KR900012350A - 전자부품 또는 어셈블리의 캡슐화 방법 및 캡슐 - Google Patents

전자부품 또는 어셈블리의 캡슐화 방법 및 캡슐

Info

Publication number
KR900012350A
KR900012350A KR1019900000459A KR900000459A KR900012350A KR 900012350 A KR900012350 A KR 900012350A KR 1019900000459 A KR1019900000459 A KR 1019900000459A KR 900000459 A KR900000459 A KR 900000459A KR 900012350 A KR900012350 A KR 900012350A
Authority
KR
South Korea
Prior art keywords
housing
region
capsule
assemblies
electronic parts
Prior art date
Application number
KR1019900000459A
Other languages
English (en)
Other versions
KR0146700B1 (ko
Inventor
지크프리트 라우흐마울
한스-에프에르 쉬미트
위르겐 베트나르쯔
카를-하인쯔 호르스만
랄프 크린스
호르스트 셰플러
한스-하인쯔 펠츠
Original Assignee
지멘스 악티엔게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 지멘스 악티엔게젤샤프트 filed Critical 지멘스 악티엔게젤샤프트
Publication of KR900012350A publication Critical patent/KR900012350A/ko
Application granted granted Critical
Publication of KR0146700B1 publication Critical patent/KR0146700B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Sealing Material Composition (AREA)
  • Polyurethanes Or Polyureas (AREA)
KR1019900000459A 1989-01-16 1990-01-16 전자부품 또는 어셈블리의 캡슐화 방법 및 캡슐 KR0146700B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE3901112 1989-01-16
DEP3901112.7 1989-01-16
EP89109084.7 1989-05-19
EP89109084 1989-05-19

Publications (2)

Publication Number Publication Date
KR900012350A true KR900012350A (ko) 1990-08-03
KR0146700B1 KR0146700B1 (ko) 1998-08-01

Family

ID=25876822

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900000459A KR0146700B1 (ko) 1989-01-16 1990-01-16 전자부품 또는 어셈블리의 캡슐화 방법 및 캡슐

Country Status (6)

Country Link
US (2) US5106785A (ko)
EP (1) EP0383025B1 (ko)
JP (1) JP2907914B2 (ko)
KR (1) KR0146700B1 (ko)
AT (1) ATE112924T1 (ko)
DE (1) DE59007409D1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100608448B1 (ko) * 2003-04-23 2006-08-03 가부시키가이샤 무라타 세이사쿠쇼 표면 실장형 전자부품의 광체 구조

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US5350713A (en) * 1990-12-19 1994-09-27 Vlsi Technology, Inc. Design and sealing method for semiconductor packages
US5474958A (en) * 1993-05-04 1995-12-12 Motorola, Inc. Method for making semiconductor device having no die supporting surface
DE4325712C2 (de) * 1993-07-30 1996-03-21 Siemens Ag Verfahren zum Verkapseln von elektrischen oder elektronischen Bauelementen oder Baugruppen und Verkapselung von elektrischen oder elektronischen Bauelementen oder Baugruppen
US5508888A (en) * 1994-05-09 1996-04-16 At&T Global Information Solutions Company Electronic component lead protector
DE19524001A1 (de) * 1995-06-30 1997-03-06 Siemens Ag Verfahren zum Verpacken einer druckempfindlichen elektronischen Schaltung mit einer allseitig abdichtenden Schutzumhäusung
DE19607212C1 (de) * 1996-02-26 1997-04-10 Richard Herbst Verbundkörper, Verfahren und Kunststoff-Spritzgießwerkzeug zur Herstellung eines solchen
FR2768707B1 (fr) * 1997-09-22 1999-10-29 Plastic Omnium Cie Dispositif de transport et/ou de collecte en matiere plastique moulee comportant un dispositif d'identification et procede de fabrication
US6534711B1 (en) * 1998-04-14 2003-03-18 The Goodyear Tire & Rubber Company Encapsulation package and method of packaging an electronic circuit module
US6949822B2 (en) * 2000-03-17 2005-09-27 International Rectifier Corporation Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance
AT411639B (de) 2002-04-26 2004-03-25 Pollmann Austria Ohg Verfahren zum herstellen einer kunststoffumspritzten leiterstruktur sowie elektrische schaltungseinheit mit einer kunststoffumspritzten leiterstruktur
US6779260B1 (en) * 2003-03-28 2004-08-24 Delphi Technologies, Inc. Overmolded electronic package including circuit-carrying substrate
US7357886B2 (en) * 2003-10-31 2008-04-15 Groth Lauren A Singular molded and co-molded electronic's packaging pre-forms
US7030316B2 (en) * 2004-01-30 2006-04-18 Piranha Plastics Insert molding electronic devices
DE102004043054B4 (de) * 2004-09-06 2016-01-28 Bayerische Motoren Werke Aktiengesellschaft Anordnung mit einer Leiterbahnstruktur mit elektrischen oder elektronischen Bauteilen in einem Schutzgehäuse, Schutzgehäuse hierfür und Verfahren zur Bildung einer Baugruppe
DE102005029458B4 (de) * 2005-05-30 2010-06-02 Erbe Elektromedizin Gmbh Betätigungsvorrichtung für elektromedizinische Geräte, insbesondere Fußschalter, und Verfahren zur Herstellung einer derartigen Betätigungsvorrichtung
JP4920288B2 (ja) * 2005-12-23 2012-04-18 帝国通信工業株式会社 電子部品の回路基板への取付構造及び取付方法
US7440285B2 (en) 2006-12-29 2008-10-21 Piranha Plastics, Llc Electronic device housing
US7616448B2 (en) * 2007-09-14 2009-11-10 Delphi Technologies, Inc. Wrap-around overmold for electronic assembly
EP2112471A1 (fr) * 2008-04-22 2009-10-28 Microcomponents AG Dispositif de montage pour composant électronique
US20100081237A1 (en) * 2008-09-30 2010-04-01 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Integrated Circuit Assemblies and Methods for Encapsulating a Semiconductor Device
JP2011100718A (ja) * 2009-10-05 2011-05-19 Yazaki Corp コネクタ
DE102015217576B4 (de) 2015-09-15 2017-03-30 Conti Temic Microelectronic Gmbh Mediendichtes Steuergerät für ein Kraftfahrzeug und Verfahren zur Herstellung des Steuergerätes
DE102015217572B3 (de) 2015-09-15 2017-03-16 Conti Temic Microelectronic Gmbh Mediendichtes Steuergerät für ein Kraftfahrzeug
DE102017127621A1 (de) * 2017-11-22 2019-05-23 Osram Opto Semiconductors Gmbh Vorrichtung mit Leiterrahmen und Verfahren zur Herstellung einer Mehrzahl von Vorrichtungen
DE102021108396A1 (de) 2021-04-01 2022-10-06 Phoenix Contact Gmbh & Co. Kg Verfahren zur Herstellung einer Kontakteinheit und Kontakteinheit
BE1029267B1 (de) 2021-04-01 2022-11-04 Phoenix Contact Gmbh & Co Verfahren zur Herstellung einer Kontakteinheit und Kontakteinheit

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US3706840A (en) * 1971-05-10 1972-12-19 Intersil Inc Semiconductor device packaging
DE2451895B2 (de) * 1974-10-31 1976-10-21 Sauer, Hans, 8024 Deisenhofen Verfahren zur herstellung eines elektromagnetischen relais
ES444085A1 (es) * 1975-01-31 1977-08-01 Siemens Ag Elemento electromecanico de construccion impermeable al la- vado y procedimiento para su impermeabilizacion.
JPS5530809A (en) * 1978-08-25 1980-03-04 Hitachi Ltd Producing method of resin mold type semiconductor device
JPS5949697B2 (ja) * 1979-12-10 1984-12-04 三菱電機株式会社 半導体装置
JPS6018145B2 (ja) * 1980-09-22 1985-05-09 株式会社日立製作所 樹脂封止型半導体装置
DE3129756A1 (de) * 1981-07-28 1983-02-17 Siemens AG, 1000 Berlin und 8000 München In einen becher eingesetztes elektrisches bauelement, bauelementegruppe oder integrierte schaltung
JPS60136347A (ja) * 1983-12-26 1985-07-19 Hitachi Micro Comput Eng Ltd 半導体装置およびその製造方法
JPS60189940A (ja) * 1984-03-09 1985-09-27 Nec Corp 樹脂封止型半導体装置の製法
EP0157938A3 (de) * 1984-03-23 1987-05-13 Siemens Aktiengesellschaft Gehäuse für elektrische Bauelemente
DE3603912A1 (de) * 1985-02-09 1986-08-14 Alps Electric Co., Ltd., Tokio/Tokyo Elektronischer netzwerk-baustein und verfahren zur herstellung desselben
JPS6221250A (ja) * 1985-07-22 1987-01-29 Hitachi Micro Comput Eng Ltd 樹脂封止半導体装置とその製造方法
US4701999A (en) * 1985-12-17 1987-10-27 Pnc, Inc. Method of making sealed housings containing delicate structures
US5065224A (en) * 1986-06-30 1991-11-12 Fairchild Semiconductor Corporation Low noise integrated circuit and leadframe
JPS63184357A (ja) * 1987-01-26 1988-07-29 Japan Aviation Electronics Ind Ltd インサート成形部品の端子保持方法
JPS63287041A (ja) * 1987-05-19 1988-11-24 Sony Corp 半導体素子収納パッケ−ジの製造方法
JPS6411352A (en) * 1987-07-06 1989-01-13 Sony Corp Hollow mold package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100608448B1 (ko) * 2003-04-23 2006-08-03 가부시키가이샤 무라타 세이사쿠쇼 표면 실장형 전자부품의 광체 구조

Also Published As

Publication number Publication date
US5376824A (en) 1994-12-27
KR0146700B1 (ko) 1998-08-01
JP2907914B2 (ja) 1999-06-21
ATE112924T1 (de) 1994-10-15
DE59007409D1 (de) 1994-11-17
EP0383025B1 (de) 1994-10-12
EP0383025A1 (de) 1990-08-22
US5106785A (en) 1992-04-21
JPH02232951A (ja) 1990-09-14

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