GB1425595A - Apparatus for preparing leads of integrated microcircuits for printed circuit boards - Google Patents

Apparatus for preparing leads of integrated microcircuits for printed circuit boards

Info

Publication number
GB1425595A
GB1425595A GB4954273A GB4954273A GB1425595A GB 1425595 A GB1425595 A GB 1425595A GB 4954273 A GB4954273 A GB 4954273A GB 4954273 A GB4954273 A GB 4954273A GB 1425595 A GB1425595 A GB 1425595A
Authority
GB
United Kingdom
Prior art keywords
leads
solder
microcircuit
holder
spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4954273A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB4954273A priority Critical patent/GB1425595A/en
Publication of GB1425595A publication Critical patent/GB1425595A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D35/00—Combined processes according to or processes combined with methods covered by groups B21D1/00 - B21D31/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/023—Feeding of components with bending or straightening of the terminal leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0405—Solder foil, tape or wire
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

1425595 Preparing leads of integrated circuits A A OSIPOV and N S PEKOV 24 Oct 1973 49542/73 Heading B3A Apparatus for preparing leads 23, Fig. 5, of integrated microcircuits 24 for printed circuit boards comprises a male die 16, Fig. 1, for pressing the leads into a required shape, a female die formed of two jaws 2 fixed to a base 1, a spring-loaded microcircuit holder 9 arranged between the jaws, a solder supply unit 7, guides 13 disposed in the upper surface of the jaws for the solder, and a device 12 for cutting the microcircuit leads. The holder 9 rests on a coiled spring 11 and forms together with the jaws 2 a profile for bending the microcircuit leads. The solder is pressed against guides 13 by folded tabs of flat springs 14, 15 that are mounted on a casing 4 and slider 6 respectively. The spring 15 serves to supply the solder and spring 14 holds it in place during the back stroke of the slider. The male die has a clamp 17 and both are arranged between plates 18 mounted on a plate 19 which is reciprocable on guide rods 20. In operation, a microcircuit is placed upon the holder 9 and positioned by pins 10 which enter between adjoining leads 23. The solenoid is energized and the slider moves along the easing 4 and spring 15 feeds the solder 8 under the leads. A force P applied to plate 19 causes clamp 17 to press the leads against the holder and then die 16 bends the leads and presses them against the solder. The plates 18 cut the solder and the microcircuit moves downwardly with the holder and its leads are pressed into the solder and simultaneously cut by the blades 12.
GB4954273A 1973-10-24 1973-10-24 Apparatus for preparing leads of integrated microcircuits for printed circuit boards Expired GB1425595A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4954273A GB1425595A (en) 1973-10-24 1973-10-24 Apparatus for preparing leads of integrated microcircuits for printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4954273A GB1425595A (en) 1973-10-24 1973-10-24 Apparatus for preparing leads of integrated microcircuits for printed circuit boards

Publications (1)

Publication Number Publication Date
GB1425595A true GB1425595A (en) 1976-02-18

Family

ID=10452688

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4954273A Expired GB1425595A (en) 1973-10-24 1973-10-24 Apparatus for preparing leads of integrated microcircuits for printed circuit boards

Country Status (1)

Country Link
GB (1) GB1425595A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0351268A1 (en) * 1988-07-13 1990-01-17 Compagnie Europeenne De Composants Electroniques Lcc Process for soldering exterior connecting wires to an electronic component
CN115302254A (en) * 2022-08-12 2022-11-08 太仓德纳森机电工程有限公司 Bending and cutting integrated machine for pins of electronic element

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0351268A1 (en) * 1988-07-13 1990-01-17 Compagnie Europeenne De Composants Electroniques Lcc Process for soldering exterior connecting wires to an electronic component
FR2634319A1 (en) * 1988-07-13 1990-01-19 Europ Composants Electron METHOD OF WELDING EXTERNAL CONNECTING WIRES TO AN ELECTRONIC COMPONENT
US4915286A (en) * 1988-07-13 1990-04-10 Compagnie Europeenne De Composants Electroniques Lcc Method for the soldering of external connection wires to an electronic component
CN115302254A (en) * 2022-08-12 2022-11-08 太仓德纳森机电工程有限公司 Bending and cutting integrated machine for pins of electronic element
CN115302254B (en) * 2022-08-12 2023-03-21 太仓德纳森机电工程有限公司 Bending and cutting integrated machine for pins of electronic element

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee