ES8800291A1 - Un procedimiento para preparar un producto preimpregnado - Google Patents

Un procedimiento para preparar un producto preimpregnado

Info

Publication number
ES8800291A1
ES8800291A1 ES552137A ES552137A ES8800291A1 ES 8800291 A1 ES8800291 A1 ES 8800291A1 ES 552137 A ES552137 A ES 552137A ES 552137 A ES552137 A ES 552137A ES 8800291 A1 ES8800291 A1 ES 8800291A1
Authority
ES
Spain
Prior art keywords
epoxy resin
resin compositions
thermosetting epoxy
glassy
polyepoxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES552137A
Other languages
English (en)
Other versions
ES552137A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hercules LLC
Original Assignee
Hercules LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27106981&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES8800291(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US06/702,518 external-priority patent/US4656207A/en
Application filed by Hercules LLC filed Critical Hercules LLC
Publication of ES552137A0 publication Critical patent/ES552137A0/es
Publication of ES8800291A1 publication Critical patent/ES8800291A1/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/08—Polysulfonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/906—Polysulfone
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PROCEDIMIENTO PARA PREPARAR COMPOSICIONES DE RESINA TERMOESTABLES. COMPRENDE: A) CALENTAR UN COMPONENTE POLIEPOXIDICO CON UN ALIGOMERO AROMATICO, PARA OBTENER UNA RESINA EPOXIDICA TERMOESTABLE; B) DISPERSAR UNA CANTIDAD DE ENDURECEDOR EN LA MEZCLA DE REACCION; C) INCORPORAR FILAMENTOS O FIBRAS EN LA MEZCLA DE B), PARA OBTENER UNA COMPOSICION DE RESINA TERMOESTABLE. EL COMPONENTE POLIEPOXIDICO SE SELECCIONA ENTRE 1,3-BIS-(2,3-EPOXIPROPOXI)-BENCENO Y 2,2,2,2-BIS P[(2,3-EPOXIPROPOXI)-FENIL] PROPANO Y TIENE UN GRUPO EPOXIDO POR MOLECULA; EL OLIGOMERO AROMATICO SE SELECCIONA ENTRE POLIESTERES, POLISULFONAS, CONTIENE GRUPOS AMINA, EPOXIDO Y TIOL Y TIENE UNA TEMPERATURA DE TRANSICION VITREA ENTRE 125 Y 250GC Y UN PESO MOLECULAR ENTRE 2.000 Y 10.000; EL ENDURECEDOR AMINICO ES 4,4''-DIAMINO DIFENILSULFONA Y LOS FILAMENTOS O FIBRAS SON DE GRAN RESISTENCIA Y DE GRAFITO. SE UTILIZA EN LA INDUSTRIA AEROESPACIAL Y EN TARJETAS DE CIRCUITO IMPRESO. A
ES552137A 1985-02-19 1986-02-18 Un procedimiento para preparar un producto preimpregnado Expired ES8800291A1 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/702,518 US4656207A (en) 1985-02-19 1985-02-19 Epoxy thermosets having improved toughness
US06/724,133 US4656208A (en) 1985-02-19 1985-04-17 Thermosetting epoxy resin compositions and thermosets therefrom

Publications (2)

Publication Number Publication Date
ES552137A0 ES552137A0 (es) 1987-10-16
ES8800291A1 true ES8800291A1 (es) 1987-10-16

Family

ID=27106981

Family Applications (2)

Application Number Title Priority Date Filing Date
ES552137A Expired ES8800291A1 (es) 1985-02-19 1986-02-18 Un procedimiento para preparar un producto preimpregnado
ES557453A Expired ES8802532A1 (es) 1985-02-19 1987-03-16 Un procedimiento para fabricar un material compuesto termoestable a base de una matriz de resina epoxidica reticulada.

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES557453A Expired ES8802532A1 (es) 1985-02-19 1987-03-16 Un procedimiento para fabricar un material compuesto termoestable a base de una matriz de resina epoxidica reticulada.

Country Status (7)

Country Link
US (1) US4656208A (es)
EP (1) EP0193082B1 (es)
JP (1) JPH0668015B2 (es)
KR (1) KR940010827B1 (es)
CA (2) CA1246294A (es)
DE (1) DE3669724D1 (es)
ES (2) ES8800291A1 (es)

Families Citing this family (52)

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US5089560A (en) * 1980-09-23 1992-02-18 Amoco Corporation Exopy resin with aromatic oligomer and rubber particles
US4863787A (en) * 1986-07-09 1989-09-05 Hercules Incorporated Damage tolerant composites containing infusible particles
US4999238A (en) * 1986-07-09 1991-03-12 Hercules Incorporated Damage tolerant composites containing infusible particles
US4680076A (en) * 1986-08-28 1987-07-14 Hercules Incorporated Multiphase epoxy thermosets having rubber within disperse phase
EP0262891B1 (en) * 1986-09-30 1996-12-27 Toho Rayon Co., Ltd. Resin composition of thermosetting resin and thermoplastic resin
US5231150A (en) * 1987-10-05 1993-07-27 Imperial Chemical Industries Plc Polymer composition
ES2096549T3 (es) * 1987-10-05 1997-03-16 Ici Plc Composicion de polimeros.
EP0319008A3 (en) * 1987-12-01 1990-08-08 Hercules Incorporated Epoxy resin compositions as used in producing composites with high wet glass transition temperatures and in adhesive applications
US5002821A (en) * 1987-12-15 1991-03-26 The Dexter Corporation Toughened prepregs and formulations
US4874661A (en) * 1987-12-15 1989-10-17 Browne James M Impact enhanced prepregs and formulations
US5317067A (en) * 1988-01-25 1994-05-31 Tokyo Tire & Rubber Company Limited Molding and punching out melt-mixed epoxy resin-thermoplastic resin composition with hardener
US4949443A (en) * 1988-06-29 1990-08-21 Tatsuhiko Saruwatari Numerically controlled lathe
US5096771A (en) * 1988-07-14 1992-03-17 General Electric Company Fibers impregnated with epoxy resin mixture, brominated bisphenol and polyphenylene ether
US4975319A (en) * 1988-07-14 1990-12-04 General Electric Company Printed circuit board from fibers impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether
US4853423A (en) * 1988-07-14 1989-08-01 General Electric Company Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production
US5073605A (en) * 1988-07-14 1991-12-17 General Electric Company Bromine-bisphenol reacted bisphenol and novolak epoxy resins with polyphenylene ether
US4977218A (en) * 1988-09-26 1990-12-11 Amoco Corporation Carboxylated rubber particles as tougheners for fiber reinforced composites
US4977215A (en) * 1988-09-26 1990-12-11 Amoco Corporation Carboxylated rubber particles as tougheners for fiber reinforced composites
US4972031A (en) * 1988-10-05 1990-11-20 Imperial Chemical Industries Plc Plastic moulding composition comprising an uncured or partly cured thermoset resin precursor and a polyarylsulphone
US5364914A (en) * 1988-10-05 1994-11-15 Imperial Chemical Industries Plc Moulding composition comprising a thermoset component and thermoplast component
DE3837015A1 (de) * 1988-10-31 1990-05-03 Basf Ag Haertbare, zaehmodifizierte epoxidharze
DE3842306A1 (de) * 1988-12-16 1990-06-21 Basf Ag Haertbare, zaehmodifizierte epoxidharze
JP2643518B2 (ja) * 1989-02-10 1997-08-20 東レ株式会社 プリプレグ
US5120823A (en) * 1989-02-17 1992-06-09 Basf Aktiengesellschaft Toughened thermosetting structural materials
US4930852A (en) * 1989-02-21 1990-06-05 Simmonds Precision Product, Inc. Optical fiber mounting and structural monitoring
US5087657A (en) * 1989-02-23 1992-02-11 Amoco Corporation Fiber-reinforced composites toughened with resin particles
EP0392348A3 (en) * 1989-04-14 1991-12-27 Cytec Technology Corp. Toughened thermosetting structural materials
US5470622A (en) * 1990-11-06 1995-11-28 Raychem Corporation Enclosing a substrate with a heat-recoverable article
US5268223A (en) * 1991-05-31 1993-12-07 Amoco Corporation Toughened fiber-reinforced composites
US5532296A (en) * 1991-07-30 1996-07-02 Cytec Technology Corp. Bismaleimide resin systems toughened by addition of preformed functionalized low Tg elastomer particles
ES2183802T3 (es) * 1991-07-30 2003-04-01 Cytec Tech Corp Materiales preimpregnados de matrices de resina termofraguada, reforzados con fibra y endurecidos, y los compuestos de los mismos.
TW223083B (es) * 1991-10-25 1994-05-01 Ciba Geigy Ag
US5250228A (en) * 1991-11-06 1993-10-05 Raychem Corporation Conductive polymer composition
US5464902A (en) * 1992-03-23 1995-11-07 Cytec Technology Corp. Toughening of brittle epoxy resin matrices with functionalized particulate elastomers
DE69323129T2 (de) * 1992-08-11 1999-08-19 Hexcel Corp Mit Sulfonpolymeren zäher gemachte hitzehärtbare Harze
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US5360840A (en) * 1992-12-29 1994-11-01 Hercules Incorporated Epoxy resin compositions with improved storage stability
US5418313A (en) * 1994-05-25 1995-05-23 Air Products And Chemicals, Inc. Process for reducing cure time in epoxy resins cured with methylenedianiline and derivatives
KR100314614B1 (ko) * 1999-10-01 2001-11-15 유현식 열가소성 고분자 입자 첨가에 의한 고강인성 열경화성 수지 조성물의 제조방법
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TW528771B (en) * 2000-01-27 2003-04-21 Lead Data Inc Soluble thermosetting polyethersulfone and making of them
US6586607B1 (en) 2002-04-11 2003-07-01 Indspec Chemical Corporation Process for making diglycidylether of alkoxylated resorcinol
JP4151573B2 (ja) * 2003-12-16 2008-09-17 東洋紡績株式会社 硬化型組成物
DE102004062551A1 (de) * 2004-12-24 2006-07-06 Rhein Chemie Rheinau Gmbh Mikrogel-enthaltende duroplastische Zusammensetzung
WO2006088612A1 (en) * 2005-02-16 2006-08-24 Cytec Technology Corp. Bismaleimire resin with high temperature thermal stability
MY156295A (en) 2009-08-31 2016-01-29 Cytec Tech Corp High performance adhesive compositions
GB0922599D0 (en) * 2009-12-23 2010-02-10 Cytec Tech Corp Modified resin systems for liquid resin infusion applications, prepreg autoclave applications and hybrids thereof
US8686069B2 (en) 2010-10-12 2014-04-01 Hexcel Corporation Solvent resistance of epoxy resins toughened with polyethersulfone
DE102011006674A1 (de) 2011-04-01 2012-10-04 Bayer Materialscience Aktiengesellschaft Polymere Nanopartikel und Beschichtungsmittel mit polymeren Nanopartikel
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US4330659A (en) * 1980-10-06 1982-05-18 Ciba-Geigy Corporation Modified amine hardener systems
US4430473A (en) * 1981-03-12 1984-02-07 Union Carbide Corporation Composites made from thermosetting compositions containing hemiformals of phenol
ZA84548B (en) * 1983-05-20 1984-12-24 Union Carbide Corp Impact resistant matrix resins for advanced composites
US4517321A (en) * 1983-05-20 1985-05-14 Union Carbide Corporation Preimpregnated reinforcements and high strength composites therefrom
ATE28654T1 (de) * 1983-06-30 1987-08-15 Union Carbide Corp Epoxidharzzusammensetzungen mit oligomeren diaminen als haertungsmitteln und verbundstoffen mit hoher festigkeit.

Also Published As

Publication number Publication date
JPH0668015B2 (ja) 1994-08-31
ES557453A0 (es) 1988-06-16
US4656208A (en) 1987-04-07
ES8802532A1 (es) 1988-06-16
CA1246294A (en) 1988-12-06
KR860006509A (ko) 1986-09-11
EP0193082A1 (en) 1986-09-03
KR940010827B1 (ko) 1994-11-17
CA1283241C (en) 1991-04-16
ES552137A0 (es) 1987-10-16
JPS6426665A (en) 1989-01-27
DE3669724D1 (de) 1990-04-26
EP0193082B1 (en) 1990-03-21

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 20070716