KR870001648A - 반도체 재료의 처리조(處理槽) - Google Patents

반도체 재료의 처리조(處理槽) Download PDF

Info

Publication number
KR870001648A
KR870001648A KR1019860005591A KR860005591A KR870001648A KR 870001648 A KR870001648 A KR 870001648A KR 1019860005591 A KR1019860005591 A KR 1019860005591A KR 860005591 A KR860005591 A KR 860005591A KR 870001648 A KR870001648 A KR 870001648A
Authority
KR
South Korea
Prior art keywords
holes
tank
processing tank
row
semiconductor material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019860005591A
Other languages
English (en)
Korean (ko)
Inventor
세이이찌로 아이고
Original Assignee
세이이찌로 아이고
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세이이찌로 아이고 filed Critical 세이이찌로 아이고
Publication of KR870001648A publication Critical patent/KR870001648A/ko
Priority to KR2019900012096U priority Critical patent/KR910001932Y1/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
    • B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
    • B05C3/09—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating separate articles
    • B05C3/109—Passing liquids or other fluent materials into or through chambers containing stationary articles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1019860005591A 1985-07-15 1986-07-11 반도체 재료의 처리조(處理槽) Withdrawn KR870001648A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019900012096U KR910001932Y1 (ko) 1985-07-15 1990-08-10 반도체 재료의 처리조

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP107856 1985-07-15
JP1985107856U JPH0642333Y2 (ja) 1985-07-15 1985-07-15 半導体材料の処理槽

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR2019900012096U Division KR910001932Y1 (ko) 1985-07-15 1990-08-10 반도체 재료의 처리조

Publications (1)

Publication Number Publication Date
KR870001648A true KR870001648A (ko) 1987-03-17

Family

ID=14469797

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1019860005591A Withdrawn KR870001648A (ko) 1985-07-15 1986-07-11 반도체 재료의 처리조(處理槽)
KR2019900012096U Expired KR910001932Y1 (ko) 1985-07-15 1990-08-10 반도체 재료의 처리조

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR2019900012096U Expired KR910001932Y1 (ko) 1985-07-15 1990-08-10 반도체 재료의 처리조

Country Status (3)

Country Link
JP (1) JPH0642333Y2 (enrdf_load_stackoverflow)
KR (2) KR870001648A (enrdf_load_stackoverflow)
DE (1) DE3623233A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050196519A1 (en) * 2004-03-08 2005-09-08 Depuy Products, Inc. Apparatus for producing a biomimetic coating on a medical implant

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1067657B (de) * 1955-08-03 1959-10-22 Schilde Maschb Ag Tauchbehaelter fuer Oberflaechenbehandlung
DE1577685B2 (de) * 1965-08-13 1974-07-04 Duerr, Otto, 7000 Stuttgart Tauchbecken zur Oberflächenbehandlung von Werkstücken, insbesondere zum Lackieren
JPS5452985A (en) * 1977-10-04 1979-04-25 Kyushu Nippon Electric Etching device

Also Published As

Publication number Publication date
DE3623233A1 (de) 1987-01-15
JPH0642333Y2 (ja) 1994-11-02
JPS6217122U (enrdf_load_stackoverflow) 1987-02-02
KR910001932Y1 (ko) 1991-03-30

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Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19860711

PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19860711

Comment text: Request for Examination of Application

PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 19900216

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 19900710

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 19900216

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

PC1205 Withdrawal of application forming a basis of a converted application
WICV Withdrawal of application forming a basis of a converted application