KR910008163A - 금속 공작용 표면처리제 - Google Patents

금속 공작용 표면처리제 Download PDF

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Publication number
KR910008163A
KR910008163A KR1019900015729A KR900015729A KR910008163A KR 910008163 A KR910008163 A KR 910008163A KR 1019900015729 A KR1019900015729 A KR 1019900015729A KR 900015729 A KR900015729 A KR 900015729A KR 910008163 A KR910008163 A KR 910008163A
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KR
South Korea
Prior art keywords
benzimidazole
dimethylbenzimidazole
methylbenzimidazole
butyl
methyl
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KR1019900015729A
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English (en)
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KR960008153B1 (ko
Inventor
히데유끼 가와이
Original Assignee
다찌바나 다이끼찌
가부시끼가이샤 산와껭뀨쇼
모리무라 다까오
모리무라쇼오지 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from JP1258564A external-priority patent/JPH03124395A/ja
Priority claimed from JP2029630A external-priority patent/JP2913410B2/ja
Application filed by 다찌바나 다이끼찌, 가부시끼가이샤 산와껭뀨쇼, 모리무라 다까오, 모리무라쇼오지 가부시끼가이샤 filed Critical 다찌바나 다이끼찌
Publication of KR910008163A publication Critical patent/KR910008163A/ko
Application granted granted Critical
Publication of KR960008153B1 publication Critical patent/KR960008153B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Paints Or Removers (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)

Abstract

내용 없음

Description

금속 공작용 표면처리제
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (7)

  1. 그의 활성 성분으로서 하기 일반식(I)로 표시되는 적어도 하나의 벤즈이미다졸 화합율을 함유함을 특징으로 하는 금속공작용 표면처리제
    식중, R1은 각각 1~6탄소원자의 치환 또는 비치환알킬기를 나타내고, m은 0~2의 정수이며, R2는 각각 수소원자, 1~17탄소원자의 치환 또는 비치환 알킬기 또는 일반식
    (식중, R3는 각각 1~6탄소원자의 치환 또는 비치환, 알킬기를 나타내고, n은 0~3의 정수이다)의 아릴기를나타낸다.
  2. 제1항에 있어서, 벤즈이미다졸 화합물이 2-메틸 벤즈 이미다졸, 2-메틸-메틸벤즈이미다졸, 2-메틸-디메틸벤즈이미다졸, 2-메틸-벤즈이미다졸, 2-에틸-메틸벤즈이미다졸, 2-에틸-디메틸벤즈이미다졸, 2-n프로필벤즈이미다졸, 2-n-프로필-메틸벤즈이미다졸, 2-n-프로필-디메틸벤즈이미다졸, 2-n-부틸-벤즈이미다졸, 2-n-부틸-메틸벤즈이미다졸, 2-n-부틸-디메틸벤즈이미다졸, 2-n-펜틸-벤즈이미다졸, 2-n-펜틸-메틸벤즈이미다졸, 2-n-펜틸-디메틸벤즈이미다졸, 2-n-헥실-벤즈이미다졸, 2-n-헥실-메틸벤즈이미다졸, 2-n-헥실-디메틸벤즈이미다졸, 2-n-헵틸-벤즈이미다졸, 2-n-헵틸-메틸벤즈이미다졸, 2-n-헵틸-디메틸벤즈이미다졸, 2-n-옥틸-벤즈이미다졸, 2-n-옥틸-메틸 벤즈이미다졸, 2-n-옥틸-디메틸벤즈이미다졸, 2-n-노닐-벤즈이미다졸, 2-n-노닐-메틸벤즈이미다졸, 2-n-노닐-디메틸벤즈이미다졸, 2-n-데실-벤즈이미다졸, 2-n-데실-메틸벤즈이미다졸, 2-n-데실-디메틸벤즈이미다졸, 2-n-운데실-벤즈이미다졸, 2-n-운데실메틸벤즈이미다졸, 2-n-운데실-디메틸벤즈이미다졸, 2-n-도데실-벤즈이미다졸, 2-n-도데실-메틸벤즈이미다졸, 2-n-도데실-디메틸벤즈이미다졸, 2-n-트리데실벤즈이미다졸, 2-n-트리데실-메틸벤즈이미다졸, 2-n-트리메실-디메틸벤즈이미다졸, 2-n-테트라데실-벤즈이미다졸, 2-n테트라데실-메틸벤즈이미다졸, 2-n-테트라데실-디메틸벤즈이미다졸, 2-n-펜타데실-벤즈이미자골, 2-n-펜타데실-메틸벤즈이미다졸, 2-n-펜타데실-디메틸벤즈이미다졸, 2-n-헥사데실-벤즈이미다졸, 2-n-헥사데실-메틸벤즈이미다졸, 2-n-헥사데실-디메틸벤즈이미다졸, 2-n-헵타데실-벤즈이미다졸, 2-n-헵타데실-메틸벤즈이미다졸, 2-n-헵타데실-디메틸벤즈이미다졸, 2-이소프로필-벤드이미다졸, 2-이소프로필-메틸벤즈이미다졸, 2-이소프로필-디메틸벤즈이미다졸, 2-이소부틸-벤즈이미다졸, 2-이소부틸-메틸벤즈이미다졸, 2-이소부틸-디메틸벤즈이미다졸, 2-이소펜틸-벤즈이미다졸, 2-이소펜틸-메틸벤즈이미다졸, 2-이소펜틸-디멘틸벤즈이미다졸, 2-이소헥실-벤즈이미다졸, 2-이소헥실-메틸벤즈이미다졸, 2-이소헥실-디메틸벤즈이미다졸, 2-네오펜틸-벤즈이미다졸, 2-네오펜틸-메틸벤즈이미다졸, 2-네오펜틸-디메틸벤즈이미다졸, 2-s-부틸-벤즈이미다졸, 2-s-부틸-메틸벤즈이미다졸, 2-s-부틸-디메틸벤즈이미다졸, 2-t-부틸-벤즈이미다졸, 2-t-부틸-메틸벤즈이미다졸 및 2-t-부틸-디메틸벤즈이미다졸의 군에서 선택됨을 특징으로 하는 표면처리제.
  3. 제1항에 있어서, 벤즈이미다졸 화합물이 2-페닐-벤즈이미다졸, 2-페닐-메틸벤즈이미다졸, 2-페닐-디메틸벤즈이미다졸, 2-토실-벤즈이미다졸, 2-토실-메틸벤즈이미다졸, 2-토실-디메틸벤즈이미다졸, 2-크실릴벤즈이미다졸, 2-크실릴-메틸벤즈이미다졸, 2-크실릴-메틸벤즈이미다졸, 2-크실릴-디메틸벤즈이미다졸, 2-메시틸-벤즈이미다졸, 2-메시틸-메틸벤즈이미다졸, 2-메시틸-디메틸벤즈이미다졸, 2-t-페닐-벤드이미다졸, 2-t-페닐-메틸벤즈이미다졸 및 2-t-페닐-디메틸벤즈이미다졸의 군에서 선택됨을 특징으로하는 표면 처리제.
  4. 제1 내지 3항중 어느 한 항에 있어서, 비휘발성 용매에 0.01~40%의 벤즈이미다졸을 함유하는 용액 또는 유제중 하나로 사용됨을 특징으로 하는 표면 처리제.
  5. 제4항에 있어서, 비휘발성 용매가 유기산, 유기산의 염, 무기산 및/또는 무기염을 함유하는 수용액, 수용성 용매 및 그의 혼합물의 군에서 선택됨을 특징으로 하는 방법.
  6. 제4항에 있어서, 용액 및 유제중 하나를 롤러피복기, 분무 피복기, 침지피복기, 회전피복기 및 브러쉬 피복기중 하나에 의해 금속제품의 표면에 도포함을 특징으로 하는 표면 처리제.
  7. 제1 내지 6항중 어느 한항에 있어서, 인쇄 회로판 제조시에 프리플럭스로 사용됨을 특징으로 하는 표면처리제.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900015729A 1989-10-03 1990-09-29 금속 공작용 표면 처리제 KR960008153B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP1-258564 1989-10-03
JP1258564A JPH03124395A (ja) 1989-10-03 1989-10-03 はんだ付け用プレフラックス
JP2029630A JP2913410B2 (ja) 1990-02-13 1990-02-13 銅又は銅合金の表面処理剤
JP2-29630 1990-02-13

Publications (2)

Publication Number Publication Date
KR910008163A true KR910008163A (ko) 1991-05-30
KR960008153B1 KR960008153B1 (ko) 1996-06-20

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Application Number Title Priority Date Filing Date
KR1019900015729A KR960008153B1 (ko) 1989-10-03 1990-09-29 금속 공작용 표면 처리제

Country Status (4)

Country Link
EP (1) EP0428260B1 (ko)
KR (1) KR960008153B1 (ko)
CA (1) CA2026684A1 (ko)
DE (1) DE69033413T2 (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5478607A (en) * 1991-05-17 1995-12-26 Hitachi Telecon Technologies Ltd. Method for use of preflux, printed wiring board, and method for production thereof
TW217426B (ko) * 1992-01-08 1993-12-11 Mekku Kk
DE4311807C2 (de) * 1993-04-03 1998-03-19 Atotech Deutschland Gmbh Verfahren zur Beschichtung von Metallen und Anwendung des Verfahrens in der Leiterplattentechnik
TW263534B (ko) * 1993-08-11 1995-11-21 Makkusu Kk
US5376189A (en) * 1993-11-08 1994-12-27 Macdermid, Incorporated Composition and process for treatment of metallic surfaces
DE4339019A1 (de) * 1993-11-10 1995-05-11 Atotech Deutschland Gmbh Verfahren zur Herstellung von Leiterplatten
JP2781954B2 (ja) * 1994-03-04 1998-07-30 メック株式会社 銅および銅合金の表面処理剤
DE4444388A1 (de) * 1994-11-28 1996-05-30 Atotech Deutschland Gmbh Verfahren zum Bonden von Drähten auf oxidationsempfindlichen, lötbaren Metallsubstraten
JP3547028B2 (ja) * 1996-02-26 2004-07-28 四国化成工業株式会社 銅及び銅合金の表面処理剤
GB2331999B (en) * 1997-10-28 2003-01-22 Ibm Copper preservative treatment
GB2336378A (en) 1998-04-17 1999-10-20 Ibm Protective treatment of a zinc or zinc alloy surface with an alcoholic solution of an azole
KR100668129B1 (ko) * 2005-07-07 2007-01-11 백양케미칼(주) 프리플럭스 조성물
KR100935580B1 (ko) * 2007-12-13 2010-01-07 (주)엑큐리스 인쇄회로 배선판용 프리플럭스 조성물의 코팅방법
WO2017205980A1 (en) * 2016-06-01 2017-12-07 Greencentre Canada Etching metal using n-heterocyclic carbenes

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FR2089003A5 (ko) * 1970-04-02 1972-01-07 Shikoku Chem
JPS5036156B2 (ko) * 1971-09-03 1975-11-21
US4235838A (en) * 1978-08-09 1980-11-25 Petrolite Corporation Use of benzazoles as corrosion inhibitors
US4395294A (en) * 1981-08-17 1983-07-26 Bell Telephone Laboratories, Incorporated Copper corrosion inhibitor
DE3540376A1 (de) * 1985-11-14 1987-05-21 Bayer Ag Verfahren zur inhibierung der wasserstoffinduzierten korrosion von metallischen werkstoffen
US4731128A (en) * 1987-05-21 1988-03-15 International Business Machines Corporation Protection of copper from corrosion

Also Published As

Publication number Publication date
EP0428260A3 (en) 1991-09-18
DE69033413T2 (de) 2000-07-20
CA2026684A1 (en) 1991-04-04
DE69033413D1 (de) 2000-02-10
EP0428260B1 (en) 2000-01-05
EP0428260A2 (en) 1991-05-22
KR960008153B1 (ko) 1996-06-20

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