KR890700919A - 미립자 충격에 의한 고체표면의 가공을 위한 방법 및 장치 - Google Patents

미립자 충격에 의한 고체표면의 가공을 위한 방법 및 장치

Info

Publication number
KR890700919A
KR890700919A KR1019880701493A KR880701493A KR890700919A KR 890700919 A KR890700919 A KR 890700919A KR 1019880701493 A KR1019880701493 A KR 1019880701493A KR 880701493 A KR880701493 A KR 880701493A KR 890700919 A KR890700919 A KR 890700919A
Authority
KR
South Korea
Prior art keywords
solid surface
processing solid
particulate impact
particulate
impact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019880701493A
Other languages
English (en)
Korean (ko)
Inventor
한스 왹히스너
Original Assignee
한스 왹히스너
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6323319&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR890700919(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 한스 왹히스너 filed Critical 한스 왹히스너
Publication of KR890700919A publication Critical patent/KR890700919A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357Generation remote from the workpiece, e.g. down-stream
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/223Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase
    • H01L21/2236Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase from or into a plasma phase
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/2633Bombardment with radiation with high-energy radiation for etching, e.g. sputteretching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/46Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electron Sources, Ion Sources (AREA)
  • Plasma Technology (AREA)
KR1019880701493A 1987-03-18 1988-11-18 미립자 충격에 의한 고체표면의 가공을 위한 방법 및 장치 Withdrawn KR890700919A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19873708717 DE3708717A1 (de) 1987-03-18 1987-03-18 Verfahren und vorrichtung zur bearbeitung von festkoerperoberflaechen durch teilchenbeschuss
PCT/DE1988/000157 WO1988007262A1 (en) 1987-03-18 1988-03-16 Process and device for the surface treatment of semiconductors by particle bombardment

Publications (1)

Publication Number Publication Date
KR890700919A true KR890700919A (ko) 1989-04-28

Family

ID=6323319

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880701493A Withdrawn KR890700919A (ko) 1987-03-18 1988-11-18 미립자 충격에 의한 고체표면의 가공을 위한 방법 및 장치

Country Status (7)

Country Link
US (1) US5156703A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0349556B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP2771205B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR890700919A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AU (1) AU1421388A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (2) DE3708717A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
WO (1) WO1988007262A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

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DE3834318A1 (de) * 1988-10-08 1990-04-12 Leybold Ag Vorrichtung zum aufbringen dielektrischer oder metallischer werkstoffe
DE4025396A1 (de) * 1990-08-10 1992-02-13 Leybold Ag Einrichtung fuer die herstellung eines plasmas
US5334264A (en) * 1992-06-30 1994-08-02 Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College Titanium plasma nitriding intensified by thermionic emission source
DE4233895C2 (de) * 1992-10-08 1996-11-28 Juergen Prof Dr Engemann Vorrichtung zur Behandlung von durch einen Wickelmechanismus bewegten bahnförmigen Materialien mittels eines reaktiven bzw. nichtreaktiven, durch Hochfrequenz- oder Pulsentladung erzeugten Niederdruckplasmas
DE4301189C2 (de) * 1993-01-19 2000-12-14 Leybold Ag Vorrichtung zum Beschichten von Substraten
DE4301188C2 (de) * 1993-01-19 2001-05-31 Leybold Ag Vorrichtung zum Beschichten oder Ätzen von Substraten
KR0170456B1 (ko) * 1993-07-16 1999-03-30 세끼사와 다까시 반도체 장치 및 그 제조방법
US5614055A (en) * 1993-08-27 1997-03-25 Applied Materials, Inc. High density plasma CVD and etching reactor
US5811022A (en) * 1994-11-15 1998-09-22 Mattson Technology, Inc. Inductive plasma reactor
DE19503205C1 (de) * 1995-02-02 1996-07-11 Muegge Electronic Gmbh Vorrichtung zur Erzeugung von Plasma
DE19546826C1 (de) 1995-12-15 1997-04-03 Fraunhofer Ges Forschung Verfahren und Einrichtung zur Vorbehandlung von Substraten
WO1997045855A1 (en) * 1996-05-31 1997-12-04 Akashic Memories Corporation Highly tetrahedral amorphous carbon films and methods for their production
US5858477A (en) 1996-12-10 1999-01-12 Akashic Memories Corporation Method for producing recording media having protective overcoats of highly tetrahedral amorphous carbon
EP1115648A1 (de) * 1998-09-23 2001-07-18 Stefan Fascko Verfahren zur herstellung von nanometerstrukturen auf halbleiteroberflächen
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US20060249370A1 (en) * 2003-09-15 2006-11-09 Makoto Nagashima Back-biased face target sputtering based liquid crystal display device
DE102004011118B4 (de) * 2004-03-08 2009-09-24 Leybold Optics Gmbh Extraktionselektrode mit Lochblendenmuster für eine Plasmastrahlquelle
US7244474B2 (en) * 2004-03-26 2007-07-17 Applied Materials, Inc. Chemical vapor deposition plasma process using an ion shower grid
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DE102006020290B4 (de) * 2006-04-27 2010-04-15 Ipt Ionen- Und Plasmatechnik Gmbh Plasmaquelle
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US8454810B2 (en) 2006-07-14 2013-06-04 4D-S Pty Ltd. Dual hexagonal shaped plasma source
DE102007051444B4 (de) * 2007-10-25 2012-11-08 Von Ardenne Anlagentechnik Gmbh Verfahren und Vorrichtung zum Trockenätzen von kontinuierlich bewegten Materialien
DE102009018912A1 (de) * 2009-04-28 2010-11-18 Leybold Optics Gmbh Verfahren zur Erzeugung eines Plasmastrahls sowie Plasmaquelle
US8698400B2 (en) 2009-04-28 2014-04-15 Leybold Optics Gmbh Method for producing a plasma beam and plasma source
US11615941B2 (en) 2009-05-01 2023-03-28 Advanced Energy Industries, Inc. System, method, and apparatus for controlling ion energy distribution in plasma processing systems
US9287092B2 (en) 2009-05-01 2016-03-15 Advanced Energy Industries, Inc. Method and apparatus for controlling ion energy distribution
US9287086B2 (en) 2010-04-26 2016-03-15 Advanced Energy Industries, Inc. System, method and apparatus for controlling ion energy distribution
US9767988B2 (en) 2010-08-29 2017-09-19 Advanced Energy Industries, Inc. Method of controlling the switched mode ion energy distribution system
US10707055B2 (en) 2017-11-17 2020-07-07 Advanced Energy Industries, Inc. Spatial and temporal control of ion bias voltage for plasma processing
US9435029B2 (en) 2010-08-29 2016-09-06 Advanced Energy Industries, Inc. Wafer chucking system for advanced plasma ion energy processing systems
US9309594B2 (en) 2010-04-26 2016-04-12 Advanced Energy Industries, Inc. System, method and apparatus for controlling ion energy distribution of a projected plasma
US9362089B2 (en) 2010-08-29 2016-06-07 Advanced Energy Industries, Inc. Method of controlling the switched mode ion energy distribution system
FR2965697B1 (fr) 2010-09-30 2014-01-03 Astrium Sas Procede et dispositif pour la formation d'un faisceau plasma.
US10225919B2 (en) * 2011-06-30 2019-03-05 Aes Global Holdings, Pte. Ltd Projected plasma source
US9685297B2 (en) 2012-08-28 2017-06-20 Advanced Energy Industries, Inc. Systems and methods for monitoring faults, anomalies, and other characteristics of a switched mode ion energy distribution system
KR101909571B1 (ko) 2012-08-28 2018-10-19 어드밴스드 에너지 인더스트리즈 인코포레이티드 넓은 다이내믹 레인지 이온 에너지 바이어스 제어; 고속 이온 에너지 스위칭; 이온 에너지 제어와 펄스동작 바이어스 서플라이; 및 가상 전면 패널
US9210790B2 (en) * 2012-08-28 2015-12-08 Advanced Energy Industries, Inc. Systems and methods for calibrating a switched mode ion energy distribution system
KR102235442B1 (ko) * 2014-06-30 2021-04-01 삼성전자주식회사 스퍼터링 장치 및 방법
JP6707559B2 (ja) 2015-03-31 2020-06-10 ビューラー アルツェナウ ゲゼルシャフト ミット ベシュレンクテル ハフツングBuehler Alzenau GmbH 被覆された基板の製造方法
FR3046520B1 (fr) * 2015-12-30 2018-06-22 Centre National De La Recherche Scientifique - Cnrs Systeme de generation de faisceau plasma a derive d'electrons fermee et propulseur comprenant un tel systeme
JP6896754B2 (ja) * 2016-03-05 2021-06-30 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 物理的気相堆積プロセスにおけるイオン分画を制御するための方法および装置
TWI726258B (zh) 2017-11-17 2021-05-01 新加坡商Aes全球公司 用於電漿處理之方法和系統以及相關的非暫時性電腦可讀取媒體
US12230476B2 (en) 2017-11-17 2025-02-18 Advanced Energy Industries, Inc. Integrated control of a plasma processing system
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Also Published As

Publication number Publication date
AU1421388A (en) 1988-10-10
EP0349556B1 (de) 1993-11-18
JP2771205B2 (ja) 1998-07-02
WO1988007262A1 (en) 1988-09-22
DE3708717C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-12-20
US5156703A (en) 1992-10-20
DE3885739D1 (de) 1993-12-23
DE3708717A1 (de) 1988-09-29
JPH02502593A (ja) 1990-08-16
EP0349556A1 (de) 1990-01-10

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19881118

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid