KR900002438A - 전자 부품에 외부 접속 와이어를 납땜하는 방법 - Google Patents
전자 부품에 외부 접속 와이어를 납땜하는 방법 Download PDFInfo
- Publication number
- KR900002438A KR900002438A KR1019890009892A KR890009892A KR900002438A KR 900002438 A KR900002438 A KR 900002438A KR 1019890009892 A KR1019890009892 A KR 1019890009892A KR 890009892 A KR890009892 A KR 890009892A KR 900002438 A KR900002438 A KR 900002438A
- Authority
- KR
- South Korea
- Prior art keywords
- wire
- solder
- strip
- soldering
- soldered
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 13
- 238000000034 method Methods 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims 4
- 238000002788 crimping Methods 0.000 claims 2
- 239000011159 matrix material Substances 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 1
- 239000013013 elastic material Substances 0.000 claims 1
- 238000007373 indentation Methods 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 230000001376 precipitating effect Effects 0.000 claims 1
- 238000004080 punching Methods 0.000 claims 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L21/603—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of pressure, e.g. thermo-compression bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 접속 와이어 스트립의 사시도.
제2도는 변형된 접속 와이어의 상세 단면도 및 평면도.
제3도는 예비 성형 땜납을 구비하는 접속 와이어의 상세 단면도 및 평면도. 제4도 내지 제 6도는 접속 와이어상의 예비 형성 땜납의 권선 방법 및 공구의 개략적인 단면도.
Claims (3)
- 납땜될 수 있는 표면을 갖는 전자 부품에 외부 접속 와이어를 납땜하는 방법으로써, a) 비대칭 회전을 부여하도록 적어도 하나의 접속 와이어가 납땜하는 이의 단부에서 스탬프되는 단계와, b) 땜납 스트립이 노출된 와이어의 펴면부를 떠나는 스트립으로부터 땜납 예비 형태를 만들도록 상기 스트립의 변형에 의해 와이어의 변형된 단부에 크림프되는 단계와, c)납땜되는 부품이 땜납 예비 형태로 피복되지 않는 와이어 부분과 마주하는 부품의 납땜될 수 잇는 표면을 갖는 이의 땜납 예비 형태를 구비하는 와이어에 대해 제공되는 단계와, d) 리플로우 공정에 의해 용융 및 납땜되는 단계를 구비하는 것을 특징으로 하는 전자 부품에 외부접속 와이어를 납땜하는 방법.
- 제1항에 있어서, 적어도 하나의 접속 와이어의 납땜되는 단부에 스탬핑 함으로서 땜납 예비 형태가 와이어상에 회전하지 않고 정확하게 위치하는 것을 가능하게 하고, 납땜되는 부품에 와이어를 직접 지지하기 위한 표면의 보존을 가능하게 하는 것을 특징으로 하는 전자 부품에 외부 접속 와이어를 납땜하는 방법.
- 제1항에 있어서, 땜납 예비 형태를 접속 와이어에 크림핑하는 작동은, a) 폭이 와이어의 외주연과 같으며 두께가 폭보다 작은 변형가능한 탄성 재료로 만들어진 매트릭스상에 땜납 스트립을 침전시크는 단계와, b) 접속 와이어의 스탬프된 단부를 이의 대칭축을 따라 땜납 스트립상에 침전시키는 단계와, c) 땜납 금속을 자유롭게 남겨두는 펀치와 접촉하는 표면을 갖는 와이어의 압흔에 대한 스트립의 운동을 야기하며 땜납 예비형태를 형성하는 변형 가능한 매트릭스의 스트립을 인각하는 펀치에 의해 와이어상에서 변형되는 단계를 구비하는 것을 특징으로 하는 전자 부품에 외부 접속 와이어를 납땜하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8809546A FR2634319B1 (fr) | 1988-07-13 | 1988-07-13 | Procede de soudure des fils de connexions exterieures sur un composant electronique |
FR8809546 | 1988-07-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR900002438A true KR900002438A (ko) | 1990-02-28 |
Family
ID=9368422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890009892A KR900002438A (ko) | 1988-07-13 | 1989-07-12 | 전자 부품에 외부 접속 와이어를 납땜하는 방법 |
Country Status (7)
Country | Link |
---|---|
US (1) | US4915286A (ko) |
EP (1) | EP0351268B1 (ko) |
JP (1) | JPH0287513A (ko) |
KR (1) | KR900002438A (ko) |
BR (1) | BR8903392A (ko) |
DE (1) | DE68906092T2 (ko) |
FR (1) | FR2634319B1 (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2826065B2 (ja) * | 1994-03-30 | 1998-11-18 | 本田技研工業株式会社 | 超塑性成形装置 |
NL9400554A (nl) * | 1994-04-07 | 1995-11-01 | Plastronic Holland Bv | Werkwijze voor het solderen en isoleren van twee te verbinden uiteinden van kabels en dergelijke. |
DE19636577C1 (de) * | 1996-09-09 | 1998-04-09 | Siemens Matsushita Components | Verfahren zum Anlöten von Anschlußdrähten an keramische Bauelemente |
FR2758888B1 (fr) * | 1997-01-27 | 1999-04-23 | Thomson Csf | Procede de modelisation fine du fouillis de sol recu par un radar |
US6595788B2 (en) * | 1999-10-14 | 2003-07-22 | Berg Technology, Inc. | Electrical connector with continuous strip contacts |
DE10023358A1 (de) * | 2000-05-12 | 2001-11-29 | Siemens Ag | Fertigungslinie für die einseitige und doppelseitige Bestückung von Leiterplatten |
US7297003B2 (en) * | 2003-07-16 | 2007-11-20 | Gryphics, Inc. | Fine pitch electrical interconnect assembly |
WO2005011060A2 (en) * | 2003-07-16 | 2005-02-03 | Gryphics, Inc. | Electrical interconnect assembly with interlocking contact system |
US7537461B2 (en) * | 2003-07-16 | 2009-05-26 | Gryphics, Inc. | Fine pitch electrical interconnect assembly |
JP4956609B2 (ja) | 2006-03-20 | 2012-06-20 | グリフィクス インコーポレーティッド | ファインピッチ電気接続アセンブリのための複合端子 |
US7829791B2 (en) * | 2008-01-03 | 2010-11-09 | Interplex Nas, Inc. | Solder wire construction |
US20100087104A1 (en) * | 2008-10-02 | 2010-04-08 | Gump Bruce S | Terminal crimp having knurl with omega-shaped cross-section |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3220098A (en) * | 1962-03-19 | 1965-11-30 | Alfred C Arbogast | Method and means for forming tubular fittings with solder rings |
US3333047A (en) * | 1965-01-13 | 1967-07-25 | Geoffroi Louis Emil Gerard | Electrical connector with pre-placed solder |
DE1665608A1 (de) * | 1966-04-15 | 1971-03-25 | Siemens Ag | Anschlussdraht zum Anloeten an metallische Flaechen und Verfahren zur Herstellung des Drahtes |
US3616981A (en) * | 1969-08-08 | 1971-11-02 | Erie Technological Prod Inc | Lead and solder preform assembly and method of making the same |
US3760622A (en) * | 1972-02-01 | 1973-09-25 | I Mansell | Elastomeric forming die |
GB1425595A (en) * | 1973-10-24 | 1976-02-18 | Osipov A A | Apparatus for preparing leads of integrated microcircuits for printed circuit boards |
US3886650A (en) * | 1974-03-28 | 1975-06-03 | Amp Inc | Method and apparatus for precrimping solder rings on electrical terminal posts |
US4785988A (en) * | 1986-11-20 | 1988-11-22 | Methode Electronics, Inc. | Attachment of lead to elongated conductor |
-
1988
- 1988-07-13 FR FR8809546A patent/FR2634319B1/fr not_active Expired - Fee Related
-
1989
- 1989-06-23 EP EP89401786A patent/EP0351268B1/fr not_active Expired - Lifetime
- 1989-06-23 DE DE8989401786T patent/DE68906092T2/de not_active Expired - Fee Related
- 1989-07-10 US US07/377,417 patent/US4915286A/en not_active Expired - Fee Related
- 1989-07-11 BR BR898903392A patent/BR8903392A/pt unknown
- 1989-07-12 KR KR1019890009892A patent/KR900002438A/ko not_active Application Discontinuation
- 1989-07-12 JP JP1180115A patent/JPH0287513A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US4915286A (en) | 1990-04-10 |
FR2634319A1 (fr) | 1990-01-19 |
JPH0287513A (ja) | 1990-03-28 |
DE68906092D1 (de) | 1993-05-27 |
FR2634319B1 (fr) | 1990-09-07 |
BR8903392A (pt) | 1990-02-13 |
DE68906092T2 (de) | 1993-07-29 |
EP0351268A1 (fr) | 1990-01-17 |
EP0351268B1 (fr) | 1993-04-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |