KR890020399U - 반도체 칩 자동부착장치 - Google Patents

반도체 칩 자동부착장치

Info

Publication number
KR890020399U
KR890020399U KR2019880003374U KR880003374U KR890020399U KR 890020399 U KR890020399 U KR 890020399U KR 2019880003374 U KR2019880003374 U KR 2019880003374U KR 880003374 U KR880003374 U KR 880003374U KR 890020399 U KR890020399 U KR 890020399U
Authority
KR
South Korea
Prior art keywords
semiconductor chip
attachment device
automatic attachment
chip automatic
semiconductor
Prior art date
Application number
KR2019880003374U
Other languages
English (en)
Other versions
KR900009648Y1 (ko
Inventor
김정덕
Original Assignee
삼성항공산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성항공산업 주식회사 filed Critical 삼성항공산업 주식회사
Priority to KR2019880003374U priority Critical patent/KR900009648Y1/ko
Publication of KR890020399U publication Critical patent/KR890020399U/ko
Application granted granted Critical
Publication of KR900009648Y1 publication Critical patent/KR900009648Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Operations Research (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
KR2019880003374U 1988-03-14 1988-03-14 반도체 칩 자동부착장치 KR900009648Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019880003374U KR900009648Y1 (ko) 1988-03-14 1988-03-14 반도체 칩 자동부착장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019880003374U KR900009648Y1 (ko) 1988-03-14 1988-03-14 반도체 칩 자동부착장치

Publications (2)

Publication Number Publication Date
KR890020399U true KR890020399U (ko) 1989-10-05
KR900009648Y1 KR900009648Y1 (ko) 1990-10-15

Family

ID=19273181

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019880003374U KR900009648Y1 (ko) 1988-03-14 1988-03-14 반도체 칩 자동부착장치

Country Status (1)

Country Link
KR (1) KR900009648Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030079502A (ko) * 2002-04-04 2003-10-10 한동희 평판표시장치의 칩본딩장치 및 이를 이용한 칩본딩방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030079502A (ko) * 2002-04-04 2003-10-10 한동희 평판표시장치의 칩본딩장치 및 이를 이용한 칩본딩방법

Also Published As

Publication number Publication date
KR900009648Y1 (ko) 1990-10-15

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Legal Events

Date Code Title Description
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E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20010928

Year of fee payment: 12

LAPS Lapse due to unpaid annual fee