KR870008384A - 밀폐식 고주파수 표면장착 마이크로 일렉트로닉 팩키지 - Google Patents
밀폐식 고주파수 표면장착 마이크로 일렉트로닉 팩키지 Download PDFInfo
- Publication number
- KR870008384A KR870008384A KR870001510A KR870001510A KR870008384A KR 870008384 A KR870008384 A KR 870008384A KR 870001510 A KR870001510 A KR 870001510A KR 870001510 A KR870001510 A KR 870001510A KR 870008384 A KR870008384 A KR 870008384A
- Authority
- KR
- South Korea
- Prior art keywords
- package
- base
- top surface
- welded
- frame
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01025—Manganese [Mn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 2 도는 본 발명에 따라 구성된 용접 밀폐식 마이코로 웨이브 IC 및 하이브리드 팩키지의 단면도.
제 3 도는 제 2 도에 도시한 팩키지의 리이드들 중 1개의 리이드를 더욱 상세하게 도시한 도면.
제 4 도는 제 2 도에 도시한 팩키지의 구성부품들의 분해도.
Claims (5)
- 기부를 통해 상부 표면으로부터 저부 표면으로 연장되는 용접 밀폐식 전도성 비아를 갖고 있고 마이크로 일렉트로닉 회로 소자 및 저부 표면을 지지하기 위한 상부 표면을 갖고 있는 세라믹 기부, 용접 밀폐부를 형성하는 열전도성 물질로 기부의 상부 표면상의 회로 소자들에 부착되고 팩키지내의 회로에 전기적 접속부를 제공하도록 팩키지의 측면으로부터 연장되는 다수의 전도성 리이드, 용접 밀폐부를 형성하는 열비전도성 물질로 기부의 상부표면 및 리이드에 밀폐된 팩키지의 측벽들을 형성하고 금속층을 가진 상부표면을 갖고 있는 세라믹 프레임, 및 프레임의 금속 상부 표면에 용접 밀폐된 납땜 가능한 저부 표면을 갖고 있는 리드로 구성되는 것을 특징으로하는 마이크로 일렉트로닉 회로용 용접 밀폐식 팩키지.
- 제 1 항에 있어서, 전도성 비아들이 기부가 화이어되기 전에 기부내에 형성되고, 텅스텐 페이스트로 채워지며, 세라믹 기부와 코화이어되는 것을 특징으로 하는 팩키지.
- 제 1 항에 있어서, 열전도성 물질이 은이 섞인 납땜 유리이고, 열비전도성 물질이 산화 납땜납 유리인 것을 특징으로 하는 팩키지.
- 제 1 항에 있어서, 기부의 저부 표면이 접지면을 제공하도록 금속화되는 것을 특징으로 하는 팩키지.
- 제 1 항에 있어서, 리이들이 팩키지 측으로부터 나오는 지점에서 테이퍼되고, 좁은 부분이 기부와 프레임 사이로 연장되며, 표면 장착시키기 위해 형성된 테이퍼 부분이 인쇄회로 기판과 접속되는 것을 특징으로 하는 팩키지.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US83292186A | 1986-02-24 | 1986-02-24 | |
US832921 | 1992-02-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR870008384A true KR870008384A (ko) | 1987-09-26 |
Family
ID=25262933
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR870001510A KR870008384A (ko) | 1986-02-24 | 1987-02-23 | 밀폐식 고주파수 표면장착 마이크로 일렉트로닉 팩키지 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0235503B1 (ko) |
JP (1) | JPH0752759B2 (ko) |
KR (1) | KR870008384A (ko) |
CA (1) | CA1256589A (ko) |
DE (1) | DE3777856D1 (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0793392B2 (ja) * | 1986-10-25 | 1995-10-09 | 新光電気工業株式会社 | 超高周波素子用パツケ−ジ |
US4942076A (en) * | 1988-11-03 | 1990-07-17 | Micro Substrates, Inc. | Ceramic substrate with metal filled via holes for hybrid microcircuits and method of making the same |
JP3129288B2 (ja) * | 1998-05-28 | 2001-01-29 | 日本電気株式会社 | マイクロ波集積回路マルチチップモジュール、マイクロ波集積回路マルチチップモジュールの実装構造 |
EP1058307A1 (en) * | 1999-06-03 | 2000-12-06 | Alps Electric Co., Ltd. | Electronic unit effectively utilizing circuit board surface |
US8232635B2 (en) | 2004-08-25 | 2012-07-31 | International Rectifier Corporation | Hermetic semiconductor package |
JP4575261B2 (ja) * | 2005-09-14 | 2010-11-04 | 株式会社東芝 | 高周波用パッケージ |
JP5368377B2 (ja) * | 2010-06-02 | 2013-12-18 | 三菱電機株式会社 | 電子部品パッケージおよびその製造方法 |
US20220044981A1 (en) * | 2020-08-04 | 2022-02-10 | Qorvo Us, Inc. | Hermetic package for high cte mismatch |
CN113838845B (zh) * | 2021-11-26 | 2022-02-11 | 成都雷电微力科技股份有限公司 | 一种基于三维堆叠气密封装的tr组件及组装方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2007911B (en) * | 1977-10-12 | 1982-03-24 | Secr Defence | Methods of packaging microwave intergrated circuits and to microwave intergrated circiuted packages |
JPS55166941A (en) * | 1979-06-13 | 1980-12-26 | Nec Corp | Semiconductor device |
JPS5683050A (en) * | 1979-12-12 | 1981-07-07 | Toshiba Corp | Semiconductor device |
JPS5756953A (en) * | 1981-08-10 | 1982-04-05 | Nec Corp | Transistor |
-
1987
- 1987-01-12 EP EP87100266A patent/EP0235503B1/en not_active Expired - Lifetime
- 1987-01-12 DE DE8787100266T patent/DE3777856D1/de not_active Expired - Lifetime
- 1987-01-19 CA CA000527619A patent/CA1256589A/en not_active Expired
- 1987-02-18 JP JP62035419A patent/JPH0752759B2/ja not_active Expired - Lifetime
- 1987-02-23 KR KR870001510A patent/KR870008384A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JPS62196853A (ja) | 1987-08-31 |
JPH0752759B2 (ja) | 1995-06-05 |
CA1256589A (en) | 1989-06-27 |
EP0235503A3 (en) | 1988-10-26 |
EP0235503B1 (en) | 1992-04-01 |
DE3777856D1 (de) | 1992-05-07 |
EP0235503A2 (en) | 1987-09-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |