KR900010932A - 스퍼터링 타겟 및 그 제조방법 - Google Patents
스퍼터링 타겟 및 그 제조방법 Download PDFInfo
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- KR900010932A KR900010932A KR1019890019364A KR890019364A KR900010932A KR 900010932 A KR900010932 A KR 900010932A KR 1019890019364 A KR1019890019364 A KR 1019890019364A KR 890019364 A KR890019364 A KR 890019364A KR 900010932 A KR900010932 A KR 900010932A
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- sputtering target
- msi
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- 238000005477 sputtering target Methods 0.000 title claims description 17
- 238000004519 manufacturing process Methods 0.000 title claims 3
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims 9
- 229910052751 metal Inorganic materials 0.000 claims 5
- 239000002184 metal Substances 0.000 claims 5
- 239000011812 mixed powder Substances 0.000 claims 4
- 239000000843 powder Substances 0.000 claims 4
- 229910021332 silicide Inorganic materials 0.000 claims 4
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- 239000006185 dispersion Substances 0.000 claims 2
- 229910052735 hafnium Inorganic materials 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000011159 matrix material Substances 0.000 claims 2
- 229910052750 molybdenum Inorganic materials 0.000 claims 2
- 229910052758 niobium Inorganic materials 0.000 claims 2
- 239000010955 niobium Substances 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 239000003870 refractory metal Substances 0.000 claims 2
- 239000011863 silicon-based powder Substances 0.000 claims 2
- 239000010936 titanium Chemical group 0.000 claims 2
- 229910052719 titanium Inorganic materials 0.000 claims 2
- 229910052721 tungsten Inorganic materials 0.000 claims 2
- 229910052726 zirconium Inorganic materials 0.000 claims 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical group [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 1
- 229910052787 antimony Inorganic materials 0.000 claims 1
- 229910052785 arsenic Inorganic materials 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- 230000005496 eutectics Effects 0.000 claims 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims 1
- 239000011261 inert gas Substances 0.000 claims 1
- 239000011733 molybdenum Chemical group 0.000 claims 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 230000003746 surface roughness Effects 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical group [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/58085—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicides
- C04B35/58092—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicides based on refractory metal silicides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/64—Burning or sintering processes
- C04B35/645—Pressure sintering
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/64—Burning or sintering processes
- C04B35/65—Reaction sintering of free metal- or free silicon-containing compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Structural Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 기판 중심으로 부터의 거리와 본 발명의 실시예(18)와 참조 실시예(16)에 따라 제조된 스퍼터링 타겟을 사용하여 스퍼터링시킴으로써 성형된 각각의 얇은 필름의 시트 저항과의 관계를 도시한 그래프, 제2도는 기판의 중심으로 부터의 거리와 실시예(19) 및 비교 실시예(17)에 따른 각각의 얇은 필름의 시트 저항과의 관계를 도시한 그래프, 제3도는 기판 중심으로 부터의 거리와 실시예(20) 및 비교 실시예(18)에 따른 각각의 얇은 필름의 시트 저항과의 관계를 도시한 그래프.
Claims (14)
- MSix조성으로 되어있는 내열성 금속 실리 사이드로 만들어진 스퍼터링 타겟에 있어서, 상기 MSix는 입자형태로 된 MSi2상과 매트릭스상으로 된 Si상으로 구성되어있고, M은 텅스텐, 몰리브데늄, 티타늄, 지르코늄, 하프눔, 니오붐 및 탄탈륨 중에서 선택된 적어도 하나의 내열성 금속이며, 두께가 선정되어있는 접촉층이 MSi2상과 Si상 사이에 존재하는 것을 특징으로 하는 스퍼터링 타겟.
- 제1항에 있어서, 조성식 MSix의 x 값이 2와 4 사이의 값인 것을 특징으로 하는 스퍼터링 타겟.
- 제1항에 있어서, MSix상과 Si 상 사이의 접촉면에 형성된 접촉층의 두께가 100Å과 5000Å 사이인 것을 특징으로 하는 스퍼터링 타겟.
- 제1항에 있어서, 조성식 MSix의 공간적인 분산이 Si/M 원자비에서 ±0.05의 범위 이내이고, 그리고 타겟의 밀도비가 99% 이상인 것을 특징으로 하는 스퍼터링 타겟.
- 제1항에 있어서, Si상이 B,P,Sb 및 As 중에서 선택된 적어도 하나의 원소를 포함하고 있고 0.01내지 1Ω·cm의 저항율을 가진 것을 특징으로 하는 스퍼터링 타겟.
- 제1항에 있어서, 중심선 거칠기(Ra)로 표시된 스퍼터링타겟 표면의 거칠기가 0.05μm이하인 것을 특징으로 하는 스퍼터링타겟.
- 제1항에 있어서, 타겟 표면의 잔류 압축응력이 5kg/mm2이하인 것을 특징으로하는 스퍼터링 타겟.
- 제1항에 있어서, 판의 형태로 되어있고 조성식 MSix로 된 내열성 금속 실리사이드로 형성되어 있으며, x값이 타겟의 주변부에서부터 중심쪽으로 향해 증가하도록 조성분포를 가지고 있는 것을 특징으로 하는 스퍼터링타겟.
- 제1항에 있어서, 조성식 MSix의 x값이 2.0과 4.0사이에서 연속적으로 변화되게 조성되어있는 것을 특징으로 하는 스퍼터링 타겟.
- 제1항에 있어서, 조성식 MSix로된 내열성 금속 실리사이드로 형성되어있고, x 값이 2.0과 4.0 사이의 값이 되고 그리고 스퍼터링에 의해 침식된 영역에서부터 주변부 쪽으로 계속적으로 감소되게된 조성분포를 가진 것을 특징으로 하는 스퍼터링타겟.
- 입자형태로된 MSi2로 상의 조성을 가진 내열성 금속 실리사이드로 만들어져 있고, 상기 M이 W, Mo, Ti, Zr, Hf, Nb 및 Ta 중에서 선택된 하나 이상의 내열성 금속이고 Si 매트릭스 상에 분산되어지며, MSi2상과 Si상 사이의 접촉면에 접촉층이 형성되어있는 것으로 된 스퍼터링 타겟을 제조하는 방법에 있어서, (가) M 파우더와 Si파우더를 Si/M 원자비 2.0과 4.0사이의 값으로 혼합하여 혼합파우더를 만드는 단계, (나) 모울드에 혼합 파우더를 넣어 고진공상태에서 고압으로 신속하게 가열시켜 MSi2상이 합성되는 압분체를 만드는 단계, 그리고 (다) 고압하의 저 진공상태나 불활성 가스 분위기속에서 공융온도 바로 밑의 온도로 가열시켜 압분체를 소결시키는 단계로 구성되어있는 것을 특징으로 하는 스퍼터링 타겟의 제조방법.
- 제11항에 있어서, 조성식 MSix의 공간적인 분산은 Si/M 원자비에서 ±0.05의 범위 이내가 되게하고, 타겟의 밀도비는 99% 이상이 되게 하는 것을 특징으로 하는 방법.
- 제11항에 있어서, 단계(나)중에서 모울드에 들어있는 혼합 파우더의 중심부가 급속히 가열되게 하는 것을 특징으로 하는 방법.
- 제11항에 있어서, 단계(나) 중에서 내열성 금속 M 파우더와 Si파우더를 혼합하여 적어도 두가지의 혼합비율이 다른 혼합 파우더로 만들고, Si의 함유량이 더 많은 혼합 파우더를 모울드의 중앙부에 넣고 Si의 함유량이 작은 혼합 파우더를 모울드의 주변부에 넣는 것을 특징으로 하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930027136A KR940008016B1 (ko) | 1989-07-28 | 1993-12-08 | 스퍼터링장치용 타겟 및 그 제조방법 |
Applications Claiming Priority (14)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP88-322423 | 1988-12-21 | ||
JP32242388 | 1988-12-21 | ||
JP32531088 | 1988-12-23 | ||
JP63-325310 | 1988-12-23 | ||
JP88-325310 | 1988-12-23 | ||
JP88-328441 | 1988-12-26 | ||
JP63-328441 | 1988-12-26 | ||
JP32844188 | 1988-12-26 | ||
JP01-194344 | 1989-07-28 | ||
JP19434489 | 1989-07-28 | ||
JP19434689 | 1989-07-28 | ||
JP89-194346 | 1989-07-28 | ||
JP89-194344 | 1989-07-28 | ||
JP01-194346 | 1989-07-28 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930027136A Division KR940008016B1 (ko) | 1989-07-28 | 1993-12-08 | 스퍼터링장치용 타겟 및 그 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900010932A true KR900010932A (ko) | 1990-07-11 |
KR940008020B1 KR940008020B1 (ko) | 1994-08-31 |
Family
ID=27529096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890019364A KR940008020B1 (ko) | 1988-12-21 | 1989-12-21 | 스퍼터링장치용 타겟 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0374931B1 (ko) |
JP (1) | JP2907907B2 (ko) |
KR (1) | KR940008020B1 (ko) |
DE (1) | DE68913466T2 (ko) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0486475B1 (en) * | 1988-03-03 | 1997-12-03 | Asahi Glass Company Ltd. | Amorphous oxide film and article having such film thereon |
US5354446A (en) * | 1988-03-03 | 1994-10-11 | Asahi Glass Company Ltd. | Ceramic rotatable magnetron sputtering cathode target and process for its production |
US5605609A (en) * | 1988-03-03 | 1997-02-25 | Asahi Glass Company Ltd. | Method for forming low refractive index film comprising silicon dioxide |
US5209835A (en) * | 1988-03-03 | 1993-05-11 | Asahi Glass Company Ltd. | Method for producing a specified zirconium-silicon amorphous oxide film composition by sputtering |
US5264286A (en) * | 1988-03-03 | 1993-11-23 | Asahi Glass Company Ltd. | Laminated glass structure |
EP0436741B1 (en) * | 1989-08-01 | 1996-06-26 | Asahi Glass Company Ltd. | DC sputtering method and target for producing films based on silicon dioxide |
JP2750483B2 (ja) * | 1991-11-26 | 1998-05-13 | 株式会社 ジャパンエナジー | Itoスパッタリングターゲット |
JPH05214523A (ja) * | 1992-02-05 | 1993-08-24 | Toshiba Corp | スパッタリングターゲットおよびその製造方法 |
TW234767B (ko) * | 1992-09-29 | 1994-11-21 | Nippon En Kk | |
US5464520A (en) * | 1993-03-19 | 1995-11-07 | Japan Energy Corporation | Silicide targets for sputtering and method of manufacturing the same |
KR0184725B1 (ko) * | 1993-07-27 | 1999-04-01 | 사토 후미오 | 고융점 금속 실리사이드 타겟, 그의 제조방법, 고융점 금속 실리사이드 박막 및 반도체장치 |
JP3445276B2 (ja) | 1993-12-14 | 2003-09-08 | 株式会社東芝 | 配線形成用Mo−WターゲットとMo−W配線薄膜、およびそれを用いた液晶表示装置 |
WO2000040769A1 (fr) * | 1998-12-28 | 2000-07-13 | Japan Energy Corporation | Cible de pulverisation cathodique |
JP5038553B2 (ja) * | 2000-04-27 | 2012-10-03 | 株式会社東芝 | スパッタリングターゲットの製造方法 |
JP5036936B2 (ja) * | 2001-03-12 | 2012-09-26 | Jx日鉱日石金属株式会社 | ゲート酸化膜形成用シリサイドターゲット及びその製造方法 |
JP3995082B2 (ja) * | 2001-07-18 | 2007-10-24 | 日鉱金属株式会社 | ゲート酸化膜形成用ハフニウムシリサイドターゲット及びその製造方法 |
JP4921653B2 (ja) * | 2001-08-13 | 2012-04-25 | 株式会社東芝 | スパッタリングターゲットおよびその製造方法 |
JP2003066587A (ja) * | 2001-08-24 | 2003-03-05 | Shin Etsu Chem Co Ltd | スパッタターゲット、並びに該スパッタターゲットを用いた位相シフトマスクブランク及び位相シフトマスクの製造方法 |
US6986834B2 (en) * | 2002-08-06 | 2006-01-17 | Nikko Materials Co., Ltd. | Hafnium silicide target and manufacturing method for preparation thereof |
JP2007051337A (ja) * | 2005-08-18 | 2007-03-01 | Ulvac Japan Ltd | スパッタ電極及びスパッタ電極を備えたスパッタリング装置 |
KR20140071058A (ko) * | 2012-12-03 | 2014-06-11 | 코닝정밀소재 주식회사 | 롤투롤 스퍼터링 장치 |
WO2014157054A1 (ja) * | 2013-03-26 | 2014-10-02 | Jx日鉱日石金属株式会社 | スパッタリング用シリサイドターゲット及びその製造方法 |
JP6768575B2 (ja) * | 2017-03-24 | 2020-10-14 | Jx金属株式会社 | タングステンシリサイドターゲット及びその製造方法 |
WO2021193741A1 (ja) * | 2020-03-26 | 2021-09-30 | 東ソー株式会社 | Cr-Si系焼結体、スパッタリングターゲット、及び薄膜の製造方法 |
CN112225565B (zh) * | 2020-10-14 | 2023-01-03 | 宁波江丰电子材料股份有限公司 | 一种钨硅靶坯的制备方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5832015A (ja) * | 1981-08-18 | 1983-02-24 | Shikoku Chem Corp | 自由流動性に富む芒硝の製造法 |
US4619697A (en) * | 1984-08-30 | 1986-10-28 | Mitsubishi Kinzoku Kabushiki Kaisha | Sputtering target material and process for producing the same |
JPS61141674A (ja) * | 1984-12-13 | 1986-06-28 | 東京タングステン株式会社 | タングステンシリサイド合金焼結体及びその製造方法 |
JPS61141673A (ja) * | 1984-12-13 | 1986-06-28 | 東京タングステン株式会社 | モリブデンシリサイド合金焼結体及びその製造方法 |
US4663120A (en) * | 1985-04-15 | 1987-05-05 | Gte Products Corporation | Refractory metal silicide sputtering target |
JPH0791636B2 (ja) * | 1987-03-09 | 1995-10-04 | 日立金属株式会社 | スパツタリングタ−ゲツトおよびその製造方法 |
JPH01198471A (ja) * | 1988-02-04 | 1989-08-10 | Mitsubishi Metal Corp | 半導体デバイスのゲート電極薄膜形成用スパッタリング・ターゲット材 |
-
1989
- 1989-12-21 KR KR1019890019364A patent/KR940008020B1/ko not_active IP Right Cessation
- 1989-12-21 DE DE68913466T patent/DE68913466T2/de not_active Expired - Fee Related
- 1989-12-21 JP JP1329678A patent/JP2907907B2/ja not_active Expired - Lifetime
- 1989-12-21 EP EP89123704A patent/EP0374931B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE68913466T2 (de) | 1994-09-01 |
KR940008020B1 (ko) | 1994-08-31 |
JPH03130360A (ja) | 1991-06-04 |
DE68913466D1 (de) | 1994-04-07 |
EP0374931A2 (en) | 1990-06-27 |
JP2907907B2 (ja) | 1999-06-21 |
EP0374931A3 (en) | 1991-05-15 |
EP0374931B1 (en) | 1994-03-02 |
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