KR860006509A - 열 경화성 에폭시 수지 조성물 - Google Patents

열 경화성 에폭시 수지 조성물 Download PDF

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KR860006509A
KR860006509A KR1019860001135A KR860001135A KR860006509A KR 860006509 A KR860006509 A KR 860006509A KR 1019860001135 A KR1019860001135 A KR 1019860001135A KR 860001135 A KR860001135 A KR 860001135A KR 860006509 A KR860006509 A KR 860006509A
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epoxy resin
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amine
transition temperature
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추 성 건
성건추
쟈브로네트 하론드
조셉 스웨틀린 브리안
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허큘레스 인코오포레이티드
미첼 비. 키한
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    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
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    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/08—Polysulfonates
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
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Abstract

내용 없음

Description

열 경화성 에폭시 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도－제4도는 각각 실시예 10(B) 및 실시예 11－13의 열 경화성 매트릭스의 Ruo－착색 마이크로톰 단편의 사진이며,
제(5a) 및 (5b)도는 본 발명의 열경화재의 파쇄에너지(G IC ) 및 파쇄 메짐성(K IC )을 측정하는데 사용되는 테스트 표본을 도시한 것이다.

Claims (16)

1당량의 에폭사이드기당 0.8 내지 1.5당량의 활성 수소원자를 제공하도록 충분한 양의 아민 경화제와 약 2000 내지 10000의 수 평균 분자량, 약 125℃ 내지 250℃의 유리전이 온도 및 폴리에폭사이드 성분 또는 아민 경화제와 반응하는 적어도 1.4의 작용기를 갖는 20 내지 50중량%의 방향족 올리고머를 함유하는 것을 특징으로 하는 분자당 평균 1 이상의 에폭사이드기 및 약 50℃ 이하의 유리 전이 온도를 갖는 폴리에폭사이드 성분 및 방향족 올리고머로 구성된 열경화성 에폭시수지 조성물.
제1항에 있어서, 아민 경화제는 방향족 아민으로 구성되는 것을 특징으로 하는 열경화성 에폭시 수지 조성물.
제1항 또는 제2항에 있어서, 아민 경화제는 4,4'－디아미노 디페닐설폰인 것을 특징으로 하는 열경화성 에폭시 수지 조성물.
제1항 제2항 또는 제3항에 있어서, 상기 올리고머는 설폰다리결합 디페닐렌 단위를 함유하는 것을 특징으로 하는 열경화성 에폭시수지 조성물.
제4항에 있어서, 상기 올리고머는 또한 탄화수소 다리결합 디페닐렌단위를 함유하며 설폰 다리화 디페닐렌 단위의 수는 탄화수소 다리결합 디페닐렌 단위의 수를 초과하는 것울 특징으로 하는 열경화성 에폭시수지 조성물.
전술된 항 중 어느 한 항에 있어서, 폴리에폭사이드 성분은 평균 2 내지 4의 에폭사이드 기를 갖는 것을 특징으로 하는 열경화성에폭시수지 조성물.
전술된 항 중 어느 한 항에 있어서, 상기 작용기는 1차 아민, 2차 아민, 히드록실 또는 에폭사이드기로 부터 선택된 1 또는 그 이상의 기 인것을 특징으로 하는 열경화성 에폭시수지 조성물.
전술된 항 중 어느 한 항에 있어서, 폴리에폭사이드 화합물은 분자당 적어도 2 에폭사이드 기 및 약 20℃ 이하의 유리 전이 온도를 갖는 것을 특징으로 하는 열경화성 에폭시수지 조성물.
적어도 1.0MPam1/2의 파쇄메짐성(K IC ) 및 적어도 125℃의 유리 전이온도(Tg)를 가지며, 매트릭스 중 적어도 일부에 계속되는 유리질 연속상에 분산된 유리질 불연속 상의 영역으로 구성되는 것을 특징으로 하는 고 강도의 필라멘트 또는 파이버를 함유한 가교화 에폭시 수지 매트릭스로 구성되는 열경화성 합성물.
제9항에 있어서, 불연속상의 영역의 가장 큰 디멘젼은 약 0.1 내지 5 마이크론인 것을 특징으로 하는 열경화성 합성물.
제10항에 있어서, 불연속상의 총 부피는 연속상 및 불연속상의 총 부피에 대해 약 45 내지 50%인 것을 특징으로 하는 열경화성 합성물.
제11항에 있어서, 고강도의 필라멘트 또는 파이버는 탄소(그래파이트)섬유로 구성되며, 조성물의 총 부피에 대해 약 40 내지 70% 함유되어 있는 것을 특징으로 하는 열경화성 합성물.
열경화성 에폭시 수지 조성물 1중당량의 에폭사이드기 당 0.8 내지 1.5당량의 활성수소 원자를 제공하기에 충분한 양의 아민 경화제가 반응 혼합물에 분산되며, 방향족 올리고머는 조성물의 중량에 대해 20 내지 50중량%로 존재하며, 2000 내지 10000의 수평균 분자량, 약 125℃ 내지 250℃의 유리 전이온도 및 폴리에폭사이드 성분 또는 아민 경화제와 반응하는 적어도 1.4의 아민기를 갖는 것을 특징으로 하는, 분자당 평균 1이상의 에폭사이드 및 약 50℃ 이하의 유리전이 온도를 갖는 폴리에폭사이드 성분을 방향족 올리고머와 함께 가열하는 방법에 의해 제조되며, 고강도의 필라멘트 또는 파이버를 함유한 열경화성 에폭시 수지 조성물로 구성된 프레프레그.
제13항에 있어서, 고 강도의 필라멘트 또는 파이버는 탄소(그래파이트)파이버로 구성되는 것을 특징으로 하는 프레프레그.
조성물 중 1당량의 에폭사이드기 당 0.8 내지 1.5당량의 활성 수소 원자를 제공하기에 충분한 양의 아민 경화제가 반응 혼합물에 분산되며, 방향족 올리고머는 조성물의 중량에 대해 20 내지 50중량%로 존재하며, 2000 내지 10000의 수평균 분자량, 약 125℃ 내지 250℃의 유리전이 온도 및 폴리에폭사이드 성분 또는 아민 경화제와 반응하는 적어도 1.4의 아민기를 갖는 것을 특징으로 하는, 분자당 평균 1이상의 에폭사이드 및 약 50℃ 이하의 유리전이온도를 갖는 폴리에폭사이드 성분을 방향족 올리고머와 함께 가열하여 열경화성 에폭시수지 조성물을 제조하고 결과의 수지 조성물에 고강도의 필라멘트 또는 파이버를 결합시키는 단계로 구성되는 프레프레그 제조방법.
제15항에 있어서, 고 강도의 필라멘트 또는 파이버는 탄소(그래파이트)섬유로 구성되는 것을 특징으로 하는 프레프레그 제조 방법.
※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860001135A 1985-02-19 1986-02-19 열경화성 에폭시 수지 조성물 및 그로부터 제조된 열경화재 KR940010827B1 (ko)

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US702,518 1985-02-19
US06/702,518 US4656207A (en) 1985-02-19 1985-02-19 Epoxy thermosets having improved toughness
US724,133 1985-04-17
US06/724,133 US4656208A (en) 1985-02-19 1985-04-17 Thermosetting epoxy resin compositions and thermosets therefrom

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KR860006509A true KR860006509A (ko) 1986-09-11
KR940010827B1 KR940010827B1 (ko) 1994-11-17

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EP (1) EP0193082B1 (ko)
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CA (2) CA1246294A (ko)
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ES557453A0 (es) 1988-06-16
US4656208A (en) 1987-04-07
ES8802532A1 (es) 1988-06-16
CA1246294A (en) 1988-12-06
EP0193082A1 (en) 1986-09-03
KR940010827B1 (ko) 1994-11-17
CA1283241C (en) 1991-04-16
ES552137A0 (es) 1987-10-16
JPS6426665A (en) 1989-01-27
DE3669724D1 (de) 1990-04-26
ES8800291A1 (es) 1987-10-16
EP0193082B1 (en) 1990-03-21

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