KR870003680A - 물품의 융착 접합장치 - Google Patents

물품의 융착 접합장치 Download PDF

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Publication number
KR870003680A
KR870003680A KR1019860004051A KR860004051A KR870003680A KR 870003680 A KR870003680 A KR 870003680A KR 1019860004051 A KR1019860004051 A KR 1019860004051A KR 860004051 A KR860004051 A KR 860004051A KR 870003680 A KR870003680 A KR 870003680A
Authority
KR
South Korea
Prior art keywords
article
heat transfer
heating
transfer liquid
fusion splicing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019860004051A
Other languages
English (en)
Korean (ko)
Inventor
겐시 곤도오
Original Assignee
겐시 곤도오
니혼 덴네쓰 게이기 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 겐시 곤도오, 니혼 덴네쓰 게이기 가부시끼가이샤 filed Critical 겐시 곤도오
Publication of KR870003680A publication Critical patent/KR870003680A/ko
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0002—Soldering by means of dipping in a fused salt bath
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Molten Solder (AREA)
KR1019860004051A 1985-09-17 1986-05-23 물품의 융착 접합장치 Ceased KR870003680A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60203345A JPS6264475A (ja) 1985-09-17 1985-09-17 物品の融着接合装置
JP203345 1985-09-17

Publications (1)

Publication Number Publication Date
KR870003680A true KR870003680A (ko) 1987-04-18

Family

ID=16472487

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860004051A Ceased KR870003680A (ko) 1985-09-17 1986-05-23 물품의 융착 접합장치

Country Status (4)

Country Link
EP (1) EP0217588A1 (https=)
JP (1) JPS6264475A (https=)
KR (1) KR870003680A (https=)
CN (1) CN1006612B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4747533A (en) * 1986-04-28 1988-05-31 International Business Machines Corporation Bonding method and apparatus
DE4103098C1 (https=) * 1991-02-01 1992-06-25 Helmut Walter 8901 Koenigsbrunn De Leicht
JP3974525B2 (ja) 2000-12-21 2007-09-12 富士通株式会社 リフロー半田付け装置及びリフロー半田付け方法
DE102007054710B3 (de) * 2007-11-16 2009-07-09 Semikron Elektronik Gmbh & Co. Kg Verfahren zur Herstellung einer Halbleiterbaugruppe

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3765475A (en) * 1971-06-04 1973-10-16 Iteck Corp Apparatus for soldering thick film substrates
US3904102A (en) * 1974-06-05 1975-09-09 Western Electric Co Apparatus and method for soldering, fusing or brazing
US3866307A (en) * 1973-09-07 1975-02-18 Western Electric Co Method for soldering, fusing or brazing
US4032033A (en) * 1976-03-18 1977-06-28 Western Electric Company, Inc. Methods and apparatus for heating articles
US4389797A (en) * 1981-06-23 1983-06-28 The Htc Corporation Continuous vapor processing system
US4558524A (en) * 1982-10-12 1985-12-17 Usm Corporation Single vapor system for soldering, fusing or brazing
US4538757A (en) * 1983-08-01 1985-09-03 Motorola, Inc. Wave soldering in a reducing atmosphere

Also Published As

Publication number Publication date
CN1006612B (zh) 1990-01-31
CN86104933A (zh) 1987-03-18
JPH0354030B2 (https=) 1991-08-16
EP0217588A1 (en) 1987-04-08
JPS6264475A (ja) 1987-03-23

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19860523

PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 19900122

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 19900626

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 19900122

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I