KR900005447B1 - 전자회로 부품용 냉각장치 - Google Patents

전자회로 부품용 냉각장치 Download PDF

Info

Publication number
KR900005447B1
KR900005447B1 KR1019860002203A KR860002203A KR900005447B1 KR 900005447 B1 KR900005447 B1 KR 900005447B1 KR 1019860002203 A KR1019860002203 A KR 1019860002203A KR 860002203 A KR860002203 A KR 860002203A KR 900005447 B1 KR900005447 B1 KR 900005447B1
Authority
KR
South Korea
Prior art keywords
refrigerant
passage
cooling
electronic circuit
passages
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019860002203A
Other languages
English (en)
Korean (ko)
Other versions
KR860007861A (ko
Inventor
슈니찌 기구찌
하루유끼 마쯔나가
히데오 가쯔미
고지 가쯔야마
Original Assignee
후지쓰 가부시끼가이샤
야마모도 다꾸마
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지쓰 가부시끼가이샤, 야마모도 다꾸마 filed Critical 후지쓰 가부시끼가이샤
Publication of KR860007861A publication Critical patent/KR860007861A/ko
Application granted granted Critical
Publication of KR900005447B1 publication Critical patent/KR900005447B1/ko
Expired legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H10W40/475—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H10W40/47—
    • H10W40/772—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/04—Communication passages between channels

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1019860002203A 1985-03-28 1986-03-25 전자회로 부품용 냉각장치 Expired KR900005447B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60-064391 1985-03-28
JP60064391A JPS61222242A (ja) 1985-03-28 1985-03-28 冷却装置

Publications (2)

Publication Number Publication Date
KR860007861A KR860007861A (ko) 1986-10-17
KR900005447B1 true KR900005447B1 (ko) 1990-07-30

Family

ID=13256968

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860002203A Expired KR900005447B1 (ko) 1985-03-28 1986-03-25 전자회로 부품용 냉각장치

Country Status (7)

Country Link
US (1) US4712158A (enExample)
EP (1) EP0196863B1 (enExample)
JP (1) JPS61222242A (enExample)
KR (1) KR900005447B1 (enExample)
AU (1) AU568973B2 (enExample)
BR (1) BR8601366A (enExample)
DE (1) DE3663614D1 (enExample)

Families Citing this family (100)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4765397A (en) * 1986-11-28 1988-08-23 International Business Machines Corp. Immersion cooled circuit module with improved fins
KR910008985B1 (ko) * 1987-05-25 1991-10-26 후지쓰 가부시끼가이샤 전자회로부품을 냉각시키기 위해 열도전성 화합물층을 갖는 냉각시스템 및 그 화합물 형성방법
US4942497A (en) * 1987-07-24 1990-07-17 Nec Corporation Cooling structure for heat generating electronic components mounted on a substrate
US4996589A (en) * 1987-10-21 1991-02-26 Hitachi, Ltd. Semiconductor module and cooling device of the same
CA1283225C (en) * 1987-11-09 1991-04-16 Shinji Mine Cooling system for three-dimensional ic package
CA1327710C (en) * 1987-12-07 1994-03-15 Kazuhiko Umezawa Cooling system for ic package
US4871623A (en) * 1988-02-19 1989-10-03 Minnesota Mining And Manufacturing Company Sheet-member containing a plurality of elongated enclosed electrodeposited channels and method
EP0341950B1 (en) * 1988-05-09 1994-09-14 Nec Corporation Flat cooling structure of integrated circuit
JPH0812890B2 (ja) * 1988-05-24 1996-02-07 富士通株式会社 モジュール封止方法
US5070606A (en) * 1988-07-25 1991-12-10 Minnesota Mining And Manufacturing Company Method for producing a sheet member containing at least one enclosed channel
US4975766A (en) * 1988-08-26 1990-12-04 Nec Corporation Structure for temperature detection in a package
JPH06100408B2 (ja) * 1988-09-09 1994-12-12 日本電気株式会社 冷却装置
DE68925403T2 (de) * 1988-09-20 1996-05-30 Nippon Electric Co Kühlungsstruktur für elektronische Bauelemente
US4910642A (en) * 1988-12-05 1990-03-20 Sundstrand Corporation Coolant activated contact compact high intensity cooler
US4975803A (en) * 1988-12-07 1990-12-04 Sundstrand Corporation Cold plane system for cooling electronic circuit components
US5664427A (en) * 1989-03-08 1997-09-09 Rocky Research Rapid sorption cooling or freezing appliance
US5598721A (en) 1989-03-08 1997-02-04 Rocky Research Heating and air conditioning systems incorporating solid-vapor sorption reactors capable of high reaction rates
US5271239A (en) * 1990-11-13 1993-12-21 Rocky Research Cooling apparatus for electronic and computer components
US5628205A (en) * 1989-03-08 1997-05-13 Rocky Research Refrigerators/freezers incorporating solid-vapor sorption reactors capable of high reaction rates
US5001548A (en) * 1989-03-13 1991-03-19 Coriolis Corporation Multi-chip module cooling
US4956746A (en) * 1989-03-29 1990-09-11 Hughes Aircraft Company Stacked wafer electronic package
US5057968A (en) * 1989-10-16 1991-10-15 Lockheed Corporation Cooling system for electronic modules
JPH0766027B2 (ja) * 1989-12-21 1995-07-19 安藤電気株式会社 Ｉｃテスタ用テストヘッドの冷却構造
US5016090A (en) * 1990-03-21 1991-05-14 International Business Machines Corporation Cross-hatch flow distribution and applications thereof
US5265670A (en) * 1990-04-27 1993-11-30 International Business Machines Corporation Convection transfer system
US5088005A (en) * 1990-05-08 1992-02-11 Sundstrand Corporation Cold plate for cooling electronics
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
CA2053055C (en) * 1990-10-11 1997-02-25 Tsukasa Mizuno Liquid cooling system for lsi packages
US5159529A (en) * 1991-05-15 1992-10-27 International Business Machines Corporation Composite liquid cooled plate for electronic equipment
JP2748732B2 (ja) * 1991-07-19 1998-05-13 日本電気株式会社 液体冷媒循環システム
SE468964B (sv) * 1991-08-29 1993-04-19 Asea Atom Ab Slutet kylsystem foer akustiska apparater
JP2852148B2 (ja) * 1991-10-21 1999-01-27 日本電気株式会社 集積回路パッケージの冷却構造
JP2728105B2 (ja) * 1991-10-21 1998-03-18 日本電気株式会社 集積回路用冷却装置
US5177666A (en) * 1991-10-24 1993-01-05 Bland Timothy J Cooling rack for electronic devices
US5206791A (en) * 1992-02-07 1993-04-27 Digital Equipment Corporation Bellows heat pipe apparatus for cooling systems
US5249358A (en) * 1992-04-28 1993-10-05 Minnesota Mining And Manufacturing Company Jet impingment plate and method of making
US5317805A (en) * 1992-04-28 1994-06-07 Minnesota Mining And Manufacturing Company Method of making microchanneled heat exchangers utilizing sacrificial cores
US5343358A (en) * 1993-04-26 1994-08-30 Ncr Corporation Apparatus for cooling electronic devices
US5697428A (en) * 1993-08-24 1997-12-16 Actronics Kabushiki Kaisha Tunnel-plate type heat pipe
US5509468A (en) * 1993-12-23 1996-04-23 Storage Technology Corporation Assembly for dissipating thermal energy contained in an electrical circuit element and associated method therefor
DE4416616C2 (de) * 1994-05-11 1997-05-22 Fichtel & Sachs Ag Gehäuse
CA2203213A1 (en) * 1996-05-31 1997-11-30 R-Theta Inc. Heat sink with coolant accelerator
IT1297593B1 (it) * 1997-08-08 1999-12-17 Itelco S P A Dissipatore per componenti elettronici raffreddato a liquido, dotato di alette dissipatrici disposte in maniera selettiva
US6400012B1 (en) 1997-09-17 2002-06-04 Advanced Energy Voorhees, Inc. Heat sink for use in cooling an integrated circuit
US6097597A (en) * 1998-06-30 2000-08-01 Mitsubishi Denki Kabushiki Kaisha Thermo-siphon and manufacturing method of thermo-siphon and information processing apparatus
US6116040A (en) * 1999-03-15 2000-09-12 Carrier Corporation Apparatus for cooling the power electronics of a refrigeration compressor drive
US6301109B1 (en) * 2000-02-11 2001-10-09 International Business Machines Corporation Isothermal heat sink with cross-flow openings between channels
US7134484B2 (en) * 2000-12-07 2006-11-14 International Business Machines Corporation Increased efficiency in liquid and gaseous planar device cooling technology
JP2002189535A (ja) * 2000-12-20 2002-07-05 Hitachi Ltd 液冷システムおよびこれを用いたパーソナルコンピュータ
WO2003007372A2 (en) * 2001-07-13 2003-01-23 Coolit Systems Inc. Cooling apparatus for electronic devices
CA2352997A1 (en) * 2001-07-13 2003-01-13 Coolit Systems Inc. Computer cooling apparatus
US7385821B1 (en) * 2001-12-06 2008-06-10 Apple Inc. Cooling method for ICS
DE10163915A1 (de) * 2001-12-22 2003-07-17 Conti Temic Microelectronic Baugruppe mit mindestens einer elektronischen Komponente und mit zwei Formteilen
US20050039880A1 (en) * 2001-12-26 2005-02-24 Scott Alexander Robin Walter Computer cooling apparatus
JPWO2005001674A1 (ja) * 2003-06-27 2007-09-20 日本電気株式会社 電子機器の冷却装置
WO2005004571A1 (ja) * 2003-06-30 2005-01-13 Advantest Corporation 発熱素子冷却用カバー、発熱素子実装装置およびテストヘッド
DE10335197B4 (de) * 2003-07-30 2005-10-27 Kermi Gmbh Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor
US7508672B2 (en) * 2003-09-10 2009-03-24 Qnx Cooling Systems Inc. Cooling system
FR2867608B1 (fr) * 2004-03-12 2006-05-26 Metal Process Refroidisseur pour composant electronique de puissance
DE102004026061B4 (de) * 2004-05-25 2009-09-10 Danfoss Silicon Power Gmbh Leistungshalbleitermodul und Verfahren zum Kühlen eines Leistungshalbleitermoduls
FI117590B (fi) * 2004-06-11 2006-11-30 Abb Oy Jäähdytyselementti
WO2005125296A1 (en) * 2004-06-15 2005-12-29 Tm4 Inc. Cooling device for electric circuit
ITMI20041652A1 (it) * 2004-08-13 2004-11-13 Bosari Thermal Man S R L Scambiatore di calore e metodo per produrlo
EP1748512A1 (en) * 2005-07-25 2007-01-31 Harris Broadcast Systems Europe Liquid cooled high-frequency filter
US20080041081A1 (en) 2006-08-15 2008-02-21 Bristol Compressors, Inc. System and method for compressor capacity modulation in a heat pump
US7628028B2 (en) 2005-08-03 2009-12-08 Bristol Compressors International, Inc. System and method for compressor capacity modulation
FI20055428L (fi) * 2005-08-08 2007-02-09 Abb Oy Kojekaappi
US8475375B2 (en) * 2006-12-15 2013-07-02 General Electric Company System and method for actively cooling an ultrasound probe
CA2573941A1 (en) 2007-01-15 2008-07-15 Coolit Systems Inc. Computer cooling system
US8919426B2 (en) * 2007-10-22 2014-12-30 The Peregrine Falcon Corporation Micro-channel pulsating heat pipe
US8904814B2 (en) 2008-06-29 2014-12-09 Bristol Compressors, International Inc. System and method for detecting a fault condition in a compressor
US8297343B2 (en) * 2008-10-15 2012-10-30 Tai-Her Yang Heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids
US8622116B2 (en) * 2008-10-15 2014-01-07 Tai-Her Yang Heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids
US20100129140A1 (en) * 2008-11-26 2010-05-27 Coolit Systems Inc. Connector for a liquid cooling system in a computer
US8601828B2 (en) 2009-04-29 2013-12-10 Bristol Compressors International, Inc. Capacity control systems and methods for a compressor
US8422229B2 (en) * 2009-06-25 2013-04-16 Oracle America, Inc. Molded heat sink and method of making same
JP5700034B2 (ja) 2009-08-10 2015-04-15 富士電機株式会社 半導体モジュール及び冷却器
EP2354744B1 (en) * 2010-01-20 2017-09-20 ABB Technology Oy Cooling element
US8289711B2 (en) 2010-08-20 2012-10-16 Hamilton Sundstrand Corporation Integrated thermal packaging of high power motor controller
TW201228583A (en) * 2010-12-30 2012-07-01 Hon Hai Prec Ind Co Ltd Electronic device
DE102012101186A1 (de) * 2012-02-15 2013-08-22 Karlsruher Institut für Technologie Wärmetauscherstruktur
WO2014027405A1 (ja) 2012-08-15 2014-02-20 富士通株式会社 受熱装置、冷却装置、及び電子装置
JP2014183072A (ja) * 2013-03-18 2014-09-29 Fujitsu Ltd 電子機器及び受熱器
USD749713S1 (en) 2014-07-31 2016-02-16 Innovative Medical Equipment, Llc Heat exchanger
US20170038154A1 (en) * 2015-08-06 2017-02-09 Chaun-Choung Technology Corp. Vapor chamber structure having stretchable heated part
US10309732B2 (en) * 2015-12-11 2019-06-04 Hanon Systems Internal degas feature for plate-fin heat exchangers
CN105744805A (zh) * 2016-04-15 2016-07-06 周哲明 一种多通道组合水冷板
US11025034B2 (en) * 2016-08-31 2021-06-01 Nlight, Inc. Laser cooling system
US10757809B1 (en) 2017-11-13 2020-08-25 Telephonics Corporation Air-cooled heat exchanger and thermal arrangement for stacked electronics
CN108460179A (zh) * 2018-01-11 2018-08-28 郑州云海信息技术有限公司 Pcb板设计中使用快捷键开关gnd属线的方法及系统
US10784645B2 (en) 2018-03-12 2020-09-22 Nlight, Inc. Fiber laser having variably wound optical fiber
US10976119B2 (en) * 2018-07-30 2021-04-13 The Boeing Company Heat transfer devices and methods of transfering heat
DE102019134565A1 (de) * 2019-12-16 2021-06-17 HELLA GmbH & Co. KGaA Gehäuse für einen Stromrichter und Stromrichter, insbesondere Gleichstromsteller mit einem solchen Gehäuse
US11653480B1 (en) * 2020-04-03 2023-05-16 Nuro. Inc. Methods and apparatus for controlling the environment of electronic systems in vehicles
CN212278664U (zh) * 2020-05-12 2021-01-01 深圳比特微电子科技有限公司 适于电子设备液冷散热的液冷板及具有其的散热单元
US11889614B2 (en) * 2021-07-22 2024-01-30 Borgwarner Inc. Cooling conduit for electrical components on a PCB
CN113316376B (zh) * 2021-07-28 2022-07-12 中兴通讯股份有限公司 散热装置及电子设备
KR102520820B1 (ko) * 2021-08-13 2023-04-11 주식회사 바로에이아이 Pcb 냉각 블록 및 그 제조 방법
CN115339035A (zh) * 2022-08-27 2022-11-15 沈阳橡胶研究设计院有限公司 一种橡胶加工用热橡胶片快速降温系统
US20240084821A1 (en) * 2022-09-13 2024-03-14 Us Hybrid Corporation Self-priming cooling jacket

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
US4155402A (en) * 1977-01-03 1979-05-22 Sperry Rand Corporation Compliant mat cooling
US4341432A (en) * 1979-08-06 1982-07-27 Cutchaw John M Liquid cooled connector for integrated circuit packages
US4551787A (en) * 1983-02-07 1985-11-05 Sperry Corporation Apparatus for use in cooling integrated circuit chips
JPS60160149A (ja) * 1984-01-26 1985-08-21 Fujitsu Ltd 集積回路装置の冷却方式
US4631636A (en) * 1984-03-26 1986-12-23 Harris Corporation High density packaging technique for electronic systems

Also Published As

Publication number Publication date
JPH0329312B2 (enExample) 1991-04-23
JPS61222242A (ja) 1986-10-02
DE3663614D1 (en) 1989-06-29
AU5501586A (en) 1986-10-02
KR860007861A (ko) 1986-10-17
AU568973B2 (en) 1988-01-14
EP0196863A1 (en) 1986-10-08
BR8601366A (pt) 1986-12-02
EP0196863B1 (en) 1989-05-24
US4712158A (en) 1987-12-08

Similar Documents

Publication Publication Date Title
KR900005447B1 (ko) 전자회로 부품용 냉각장치
EP4062723B1 (en) Cold plate and system for cooling electronic devices
US6748755B2 (en) Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator
EP0447835A2 (en) Heat removal apparatus for liquid cooled semiconductor modules
EP0200221B1 (en) Evaporation cooling module for semiconductor devices
US6305463B1 (en) Air or liquid cooled computer module cold plate
CN112020271B (zh) 液冷装置和包括液冷装置的服务器
CN121143602A (zh) 用于计算机处理器及处理器组件的主动冷却散热盖
US9303926B2 (en) Condenser fin structures facilitating vapor condensation cooling of coolant
JP3203475B2 (ja) 半導体装置
US20060126296A1 (en) Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly
EP1682841A1 (en) Flow distributing unit and cooling unit
WO2008097557B1 (en) Carbon-based waterblock with attached heat-exchanger for cooling of electronic devices
US12146506B2 (en) Two-phase cold plate
US6345665B1 (en) Cooling system
KR20010005801A (ko) 전자 열원을 냉각시키는 장치 및 방법
JP2000349480A (ja) 発熱素子冷却装置
EP0483107B1 (en) Cooling modules for electronic circuit devices
JP2611704B2 (ja) 集積回路の冷却構造
CN222322014U (zh) 一种可以同时输出冷风及冷水的机架式冷却机组
JPH0534113Y2 (enExample)
KR100938842B1 (ko) 동 파이프 격리형 냉각 유닛
KR20050116000A (ko) 열교환기
JPH0344065A (ja) 半導体冷却法
WO2026032667A1 (en) Vehicle module with a housing and a cooling device for cooling an electronic device of the vehicle module

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

St.27 status event code: A-2-2-Q10-Q13-nap-PG1605

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 19960718

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 19970731

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 19970731

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000