KR890004879B1 - Master-slcie type semiconductor integrated circuit device - Google Patents
Master-slcie type semiconductor integrated circuit deviceInfo
- Publication number
- KR890004879B1 KR890004879B1 KR8405988A KR840005988A KR890004879B1 KR 890004879 B1 KR890004879 B1 KR 890004879B1 KR 8405988 A KR8405988 A KR 8405988A KR 840005988 A KR840005988 A KR 840005988A KR 890004879 B1 KR890004879 B1 KR 890004879B1
- Authority
- KR
- South Korea
- Prior art keywords
- master
- current source
- semiconductor integrated
- integrated circuit
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Layout of the interconnection structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/90—Masterslice integrated circuits
- H10D84/901—Masterslice integrated circuits comprising bipolar technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58179265A JPS6074455A (ja) | 1983-09-29 | 1983-09-29 | マスタスライス集積回路 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR890004879B1 true KR890004879B1 (en) | 1989-11-30 |
Family
ID=16062822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR8405988A Expired KR890004879B1 (en) | 1983-09-29 | 1984-09-28 | Master-slcie type semiconductor integrated circuit device |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4748488A (enExample) |
| EP (1) | EP0140584B1 (enExample) |
| JP (1) | JPS6074455A (enExample) |
| KR (1) | KR890004879B1 (enExample) |
| DE (1) | DE3475366D1 (enExample) |
| IE (1) | IE55775B1 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2633558B2 (ja) * | 1987-03-30 | 1997-07-23 | 株式会社東芝 | 半導体装置 |
| JP2606845B2 (ja) * | 1987-06-19 | 1997-05-07 | 富士通株式会社 | 半導体集積回路 |
| JPH01278041A (ja) * | 1988-04-30 | 1989-11-08 | Hitachi Ltd | 半導体集積回路装置 |
| KR920005863B1 (ko) * | 1988-08-12 | 1992-07-23 | 산요덴끼 가부시끼가이샤 | 반도체 집적회로 |
| US5168342A (en) * | 1989-01-30 | 1992-12-01 | Hitachi, Ltd. | Semiconductor integrated circuit device and manufacturing method of the same |
| EP0382415B1 (en) * | 1989-02-09 | 1994-09-28 | Sony Corporation | Semiconductor integrated circuit devices |
| JP2509696B2 (ja) * | 1989-04-26 | 1996-06-26 | 株式会社東芝 | ゲ―トアレ―半導体集積回路装置 |
| JPH03218668A (ja) * | 1989-11-24 | 1991-09-26 | Nec Ic Microcomput Syst Ltd | 半導体集積回路装置 |
| US5283753A (en) * | 1991-07-25 | 1994-02-01 | Motorola, Inc. | Firm function block for a programmable block architected heterogeneous integrated circuit |
| US5155390A (en) * | 1991-07-25 | 1992-10-13 | Motorola, Inc. | Programmable block architected heterogeneous integrated circuit |
| US6804809B1 (en) * | 2002-10-30 | 2004-10-12 | Polarfab, Llc | System and method for defining a semiconductor device layout |
| AU2003289928A1 (en) * | 2002-12-20 | 2004-07-14 | Degussa Ag | Coated peroxygen compounds with controlled release, a process for their preparation and their use |
| DE10320196A1 (de) * | 2002-12-20 | 2004-07-08 | Henkel Kg Auf Aktien | Bleichmittelhaltige Wasch- oder Reinigungsmittel |
| RU2330878C2 (ru) * | 2002-12-20 | 2008-08-10 | Дегусса Аг | Жидкая композиция моющего и очищающего средства |
| ATE299471T1 (de) * | 2003-05-07 | 2005-07-15 | Degussa | Umhülltes natriumpercarbonatgranulat mit verbesserter lagerstabilität |
| JP2007504089A (ja) * | 2003-05-23 | 2007-03-01 | デグサ アクチエンゲゼルシャフト | 過酸化水素又は酸素の制御された放出のための、過酸化水素及び疎水化した二酸化ケイ素を含有する粉体状混合物の使用 |
| US6841810B1 (en) * | 2003-08-08 | 2005-01-11 | Semiconductor Components Industries, L.L.C. | Cell structure for bipolar integrated circuits and method |
| DE102004054495A1 (de) | 2004-11-11 | 2006-05-24 | Degussa Ag | Natriumpercarbonatpartikel mit einer Thiosulfat enthaltenden Hüllschicht |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL7107040A (enExample) * | 1971-05-22 | 1972-11-24 | ||
| US3866066A (en) * | 1973-07-16 | 1975-02-11 | Bell Telephone Labor Inc | Power supply distribution for integrated circuits |
| US3999214A (en) * | 1974-06-26 | 1976-12-21 | Ibm Corporation | Wireable planar integrated circuit chip structure |
| GB1592856A (en) * | 1976-11-27 | 1981-07-08 | Ferranti Ltd | Semiconductor devices |
| JPS60953B2 (ja) * | 1977-12-30 | 1985-01-11 | 富士通株式会社 | 半導体集積回路装置 |
| JPS5850768A (ja) * | 1981-09-21 | 1983-03-25 | Matsushita Electronics Corp | 半導体集積回路装置 |
-
1983
- 1983-09-29 JP JP58179265A patent/JPS6074455A/ja active Granted
-
1984
- 1984-09-24 US US06/653,523 patent/US4748488A/en not_active Expired - Fee Related
- 1984-09-28 KR KR8405988A patent/KR890004879B1/ko not_active Expired
- 1984-09-28 DE DE8484306612T patent/DE3475366D1/de not_active Expired
- 1984-09-28 EP EP84306612A patent/EP0140584B1/en not_active Expired
- 1984-09-28 IE IE2484/84A patent/IE55775B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| IE55775B1 (en) | 1991-01-16 |
| IE842484L (en) | 1985-03-29 |
| JPH0531309B2 (enExample) | 1993-05-12 |
| JPS6074455A (ja) | 1985-04-26 |
| EP0140584A1 (en) | 1985-05-08 |
| EP0140584B1 (en) | 1988-11-23 |
| DE3475366D1 (en) | 1988-12-29 |
| US4748488A (en) | 1988-05-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| G160 | Decision to publish patent application | ||
| PG1605 | Publication of application before grant of patent |
St.27 status event code: A-2-2-Q10-Q13-nap-PG1605 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| FPAY | Annual fee payment |
Payment date: 19921103 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 19931201 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 19931201 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |