KR900002080B1 - 비소화칼륨 단결정 박막의 기상 에피택셜 성장방법 - Google Patents
비소화칼륨 단결정 박막의 기상 에피택셜 성장방법 Download PDFInfo
- Publication number
- KR900002080B1 KR900002080B1 KR1019860007460A KR860007460A KR900002080B1 KR 900002080 B1 KR900002080 B1 KR 900002080B1 KR 1019860007460 A KR1019860007460 A KR 1019860007460A KR 860007460 A KR860007460 A KR 860007460A KR 900002080 B1 KR900002080 B1 KR 900002080B1
- Authority
- KR
- South Korea
- Prior art keywords
- carrier concentration
- concentration layer
- single crystal
- layer
- growing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
- H10P14/3421—Arsenides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/42—Gallium arsenide
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2907—Materials being Group IIIA-VA materials
- H10P14/2911—Arsenides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2926—Crystal orientations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3438—Doping during depositing
- H10P14/3441—Conductivity type
- H10P14/3442—N-type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/36—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done before the formation of the materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Junction Field-Effect Transistors (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60-198904 | 1985-09-09 | ||
| JP60198904A JPS6259595A (ja) | 1985-09-09 | 1985-09-09 | ひ化ガリウム単結晶薄膜の気相エピタキシヤル成長方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR870003554A KR870003554A (ko) | 1987-04-18 |
| KR900002080B1 true KR900002080B1 (ko) | 1990-03-31 |
Family
ID=16398877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019860007460A Expired KR900002080B1 (ko) | 1985-09-09 | 1986-09-06 | 비소화칼륨 단결정 박막의 기상 에피택셜 성장방법 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4756792A (https=) |
| JP (1) | JPS6259595A (https=) |
| KR (1) | KR900002080B1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61275191A (ja) * | 1985-05-29 | 1986-12-05 | Furukawa Electric Co Ltd:The | GaAs薄膜の気相成長法 |
| US4910167A (en) * | 1987-11-13 | 1990-03-20 | Kopin Corporation | III-V Semiconductor growth initiation on silicon using TMG and TEG |
| US5145807A (en) * | 1988-05-11 | 1992-09-08 | Mitsubishi Kasei Corporation | Method of making semiconductor laser devices |
| JP2701339B2 (ja) * | 1988-07-22 | 1998-01-21 | 日本電気株式会社 | 気相成長装置 |
| US6010937A (en) * | 1995-09-05 | 2000-01-04 | Spire Corporation | Reduction of dislocations in a heteroepitaxial semiconductor structure |
| US5834379A (en) * | 1996-07-16 | 1998-11-10 | Cornell Research Foundation, Inc. | Process for synthesis of cubic GaN on GaAs using NH3 in an RF plasma process |
| US5979614A (en) * | 1996-09-25 | 1999-11-09 | Nippon Steel Corporation | Brake disc produced from martensitic stainless steel and process for producing same |
| US7214269B2 (en) * | 2004-10-15 | 2007-05-08 | Hitachi Cable, Ltd. | Si-doped GaAs single crystal substrate |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3836408A (en) * | 1970-12-21 | 1974-09-17 | Hitachi Ltd | Production of epitaxial films of semiconductor compound material |
| US3762945A (en) * | 1972-05-01 | 1973-10-02 | Bell Telephone Labor Inc | Technique for the fabrication of a millimeter wave beam lead schottkybarrier device |
| US3925119A (en) * | 1973-05-07 | 1975-12-09 | Ibm | Method for vapor deposition of gallium arsenide phosphide upon gallium arsenide substrates |
| US3904449A (en) * | 1974-05-09 | 1975-09-09 | Bell Telephone Labor Inc | Growth technique for high efficiency gallium arsenide impatt diodes |
| JPS5577131A (en) * | 1978-12-06 | 1980-06-10 | Mitsubishi Monsanto Chem Co | Vapor phase growth of compound semiconductor epitaxial film |
| JPS56138917A (en) * | 1980-03-31 | 1981-10-29 | Fujitsu Ltd | Vapor phase epitaxial growth |
| JPS57111016A (en) * | 1980-12-26 | 1982-07-10 | Mitsubishi Monsanto Chem Co | Manufacture of gallium phosphide arsenide mixed crystal epitaxial wafer |
| US4407694A (en) * | 1981-06-22 | 1983-10-04 | Hughes Aircraft Company | Multi-range doping of epitaxial III-V layers from a single source |
-
1985
- 1985-09-09 JP JP60198904A patent/JPS6259595A/ja active Granted
-
1986
- 1986-09-05 US US06/904,178 patent/US4756792A/en not_active Expired - Fee Related
- 1986-09-06 KR KR1019860007460A patent/KR900002080B1/ko not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6259595A (ja) | 1987-03-16 |
| US4756792A (en) | 1988-07-12 |
| KR870003554A (ko) | 1987-04-18 |
| JPH0510317B2 (https=) | 1993-02-09 |
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