KR870003680A - 물품의 융착 접합장치 - Google Patents

물품의 융착 접합장치 Download PDF

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Publication number
KR870003680A
KR870003680A KR1019860004051A KR860004051A KR870003680A KR 870003680 A KR870003680 A KR 870003680A KR 1019860004051 A KR1019860004051 A KR 1019860004051A KR 860004051 A KR860004051 A KR 860004051A KR 870003680 A KR870003680 A KR 870003680A
Authority
KR
South Korea
Prior art keywords
article
heat transfer
heating
transfer liquid
fusion splicing
Prior art date
Application number
KR1019860004051A
Other languages
English (en)
Inventor
겐시 곤도오
Original Assignee
겐시 곤도오
니혼 덴네쓰 게이기 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 겐시 곤도오, 니혼 덴네쓰 게이기 가부시끼가이샤 filed Critical 겐시 곤도오
Publication of KR870003680A publication Critical patent/KR870003680A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0002—Soldering by means of dipping in a fused salt bath
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

내용 없음

Description

물품의 융착 접합장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는, 본 발명의 1실시예를 나타내는 측단면도.
제2도는, 본 발명의 다른 실시예를 나타내는 측단면도.
* 도면의 주요부분에 대한 부호의 설명
1 : 용기 2 : 가열코일
3 : 냉각코일 4 : 불소계의 열전이액
5 : 1점 쇄선 6 : 프린트기판
7 : 지지구 8 : 칩부품
9 : 이스트 땜납 11 : 가열탱크
12 : 열전이 액 13 : 히이터
14 : 프린트 기판 15 : 지지구
16 : 전자부품 21 : 반송체인
31 : 내측용기 32 : 펌프
33 : 분류파(噴流波)

Claims (1)

  1. 제1의 물품과 제2의 물품과를 접합하는 상기 제1의 물품의 접합면과 상기 제1의 물품의 접합면에 미리 도포된 접합제를 상기 제1의 물품과 상기 제2의 물품과 함께 가열하여 상기 접합체를 융해시키고, 또한 상기 융해된 접합제를 응고시켜서 상기 제1의 물품과 상기 제1의 물품과를 접합하는 물품의 융착 접합 장치에 있어서, 상기 접합제의 융해점 보다도 높은 비등점을 가지고, 상기 접합제를 융해하는 열 전이액(12)과 이 열전이액(12)을 수용하여 가열하는 가연 탱크(11)와, 이 가열탱크(11)내의 상기 열전이액(12)에 담금하여 상기 접합제를 융해시킨 후에, 상기 가열탱크(11)의 외부에서 응고시켜서 상기 제1의 물품과 상기 제2의 물품과를 접합시키는 반송 수단과를 구비한 것을 특징으로 하는 물품의 융착접합장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860004051A 1985-09-17 1986-05-23 물품의 융착 접합장치 KR870003680A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60203345A JPS6264475A (ja) 1985-09-17 1985-09-17 物品の融着接合装置
JP203345 1985-09-17

Publications (1)

Publication Number Publication Date
KR870003680A true KR870003680A (ko) 1987-04-18

Family

ID=16472487

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860004051A KR870003680A (ko) 1985-09-17 1986-05-23 물품의 융착 접합장치

Country Status (4)

Country Link
EP (1) EP0217588A1 (ko)
JP (1) JPS6264475A (ko)
KR (1) KR870003680A (ko)
CN (1) CN1006612B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4747533A (en) * 1986-04-28 1988-05-31 International Business Machines Corporation Bonding method and apparatus
DE4103098C1 (ko) * 1991-02-01 1992-06-25 Helmut Walter 8901 Koenigsbrunn De Leicht
JP3974525B2 (ja) 2000-12-21 2007-09-12 富士通株式会社 リフロー半田付け装置及びリフロー半田付け方法
DE102007054710B3 (de) * 2007-11-16 2009-07-09 Semikron Elektronik Gmbh & Co. Kg Verfahren zur Herstellung einer Halbleiterbaugruppe

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3765475A (en) * 1971-06-04 1973-10-16 Iteck Corp Apparatus for soldering thick film substrates
US3904102A (en) * 1974-06-05 1975-09-09 Western Electric Co Apparatus and method for soldering, fusing or brazing
US3866307A (en) * 1973-09-07 1975-02-18 Western Electric Co Method for soldering, fusing or brazing
US4032033A (en) * 1976-03-18 1977-06-28 Western Electric Company, Inc. Methods and apparatus for heating articles
US4389797A (en) * 1981-06-23 1983-06-28 The Htc Corporation Continuous vapor processing system
US4558524A (en) * 1982-10-12 1985-12-17 Usm Corporation Single vapor system for soldering, fusing or brazing
US4538757A (en) * 1983-08-01 1985-09-03 Motorola, Inc. Wave soldering in a reducing atmosphere

Also Published As

Publication number Publication date
JPS6264475A (ja) 1987-03-23
CN86104933A (zh) 1987-03-18
EP0217588A1 (en) 1987-04-08
JPH0354030B2 (ko) 1991-08-16
CN1006612B (zh) 1990-01-31

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