스테아타이트, 포스테라트, 코오디어 라이트 및 그 혼합물들로 이루어진 군으로 부터 선택된 물질로 부터 제조된 복합체.
- 제1항에 있어서, 상기 세라믹 버블들이 봉소화 규산 알루미늄, 멀라이트 및 그 혼합물들로 이루어진 군으로 부터 선택되는 복합체.
- 제1항에 있어서, 유전상수가 0.1 내지 20 GHZ 에서 측정시, 약 1.5내지 6.5이고 1MHz에서 측정시 약 1.5 내지 6.5이며, 상기 유전 손실인자( ')가 0.1 내지 20 GHz에서는 약 0.001 내지 1.0이며, 유전정접 또는 손실 탄젠트가 1MHz 에서 약 0.001 내지 1.0 인 복합체.
- 제1항에 있어서, 상기 버블들이 붕소화규산알루미늄, 멀라이트 및 그 혼합물의 비소성 또는 불완전하게 소성된 버블들로 이루어진 군으로 부터 선택된 버블 복합체.
- 제3항에 있어서, 금속층을 추가로 포함하는 복합체.
- 제1항에 있어서, 상기 버블대 매트릭스의 비율이 0.6:1.0 내지 1.5:1.0 인 복합체.
- 제1항에 있어서, 상기 세라믹 버블들이 10 내지 90부피 퍼센트 농도에서, 상기 세라믹 매트릭스와 혼합되는 복합체.
- 제10항에 있어서 상기 세라믹 버블들이 40 내지 70 부피 퍼센트 농도에서 상기 세라믹 매트릭스와 혼합되는 복합체.
- 제11항에 있어서, 상기 세라믹 버블들이 50 내지 60부피 퍼센트 농도에서, 상기 세라믹 매트릭스와 혼합되는 복합체.
- 금속층을 갖고 있는 제1항에 의한 상기 세라믹 복합체를 포함하는 기재.
- 회로를 포함하는 제1항에 의한 상기 세라믹 복합체를 포함하느 기재.
- 제1항에 의한 상기 세라믹 복합체를 포함하며, 마이크로파 및 밀리미터파에 투과되는 물품.
- 제1항에 있어서, 열 팽창계수가 실은(25℃) 내지 400℃ 에서 약 4.0×10-6/℃인 복합체.
- (1) 세라믹 매트릭스 및 세라믹 버블들을 제공하는 단계; (2)단계(1)의 상기 세라믹 매트릭스를 단계(1)의 상기 세라믹 버블들과 혼합하는 단계; (3)단계(2)의 혼합물을 건조하는 단계; (4)단계(3)의 혼합물을 성형하는 단계;및 (5)단계(4)의 혼합물을 소성하여 상기복합체를 형성하는 단계를 포함하는 제1항의 복합체의 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/498,350 US5108958A (en) | 1990-03-23 | 1990-03-23 | Ceramic composite for electronic applications |
US498,350 | 1990-03-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR910016649A true KR910016649A (ko) | 1991-11-05 |
Family
ID=23980712
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910004677A KR910016649A (ko) | 1990-03-23 | 1991-03-22 | 전자부품용 세라믹 복합체 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5108958A (ko) |
EP (1) | EP0450773A3 (ko) |
JP (1) | JPH05279145A (ko) |
KR (1) | KR910016649A (ko) |
IL (1) | IL97461A0 (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5346751A (en) * | 1988-12-19 | 1994-09-13 | W. R. Grace & Co.-Conn. | Electronic package using closed pore composites |
US5204289A (en) * | 1991-10-18 | 1993-04-20 | Minnesota Mining And Manufacturing Company | Glass-based and glass-ceramic-based composites |
US5284706A (en) * | 1991-12-23 | 1994-02-08 | Olin Corporation | Sealing glass composite |
US5691059A (en) * | 1995-11-21 | 1997-11-25 | Minnesota Mining And Manfacturing Company | Glass and glass-ceramic bubbles having an aluminum nitride coating |
US20030236335A1 (en) * | 2002-05-13 | 2003-12-25 | Miller James D. | Thermally-conductive plastic substrates for electronic circuits and methods of manufacturing same |
KR20040039906A (ko) * | 2002-11-05 | 2004-05-12 | 마이크로코어텍(주) | 졸 전구체의 세라믹 버블 및 졸 전구체의 분무건조에 의한세라믹 버블 제조방법 |
DE102004057804B4 (de) * | 2004-11-30 | 2010-04-08 | Osram Opto Semiconductors Gmbh | Gehäusekörper für einen Halbleiterchip aus gegossener Keramik mit reflektierender Wirkung und Verfahren zu dessen Herstellung |
DE102007020888A1 (de) * | 2007-05-04 | 2008-11-06 | Micro Systems Engineering Gmbh & Co. Kg | Keramisches Substratmaterial, Verfahren zur Herstellung und Verwendung desselben sowie Antenne oder Antennenarray |
DE102007049172A1 (de) * | 2007-10-13 | 2009-04-16 | Micro Systems Engineering Gmbh & Co. Kg | Mikroreaktor und Verfahren zur Herstellung eines solchen sowie Verfahren zur Herstellung eines Substrats für einen Mikroreaktor |
DE102007051318B4 (de) * | 2007-10-26 | 2012-03-22 | Astyx Gmbh | Herstellungsverfahren für einen Radarsensor |
EP2088134B1 (en) * | 2007-12-19 | 2016-09-07 | Imerys Kiln Furniture Hungary Ltd. | Lightweight ceramic material |
DE102008043352A1 (de) * | 2008-10-31 | 2010-05-06 | Micro Systems Engineering Gmbh | Keramisches Substratmaterial, Verfahren zur Herstellung und Verwendung desselben sowie Antenne oder Antennenarray |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3795524A (en) * | 1971-03-01 | 1974-03-05 | Minnesota Mining & Mfg | Aluminum borate and aluminum borosilicate articles |
US4349456A (en) * | 1976-04-22 | 1982-09-14 | Minnesota Mining And Manufacturing Company | Non-vitreous ceramic metal oxide microcapsules and process for making same |
US4358772A (en) * | 1980-04-30 | 1982-11-09 | Hughes Aircraft Company | Ceramic broadband radome |
US4654324A (en) * | 1981-08-27 | 1987-03-31 | Eli Lilly And Company | Human proinsulin pharmaceutical formulations |
JPS59111345A (ja) * | 1982-12-17 | 1984-06-27 | Fujitsu Ltd | 低誘電率回路基板 |
US4752531A (en) * | 1985-03-25 | 1988-06-21 | E. I. Du Pont De Nemours And Company | Dielectric composition |
US4642299A (en) * | 1985-04-08 | 1987-02-10 | Gte Products Corporation | Silicon nitride having low dielectric loss |
JPS62148365A (ja) * | 1985-12-20 | 1987-07-02 | 富士通株式会社 | 低誘電性セラミツク板 |
US4781968A (en) * | 1986-02-28 | 1988-11-01 | Digital Equipment Corporation | Micro-electronics devices and methods of manufacturing same |
JPS62206861A (ja) * | 1986-03-07 | 1987-09-11 | Hitachi Ltd | セラミツクス多層回路板及び半導体実装構造 |
US4711860A (en) * | 1986-03-12 | 1987-12-08 | Corning Glass Works | Modified cordierite glass ceramic composite |
US4777153A (en) * | 1986-05-06 | 1988-10-11 | Washington Research Foundation | Process for the production of porous ceramics using decomposable polymeric microspheres and the resultant product |
US4714687A (en) * | 1986-10-27 | 1987-12-22 | Corning Glass Works | Glass-ceramics suitable for dielectric substrates |
US4780435A (en) * | 1987-04-15 | 1988-10-25 | Tam, Ceramics, Inc. | Dielectric ceramic compositions with linear temperature coefficient characteristics and low dissipation factors |
US4867935A (en) * | 1988-02-26 | 1989-09-19 | E. I. Du Pont De Nemours And Company | Method for preparing ceramic tape compositions |
-
1990
- 1990-03-23 US US07/498,350 patent/US5108958A/en not_active Expired - Lifetime
-
1991
- 1991-03-06 IL IL97461A patent/IL97461A0/xx unknown
- 1991-03-12 EP EP19910302054 patent/EP0450773A3/en not_active Ceased
- 1991-03-22 JP JP3058971A patent/JPH05279145A/ja active Pending
- 1991-03-22 KR KR1019910004677A patent/KR910016649A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP0450773A3 (en) | 1992-06-03 |
US5108958A (en) | 1992-04-28 |
JPH05279145A (ja) | 1993-10-26 |
IL97461A0 (en) | 1992-06-21 |
EP0450773A2 (en) | 1991-10-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |