KR860008597A - 페턴 검사방법 - Google Patents
페턴 검사방법 Download PDFInfo
- Publication number
- KR860008597A KR860008597A KR1019860002753A KR860002753A KR860008597A KR 860008597 A KR860008597 A KR 860008597A KR 1019860002753 A KR1019860002753 A KR 1019860002753A KR 860002753 A KR860002753 A KR 860002753A KR 860008597 A KR860008597 A KR 860008597A
- Authority
- KR
- South Korea
- Prior art keywords
- image
- inspection method
- pattern inspection
- cutting
- pattern
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/75—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예의 개략을 도시한 전체 구성도.
제2도는 검사페턴에서 불감대 페턴의 국부영역을 잘라내는 것을 설명하기 위한 도면이며, 제1도의 불감대 설정회로 3,4 및 국부페턴 추출회로 5,6,7에 상당하는 구체적 회로구성을 도시한 도면.
제3도는 쉬프트 레지스터군의 구성을 설명하기 위한 도면.
Claims (6)
- 기준과 검사대상에 대응하는 2종류의 영상을 2치화한 후, 화상을 잘라내고, 혹은 화상을 잘라낸 후, 2치화하여, 번갈아서 비교해서 일치하지 않는 부분에 결함이 있다고 하는 패턴 검사방법에 있어서, 2치로 표시된 잘라내는 화상의 경계의 양쪽을 불감대로 하는 과정, 기준영상과 검사영상과의 위치 엇갈림을 허용하여야 할 위치엇갈림 허영범위로 마련해서 화상을 잘라내는 과정, 잘라내는 화상을 위치 엇갈림 허용범위내에서 서로 비교하는 경우, 불감대를 제외하고, 일치하는 조합이 전혀 없을 때, 결함신호를 출력하는 과정을 포함하고 있는 페턴 검사방법.
- 특허청구의 범위 제1항의 페턴 검사방법에 있어서, 상기 경계의 양쪽을 불감대로 하는 과정은, 2치로 표시된 잘라낸 화상의 확대 혹은 축소를 위한 논리회로에 의해서 달성되는 페턴 검사방법.
- 특허청구의 범위 제1항의 페턴검사 방법에 있어서, 상기 화상을 잘라내는 과정은, 상기 기준영상과, 상기 검사대상의 영상중, 한쪽의 화상을 다른쪽의 화상보다 크게 잘라내는 것에 의해 위치엇갈림 허용범위를 마련하여서 되는 페턴 검사방법.
- 특허청구의 범위 제1항의 페턴검사 방법에 있어서, 상기 화상을 잘라내는 과정은, 상기 기준영상과, 상기 검사대상인 영상의 양쪽을 위치엇살림 허용범위의 상단분을 크게 잘라내어서 되는 페턴 검사방법.
- 특허청구의 범위 제1항의 페턴검사 방법에 있어서, 상기 기준에 대응하는 영상으로서 동일형상을 다수개 가진 검사대상의 일부에 대응하는 영상을 이용하는 페턴 검사방법.
- 특허청구의 범위 제1항의 페턴검사 방법에 있어서, 상기 기준과 검사대상에 대응하는 2종류의 영상중, 적어도 한쪽을 일시적으로 기억한 후, 상기 화상의 잘라내기를 행하는 페턴 검사방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP76389 | 1985-04-12 | ||
JP60-76389 | 1985-04-12 | ||
JP60076389A JP2602201B2 (ja) | 1985-04-12 | 1985-04-12 | 被検査パターンの欠陥検査方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR860008597A true KR860008597A (ko) | 1986-11-17 |
KR900007434B1 KR900007434B1 (ko) | 1990-10-08 |
Family
ID=13603968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019860002753A KR900007434B1 (ko) | 1985-04-12 | 1986-04-11 | 패턴 검사 장치 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4776023A (ko) |
JP (1) | JP2602201B2 (ko) |
KR (1) | KR900007434B1 (ko) |
DE (1) | DE3612233A1 (ko) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5093797A (en) * | 1987-01-13 | 1992-03-03 | Omron Tateisi Electronics Co. | Apparatus for inspecting packaged electronic device |
US5046110A (en) * | 1988-03-25 | 1991-09-03 | Texas Instruments Incorporated | Comparator error filtering for pattern inspector |
US5001764A (en) * | 1988-03-25 | 1991-03-19 | Texas Instruments Incorporated | Guardbands for pattern inspector |
US4984282A (en) * | 1988-03-25 | 1991-01-08 | Texas Instruments Incorporated | Parallel processing of reference and guardband data |
US5073952A (en) * | 1988-09-07 | 1991-12-17 | Sigmax Kabushiki Kaisha | Pattern recognition device |
JPH02148180A (ja) * | 1988-11-29 | 1990-06-07 | Nippon Seiko Kk | パターン検査方法及び装置 |
US5185812A (en) * | 1990-02-14 | 1993-02-09 | Kabushiki Kaisha Toshiba | Optical pattern inspection system |
GB9006803D0 (en) * | 1990-03-27 | 1990-05-23 | Thurne Eng Co Ltd | Boundary recognition |
US6320977B1 (en) * | 1990-04-04 | 2001-11-20 | Matsushita Electric Industrial Co., Ltd | Method and apparatus for positional detection using pattern matching process |
US5157762A (en) * | 1990-04-10 | 1992-10-20 | Gerber Systems Corporation | Method and apparatus for providing a three state data base for use with automatic optical inspection systems |
DE69132304T2 (de) * | 1990-04-27 | 2000-12-21 | Canon Kk | Aufzeichnungsgerät mit Aufzeichnungsköpfen |
JP3040433B2 (ja) * | 1990-06-11 | 2000-05-15 | キヤノン株式会社 | 補正データ作成方法 |
US5365596A (en) * | 1992-12-17 | 1994-11-15 | Philip Morris Incorporated | Methods and apparatus for automatic image inspection of continuously moving objects |
US5867609A (en) * | 1995-12-07 | 1999-02-02 | Nec Research Institute, Inc. | Method for computing correlation operations on partially occluded data |
JPH09184715A (ja) * | 1995-12-28 | 1997-07-15 | Hitachi Ltd | パターン形状検査装置 |
JPH09222312A (ja) * | 1996-02-16 | 1997-08-26 | Mitsui Mining & Smelting Co Ltd | パターン検査装置および方法 |
US6266452B1 (en) | 1999-03-18 | 2001-07-24 | Nec Research Institute, Inc. | Image registration method |
US20050170056A1 (en) * | 1999-04-08 | 2005-08-04 | Weber Maschinenbau Gmbh & Co. Kg | Method for the slicing of food products |
US6707936B1 (en) * | 1999-04-16 | 2004-03-16 | Texas Instruments Incorporated | Method and apparatus for predicting device yield from a semiconductor wafer |
US7052483B2 (en) * | 2000-12-19 | 2006-05-30 | Animas Corporation | Transcutaneous inserter for low-profile infusion sets |
US6950547B2 (en) * | 2001-02-12 | 2005-09-27 | 3M Innovative Properties Company | Web inspection method and device |
US6997089B2 (en) * | 2002-06-25 | 2006-02-14 | Formax, Inc. | Optical grading system for slicer apparatus |
US7483167B2 (en) * | 2003-08-27 | 2009-01-27 | Marvell International Ltd. | Image forming apparatus for identifying undesirable toner placement |
JP2007517232A (ja) * | 2003-12-31 | 2007-06-28 | スリーエム イノベイティブ プロパティズ カンパニー | ウェブに基づく物品の歩留まりの最大化 |
US7120515B2 (en) * | 2003-12-31 | 2006-10-10 | 3M Innovative Properties Company | Inventory control for web-based articles |
US7623699B2 (en) | 2004-04-19 | 2009-11-24 | 3M Innovative Properties Company | Apparatus and method for the automated marking of defects on webs of material |
DE102004036229A1 (de) * | 2004-07-26 | 2006-02-16 | Giesecke & Devrient Gmbh | Verfahren für die Prüfung von Banknoten |
US8265354B2 (en) * | 2004-08-24 | 2012-09-11 | Siemens Medical Solutions Usa, Inc. | Feature-based composing for 3D MR angiography images |
US7697169B2 (en) * | 2004-10-29 | 2010-04-13 | Marvell International Technology Ltd. | Laser print apparatus with toner explosion compensation |
US7443627B1 (en) | 2006-03-07 | 2008-10-28 | Marvell International Ltd. | Lowest power mode for a mobile drive |
US20090028417A1 (en) * | 2007-07-26 | 2009-01-29 | 3M Innovative Properties Company | Fiducial marking for multi-unit process spatial synchronization |
US7542821B2 (en) * | 2007-07-26 | 2009-06-02 | 3M Innovative Properties Company | Multi-unit process spatial synchronization of image inspection systems |
US8175739B2 (en) * | 2007-07-26 | 2012-05-08 | 3M Innovative Properties Company | Multi-unit process spatial synchronization |
US7797133B2 (en) * | 2008-09-10 | 2010-09-14 | 3M Innovative Properties Company | Multi-roller registered repeat defect detection of a web process line |
CN103091332B (zh) * | 2013-01-16 | 2014-09-24 | 浙江科技学院 | 一种基于机器视觉的u型粉管的检测方法及其检测系统 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5637586B2 (ko) * | 1973-07-02 | 1981-09-01 | ||
JPS5419366A (en) * | 1977-07-14 | 1979-02-14 | Nippon Jidoseigyo Ltd | Device for inspecting fault of pattern |
JPS5915381B2 (ja) * | 1978-10-16 | 1984-04-09 | 日本電信電話株式会社 | パタ−ン検査法 |
JPS5616160U (ko) * | 1979-07-13 | 1981-02-12 | ||
JPS5924361A (ja) * | 1982-07-29 | 1984-02-08 | Sharp Corp | 日付の表示方式 |
JPS5951536A (ja) * | 1982-09-14 | 1984-03-26 | Fujitsu Ltd | パタ−ン認識方法及びその装置 |
GB2129546B (en) * | 1982-11-02 | 1985-09-25 | Cambridge Instr Ltd | Image comparison |
JPS59157505A (ja) * | 1983-02-28 | 1984-09-06 | Hitachi Ltd | パタ−ン検査装置 |
JPS59158162U (ja) * | 1983-04-09 | 1984-10-23 | 住友電気工業株式会社 | 加熱ロ−ラ |
EP0124113B1 (en) * | 1983-04-28 | 1989-03-01 | Hitachi, Ltd. | Method of detecting pattern defect and its apparatus |
JPH061370B2 (ja) * | 1983-11-24 | 1994-01-05 | 株式会社東芝 | マスク欠陥検査装置 |
US4648053A (en) * | 1984-10-30 | 1987-03-03 | Kollmorgen Technologies, Corp. | High speed optical inspection system |
US4668982A (en) * | 1985-06-17 | 1987-05-26 | The Perkin-Elmer Corporation | Misregistration/distortion correction scheme |
-
1985
- 1985-04-12 JP JP60076389A patent/JP2602201B2/ja not_active Expired - Fee Related
-
1986
- 1986-04-11 DE DE19863612233 patent/DE3612233A1/de active Granted
- 1986-04-11 US US06/850,681 patent/US4776023A/en not_active Expired - Lifetime
- 1986-04-11 KR KR1019860002753A patent/KR900007434B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE3612233A1 (de) | 1986-10-16 |
DE3612233C2 (ko) | 1988-09-22 |
US4776023A (en) | 1988-10-04 |
JP2602201B2 (ja) | 1997-04-23 |
KR900007434B1 (ko) | 1990-10-08 |
JPS61236285A (ja) | 1986-10-21 |
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