DE3623233A1 - Becken zur behandlung von halbleitermaterialien - Google Patents

Becken zur behandlung von halbleitermaterialien

Info

Publication number
DE3623233A1
DE3623233A1 DE19863623233 DE3623233A DE3623233A1 DE 3623233 A1 DE3623233 A1 DE 3623233A1 DE 19863623233 DE19863623233 DE 19863623233 DE 3623233 A DE3623233 A DE 3623233A DE 3623233 A1 DE3623233 A1 DE 3623233A1
Authority
DE
Germany
Prior art keywords
basin
treatment liquid
treatment
inlet
semiconductor materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19863623233
Other languages
German (de)
English (en)
Inventor
Seiichiro Aigo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE3623233A1 publication Critical patent/DE3623233A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
    • B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
    • B05C3/09—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating separate articles
    • B05C3/109—Passing liquids or other fluent materials into or through chambers containing stationary articles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE19863623233 1985-07-15 1986-07-10 Becken zur behandlung von halbleitermaterialien Ceased DE3623233A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985107856U JPH0642333Y2 (ja) 1985-07-15 1985-07-15 半導体材料の処理槽

Publications (1)

Publication Number Publication Date
DE3623233A1 true DE3623233A1 (de) 1987-01-15

Family

ID=14469797

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19863623233 Ceased DE3623233A1 (de) 1985-07-15 1986-07-10 Becken zur behandlung von halbleitermaterialien

Country Status (3)

Country Link
JP (1) JPH0642333Y2 (enrdf_load_stackoverflow)
KR (2) KR870001648A (enrdf_load_stackoverflow)
DE (1) DE3623233A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1574263A3 (en) * 2004-03-08 2007-08-22 Depuy Products, Inc. Apparatus for producing a biomimetic coating on a medical implant

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1067657B (de) * 1955-08-03 1959-10-22 Schilde Maschb Ag Tauchbehaelter fuer Oberflaechenbehandlung
DE1577685B2 (de) * 1965-08-13 1974-07-04 Duerr, Otto, 7000 Stuttgart Tauchbecken zur Oberflächenbehandlung von Werkstücken, insbesondere zum Lackieren

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5452985A (en) * 1977-10-04 1979-04-25 Kyushu Nippon Electric Etching device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1067657B (de) * 1955-08-03 1959-10-22 Schilde Maschb Ag Tauchbehaelter fuer Oberflaechenbehandlung
DE1577685B2 (de) * 1965-08-13 1974-07-04 Duerr, Otto, 7000 Stuttgart Tauchbecken zur Oberflächenbehandlung von Werkstücken, insbesondere zum Lackieren

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1574263A3 (en) * 2004-03-08 2007-08-22 Depuy Products, Inc. Apparatus for producing a biomimetic coating on a medical implant

Also Published As

Publication number Publication date
JPH0642333Y2 (ja) 1994-11-02
JPS6217122U (enrdf_load_stackoverflow) 1987-02-02
KR870001648A (ko) 1987-03-17
KR910001932Y1 (ko) 1991-03-30

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8131 Rejection