KR860006509A - 열 경화성 에폭시 수지 조성물 - Google Patents
열 경화성 에폭시 수지 조성물 Download PDFInfo
- Publication number
- KR860006509A KR860006509A KR1019860001135A KR860001135A KR860006509A KR 860006509 A KR860006509 A KR 860006509A KR 1019860001135 A KR1019860001135 A KR 1019860001135A KR 860001135 A KR860001135 A KR 860001135A KR 860006509 A KR860006509 A KR 860006509A
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- resin composition
- thermosetting epoxy
- amine
- transition temperature
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/08—Polysulfonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
- Y10S525/906—Polysulfone
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도-제4도는 각각 실시예 10(B) 및 실시예 11-13의 열 경화성 매트릭스의 Ruo-착색 마이크로톰 단편의 사진이며,
제(5a) 및 (5b)도는 본 발명의 열경화재의 파쇄에너지(G IC ) 및 파쇄 메짐성(K IC )을 측정하는데 사용되는 테스트 표본을 도시한 것이다.
Claims (16)
1당량의 에폭사이드기당 0.8 내지 1.5당량의 활성 수소원자를 제공하도록 충분한 양의 아민 경화제와 약 2000 내지 10000의 수 평균 분자량, 약 125℃ 내지 250℃의 유리전이 온도 및 폴리에폭사이드 성분 또는 아민 경화제와 반응하는 적어도 1.4의 작용기를 갖는 20 내지 50중량%의 방향족 올리고머를 함유하는 것을 특징으로 하는 분자당 평균 1 이상의 에폭사이드기 및 약 50℃ 이하의 유리 전이 온도를 갖는 폴리에폭사이드 성분 및 방향족 올리고머로 구성된 열경화성 에폭시수지 조성물.
제1항에 있어서, 아민 경화제는 방향족 아민으로 구성되는 것을 특징으로 하는 열경화성 에폭시 수지 조성물.
제1항 또는 제2항에 있어서, 아민 경화제는 4,4'-디아미노 디페닐설폰인 것을 특징으로 하는 열경화성 에폭시 수지 조성물.
제1항 제2항 또는 제3항에 있어서, 상기 올리고머는 설폰다리결합 디페닐렌 단위를 함유하는 것을 특징으로 하는 열경화성 에폭시수지 조성물.
제4항에 있어서, 상기 올리고머는 또한 탄화수소 다리결합 디페닐렌단위를 함유하며 설폰 다리화 디페닐렌 단위의 수는 탄화수소 다리결합 디페닐렌 단위의 수를 초과하는 것울 특징으로 하는 열경화성 에폭시수지 조성물.
전술된 항 중 어느 한 항에 있어서, 폴리에폭사이드 성분은 평균 2 내지 4의 에폭사이드 기를 갖는 것을 특징으로 하는 열경화성에폭시수지 조성물.
전술된 항 중 어느 한 항에 있어서, 상기 작용기는 1차 아민, 2차 아민, 히드록실 또는 에폭사이드기로 부터 선택된 1 또는 그 이상의 기 인것을 특징으로 하는 열경화성 에폭시수지 조성물.
전술된 항 중 어느 한 항에 있어서, 폴리에폭사이드 화합물은 분자당 적어도 2 에폭사이드 기 및 약 20℃ 이하의 유리 전이 온도를 갖는 것을 특징으로 하는 열경화성 에폭시수지 조성물.
적어도 1.0MPam1/2의 파쇄메짐성(K IC ) 및 적어도 125℃의 유리 전이온도(Tg)를 가지며, 매트릭스 중 적어도 일부에 계속되는 유리질 연속상에 분산된 유리질 불연속 상의 영역으로 구성되는 것을 특징으로 하는 고 강도의 필라멘트 또는 파이버를 함유한 가교화 에폭시 수지 매트릭스로 구성되는 열경화성 합성물.
제9항에 있어서, 불연속상의 영역의 가장 큰 디멘젼은 약 0.1 내지 5 마이크론인 것을 특징으로 하는 열경화성 합성물.
제10항에 있어서, 불연속상의 총 부피는 연속상 및 불연속상의 총 부피에 대해 약 45 내지 50%인 것을 특징으로 하는 열경화성 합성물.
제11항에 있어서, 고강도의 필라멘트 또는 파이버는 탄소(그래파이트)섬유로 구성되며, 조성물의 총 부피에 대해 약 40 내지 70% 함유되어 있는 것을 특징으로 하는 열경화성 합성물.
열경화성 에폭시 수지 조성물 1중당량의 에폭사이드기 당 0.8 내지 1.5당량의 활성수소 원자를 제공하기에 충분한 양의 아민 경화제가 반응 혼합물에 분산되며, 방향족 올리고머는 조성물의 중량에 대해 20 내지 50중량%로 존재하며, 2000 내지 10000의 수평균 분자량, 약 125℃ 내지 250℃의 유리 전이온도 및 폴리에폭사이드 성분 또는 아민 경화제와 반응하는 적어도 1.4의 아민기를 갖는 것을 특징으로 하는, 분자당 평균 1이상의 에폭사이드 및 약 50℃ 이하의 유리전이 온도를 갖는 폴리에폭사이드 성분을 방향족 올리고머와 함께 가열하는 방법에 의해 제조되며, 고강도의 필라멘트 또는 파이버를 함유한 열경화성 에폭시 수지 조성물로 구성된 프레프레그.
제13항에 있어서, 고 강도의 필라멘트 또는 파이버는 탄소(그래파이트)파이버로 구성되는 것을 특징으로 하는 프레프레그.
조성물 중 1당량의 에폭사이드기 당 0.8 내지 1.5당량의 활성 수소 원자를 제공하기에 충분한 양의 아민 경화제가 반응 혼합물에 분산되며, 방향족 올리고머는 조성물의 중량에 대해 20 내지 50중량%로 존재하며, 2000 내지 10000의 수평균 분자량, 약 125℃ 내지 250℃의 유리전이 온도 및 폴리에폭사이드 성분 또는 아민 경화제와 반응하는 적어도 1.4의 아민기를 갖는 것을 특징으로 하는, 분자당 평균 1이상의 에폭사이드 및 약 50℃ 이하의 유리전이온도를 갖는 폴리에폭사이드 성분을 방향족 올리고머와 함께 가열하여 열경화성 에폭시수지 조성물을 제조하고 결과의 수지 조성물에 고강도의 필라멘트 또는 파이버를 결합시키는 단계로 구성되는 프레프레그 제조방법.
제15항에 있어서, 고 강도의 필라멘트 또는 파이버는 탄소(그래파이트)섬유로 구성되는 것을 특징으로 하는 프레프레그 제조 방법.
※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/702,518 US4656207A (en) | 1985-02-19 | 1985-02-19 | Epoxy thermosets having improved toughness |
US06/724,133 US4656208A (en) | 1985-02-19 | 1985-04-17 | Thermosetting epoxy resin compositions and thermosets therefrom |
US724,133 | 1985-04-17 | ||
US702,518 | 1991-05-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR860006509A true KR860006509A (ko) | 1986-09-11 |
KR940010827B1 KR940010827B1 (ko) | 1994-11-17 |
Family
ID=27106981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019860001135A KR940010827B1 (ko) | 1985-02-19 | 1986-02-19 | 열경화성 에폭시 수지 조성물 및 그로부터 제조된 열경화재 |
Country Status (7)
Country | Link |
---|---|
US (1) | US4656208A (ko) |
EP (1) | EP0193082B1 (ko) |
JP (1) | JPH0668015B2 (ko) |
KR (1) | KR940010827B1 (ko) |
CA (2) | CA1246294A (ko) |
DE (1) | DE3669724D1 (ko) |
ES (2) | ES8800291A1 (ko) |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5089560A (en) * | 1980-09-23 | 1992-02-18 | Amoco Corporation | Exopy resin with aromatic oligomer and rubber particles |
US4863787A (en) * | 1986-07-09 | 1989-09-05 | Hercules Incorporated | Damage tolerant composites containing infusible particles |
US4999238A (en) * | 1986-07-09 | 1991-03-12 | Hercules Incorporated | Damage tolerant composites containing infusible particles |
US4680076A (en) * | 1986-08-28 | 1987-07-14 | Hercules Incorporated | Multiphase epoxy thermosets having rubber within disperse phase |
DE3751984T2 (de) * | 1986-09-30 | 1997-04-17 | Toho Rayon Kk | Harzzusammensetzung auf der Basis von wärmehärtbaren Harzen und thermoplastischen Harzen |
US5231150A (en) * | 1987-10-05 | 1993-07-27 | Imperial Chemical Industries Plc | Polymer composition |
ATE142676T1 (de) * | 1987-10-05 | 1996-09-15 | Ici Plc | Polymermasse |
EP0319008A3 (en) * | 1987-12-01 | 1990-08-08 | Hercules Incorporated | Epoxy resin compositions as used in producing composites with high wet glass transition temperatures and in adhesive applications |
US4874661A (en) * | 1987-12-15 | 1989-10-17 | Browne James M | Impact enhanced prepregs and formulations |
US5002821A (en) * | 1987-12-15 | 1991-03-26 | The Dexter Corporation | Toughened prepregs and formulations |
US5317067A (en) * | 1988-01-25 | 1994-05-31 | Tokyo Tire & Rubber Company Limited | Molding and punching out melt-mixed epoxy resin-thermoplastic resin composition with hardener |
US4949443A (en) * | 1988-06-29 | 1990-08-21 | Tatsuhiko Saruwatari | Numerically controlled lathe |
US5073605A (en) * | 1988-07-14 | 1991-12-17 | General Electric Company | Bromine-bisphenol reacted bisphenol and novolak epoxy resins with polyphenylene ether |
US5096771A (en) * | 1988-07-14 | 1992-03-17 | General Electric Company | Fibers impregnated with epoxy resin mixture, brominated bisphenol and polyphenylene ether |
US4975319A (en) * | 1988-07-14 | 1990-12-04 | General Electric Company | Printed circuit board from fibers impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether |
US4853423A (en) * | 1988-07-14 | 1989-08-01 | General Electric Company | Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production |
US4977218A (en) * | 1988-09-26 | 1990-12-11 | Amoco Corporation | Carboxylated rubber particles as tougheners for fiber reinforced composites |
US4977215A (en) * | 1988-09-26 | 1990-12-11 | Amoco Corporation | Carboxylated rubber particles as tougheners for fiber reinforced composites |
US4972031A (en) * | 1988-10-05 | 1990-11-20 | Imperial Chemical Industries Plc | Plastic moulding composition comprising an uncured or partly cured thermoset resin precursor and a polyarylsulphone |
US5364914A (en) * | 1988-10-05 | 1994-11-15 | Imperial Chemical Industries Plc | Moulding composition comprising a thermoset component and thermoplast component |
DE3837015A1 (de) * | 1988-10-31 | 1990-05-03 | Basf Ag | Haertbare, zaehmodifizierte epoxidharze |
DE3842306A1 (de) * | 1988-12-16 | 1990-06-21 | Basf Ag | Haertbare, zaehmodifizierte epoxidharze |
JP2643518B2 (ja) * | 1989-02-10 | 1997-08-20 | 東レ株式会社 | プリプレグ |
US5120823A (en) * | 1989-02-17 | 1992-06-09 | Basf Aktiengesellschaft | Toughened thermosetting structural materials |
US4930852A (en) * | 1989-02-21 | 1990-06-05 | Simmonds Precision Product, Inc. | Optical fiber mounting and structural monitoring |
US5087657A (en) * | 1989-02-23 | 1992-02-11 | Amoco Corporation | Fiber-reinforced composites toughened with resin particles |
EP0392348A3 (en) * | 1989-04-14 | 1991-12-27 | Cytec Technology Corp. | Toughened thermosetting structural materials |
US5470622A (en) * | 1990-11-06 | 1995-11-28 | Raychem Corporation | Enclosing a substrate with a heat-recoverable article |
US5268223A (en) * | 1991-05-31 | 1993-12-07 | Amoco Corporation | Toughened fiber-reinforced composites |
US5532296A (en) * | 1991-07-30 | 1996-07-02 | Cytec Technology Corp. | Bismaleimide resin systems toughened by addition of preformed functionalized low Tg elastomer particles |
ES2183802T3 (es) * | 1991-07-30 | 2003-04-01 | Cytec Tech Corp | Materiales preimpregnados de matrices de resina termofraguada, reforzados con fibra y endurecidos, y los compuestos de los mismos. |
TW223083B (ko) * | 1991-10-25 | 1994-05-01 | Ciba Geigy Ag | |
US5250228A (en) * | 1991-11-06 | 1993-10-05 | Raychem Corporation | Conductive polymer composition |
US5464902A (en) * | 1992-03-23 | 1995-11-07 | Cytec Technology Corp. | Toughening of brittle epoxy resin matrices with functionalized particulate elastomers |
EP0583224B1 (en) * | 1992-08-11 | 1999-01-20 | Hexcel Corporation | Thermosetting resins toughened with sulfone polymers |
DE69309199T2 (de) * | 1992-08-18 | 1997-11-06 | Ciba Geigy Ag | 2,2'-Dimethyl-5,5'-Diaminodiphenyl Sulphon |
US5360840A (en) * | 1992-12-29 | 1994-11-01 | Hercules Incorporated | Epoxy resin compositions with improved storage stability |
US5418313A (en) * | 1994-05-25 | 1995-05-23 | Air Products And Chemicals, Inc. | Process for reducing cure time in epoxy resins cured with methylenedianiline and derivatives |
KR100314614B1 (ko) * | 1999-10-01 | 2001-11-15 | 유현식 | 열가소성 고분자 입자 첨가에 의한 고강인성 열경화성 수지 조성물의 제조방법 |
EP1162228B1 (en) | 1999-10-13 | 2007-07-11 | Toray Industries, Inc. | Prepreg and fiber-reinforced composite material |
TW528771B (en) * | 2000-01-27 | 2003-04-21 | Lead Data Inc | Soluble thermosetting polyethersulfone and making of them |
US6586607B1 (en) | 2002-04-11 | 2003-07-01 | Indspec Chemical Corporation | Process for making diglycidylether of alkoxylated resorcinol |
JP4151573B2 (ja) * | 2003-12-16 | 2008-09-17 | 東洋紡績株式会社 | 硬化型組成物 |
DE102004062551A1 (de) * | 2004-12-24 | 2006-07-06 | Rhein Chemie Rheinau Gmbh | Mikrogel-enthaltende duroplastische Zusammensetzung |
JP2008530300A (ja) * | 2005-02-16 | 2008-08-07 | サイテク・テクノロジー・コーポレーシヨン | 高温熱安定性を有するビスマレイミド樹脂 |
CA2772333C (en) | 2009-08-31 | 2017-01-17 | Cytec Technology Corp. | High performance adhesive compositions |
GB0922599D0 (en) * | 2009-12-23 | 2010-02-10 | Cytec Tech Corp | Modified resin systems for liquid resin infusion applications, prepreg autoclave applications and hybrids thereof |
US8686069B2 (en) | 2010-10-12 | 2014-04-01 | Hexcel Corporation | Solvent resistance of epoxy resins toughened with polyethersulfone |
DE102011006674A1 (de) | 2011-04-01 | 2012-10-04 | Bayer Materialscience Aktiengesellschaft | Polymere Nanopartikel und Beschichtungsmittel mit polymeren Nanopartikel |
EP2791200B1 (en) * | 2011-12-16 | 2016-03-16 | Solvay Specialty Polymers USA, LLC. | Epoxy resin compositions |
US9486940B2 (en) * | 2012-12-18 | 2016-11-08 | Autoliv Asp, Inc. | Radiation curable resin systems for composite materials and methods for use thereof |
KR102495843B1 (ko) | 2020-08-28 | 2023-02-03 | 한국화학연구원 | 신규한 화합물, 이를 포함하는 에폭시 수지 조성물 및 이의 경화물 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1306231A (ko) * | 1969-10-24 | 1973-02-07 | ||
US3950451A (en) * | 1971-02-27 | 1976-04-13 | Asahi Denka Kogyo K.K. | Hardenable epoxy resin composition |
US3920768A (en) * | 1974-01-14 | 1975-11-18 | Union Carbide Corp | Arylimide-epoxy resin composites |
JPS5398400A (en) * | 1977-02-10 | 1978-08-28 | Hitachi Ltd | Epoxy resin composition |
JPS5464599A (en) * | 1977-11-02 | 1979-05-24 | Hitachi Chem Co Ltd | Epoxy resin comosition |
FR2427910A1 (fr) * | 1978-06-09 | 1980-01-04 | Aerospatiale | Procede d'obtention d'un preimpregne pour enroulement filamentaire a base de fibres polyamides aromatiques et preimpregne ainsi obtenu |
JPS5714889A (en) * | 1980-06-30 | 1982-01-26 | Fujitsu Ltd | Matrix display unit driving method |
US4330659A (en) * | 1980-10-06 | 1982-05-18 | Ciba-Geigy Corporation | Modified amine hardener systems |
US4430473A (en) * | 1981-03-12 | 1984-02-07 | Union Carbide Corporation | Composites made from thermosetting compositions containing hemiformals of phenol |
US4517321A (en) * | 1983-05-20 | 1985-05-14 | Union Carbide Corporation | Preimpregnated reinforcements and high strength composites therefrom |
ZA84548B (en) * | 1983-05-20 | 1984-12-24 | Union Carbide Corp | Impact resistant matrix resins for advanced composites |
ZA84551B (en) * | 1983-06-30 | 1985-03-27 | Union Carbide Corp | Epoxy compositions containing oligomeric diamine hardeners and high strength composities therefrom |
-
1985
- 1985-04-17 US US06/724,133 patent/US4656208A/en not_active Expired - Lifetime
-
1986
- 1986-02-17 CA CA000501997A patent/CA1246294A/en not_active Expired
- 1986-02-18 DE DE8686102074T patent/DE3669724D1/de not_active Expired - Lifetime
- 1986-02-18 ES ES552137A patent/ES8800291A1/es not_active Expired
- 1986-02-18 EP EP86102074A patent/EP0193082B1/en not_active Expired - Lifetime
- 1986-02-19 KR KR1019860001135A patent/KR940010827B1/ko not_active IP Right Cessation
-
1987
- 1987-03-16 ES ES557453A patent/ES8802532A1/es not_active Expired
-
1988
- 1988-02-15 CA CA000559048A patent/CA1283241C/en not_active Expired - Lifetime
- 1988-06-15 JP JP63147911A patent/JPH0668015B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0193082B1 (en) | 1990-03-21 |
ES8800291A1 (es) | 1987-10-16 |
ES552137A0 (es) | 1987-10-16 |
CA1283241C (en) | 1991-04-16 |
CA1246294A (en) | 1988-12-06 |
DE3669724D1 (de) | 1990-04-26 |
ES557453A0 (es) | 1988-06-16 |
EP0193082A1 (en) | 1986-09-03 |
JPH0668015B2 (ja) | 1994-08-31 |
KR940010827B1 (ko) | 1994-11-17 |
ES8802532A1 (es) | 1988-06-16 |
US4656208A (en) | 1987-04-07 |
JPS6426665A (en) | 1989-01-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR860006509A (ko) | 열 경화성 에폭시 수지 조성물 | |
CA1278631C (en) | Multiphase epoxy thermosets having rubber within disperse phase | |
US4656207A (en) | Epoxy thermosets having improved toughness | |
US4786669A (en) | Lightly cross-linked resin materials | |
CA2213808A1 (en) | Epoxy resin(s) with curing agent and toughener | |
EP0241931B2 (en) | Epoxy resins based on tetraglycidyl diamines | |
KR860001167A (ko) | 무용제 폴리이미드-변태 에폭시 조성물 | |
JPH0639520B2 (ja) | エポキシ樹脂組成物およびその硬化法 | |
JPH082942B2 (ja) | 硬化性エポキシ樹脂組成物 | |
EP0228277A3 (en) | Moisture resistant, wet winding epoxy resin system containing aromatic diamines | |
US4822832A (en) | Thermosetting epoxy resin compositions and thermosets therefrom | |
Johncock et al. | Epoxy systems with improved water resistance, and the non‐fickian behaviour of epoxy systems during water ageing | |
US4663072A (en) | Acid anhydride mixtures in paste form useful for curing epoxy resins and a dual catalyst system therefor | |
Wingard et al. | Crosslinking of an epoxy with a mixed amine as a function of stoichiometry. II. Final properties via dynamic mechanical spectroscopy | |
KR850002582A (ko) | 경화성 에폭시 수지 조성물 | |
KR850001860A (ko) | 인터리프 처리된 수지매트릭스 복합체 | |
KR890006777A (ko) | 페놀이 변형된 에폭시 접착제 | |
KR890011949A (ko) | 에폭시 수지 조성물 및 이를 사용하는 복합재료용 프리프레그(prepreg) | |
JP2829369B2 (ja) | エポキシ樹脂組成物 | |
CA1281730C (en) | Epoxy resins based on tetraglycidyl diamines | |
Hata et al. | Viscoelastic properties of epoxy resins. III. Effect of molecular weight of antiplasticizers in highly crosslinked antiplasticization system | |
US4814414A (en) | Epoxy resins based on tetraglycidyl diamines | |
US5179139A (en) | Dihydroxybiphenyl-advanced epoxy resin blends | |
KR880005195A (ko) | 폴리에테르이미드/에폭시이미드 수지 조성물 및 그의 제조방법 | |
JPS61166826A (ja) | エポキシ樹脂組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 19981102 Year of fee payment: 5 |
|
LAPS | Lapse due to unpaid annual fee |