KR850000171A - 프린트 배선판위의 칩형회로 요소의 자동설치 장치 - Google Patents

프린트 배선판위의 칩형회로 요소의 자동설치 장치 Download PDF

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Publication number
KR850000171A
KR850000171A KR1019840001791A KR840001791A KR850000171A KR 850000171 A KR850000171 A KR 850000171A KR 1019840001791 A KR1019840001791 A KR 1019840001791A KR 840001791 A KR840001791 A KR 840001791A KR 850000171 A KR850000171 A KR 850000171A
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South Korea
Prior art keywords
chip
circuit element
wiring board
printed wiring
tape
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KR1019840001791A
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English (en)
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KR910009484B1 (ko
Inventor
데쓰오(외 2) 다까하시
Original Assignee
오오도시 유다까
데이 데이 게이 가부시기가이샤
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Priority claimed from JP58082803A external-priority patent/JPS59209729A/ja
Priority claimed from JP58247073A external-priority patent/JPS60137100A/ja
Application filed by 오오도시 유다까, 데이 데이 게이 가부시기가이샤 filed Critical 오오도시 유다까
Publication of KR850000171A publication Critical patent/KR850000171A/ko
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Publication of KR910009484B1 publication Critical patent/KR910009484B1/ko

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/07—Responding to the occurrence of a fault, e.g. fault tolerance
    • G06F11/16—Error detection or correction of the data by redundancy in hardware
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

내용 없음.

Description

프린트 배선판위의 칩형회로 요소의 자동설치 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 자동설치장치가 적용되는 시스템의 일예를 보여주는 개략적인 사시도.
제21도(A)-1도(F)의 각각은 본 발명에 의한 자동설치장치의 다른 실시예의 작동을 나타내는 정면도.

Claims (9)

  1. 세로방향의 일렬로 배치되어 지지된 칩형회로요소를 보유한 칩테이프(32)로부터 칩형회로요소(34)를 하나씩 제거하고, 전기한 칩형회로요소를 프린트 배선판(P)에 장착시키는 수직이동가능한 헤드(46)와, 전기한 칩형회로요소가 칩테이프로부터 제거되는 위치와 칩테이프 회로요소가 프린트배선판에 장착되는 위치 사이에서 헤드를 세로방향으로 이동시키는 상부프레일(48)과, 전기한 상부프레임을 세로방향으로 이동가능하게 지지하는 프레임(50)과, 축(106)을 통하여 하부프레임에 회동가능하게 장착되어 칩테이프를 이송하여 한쪽방향 클리치에 의해 오직 한방향으로 회동되는 피이드 휘일(108)과, 전기한 피이드 휘일의 축에 끼여 상부프레임을 향하여 연장되어 비틀림력이 가해지지 않는 방향으로 기울어지게 된 레버(124)장치와, 전기한 레버장치에 인접하여 이를 압압하기 위하여 상부프레일에 설치된 캠장치(128)로 구성되고,이러한 구성에 의해 전기한 칩테이프가 헤드의 세로방향 운동과 함께 피이드 휘일에 의해간헐적으로 공급되는 것을 특징으로 하는 프린트 배선판위 의칩형회로요소 자동설치장치.
  2. 제1항에 있어서, 전기한 헤드(46)가 칩테이프(32)로부터 칩형회로요(34)소를 추출하는 진공노즐(52)과 이 진공노즐 둘레에 배치된 물림장치(54)로 구성된 것을 특징으로 하는 프린트 배선판위의 칩형회로요소 자동설치장치.
  3. 제1항에 있어서, 전기한 헤드(46)의 수직운동이 제1작동장치에 의해서, 헤드의 세로방향운동이 제2작동장치에 의하여수 행되는 것을 특징으로 하는 프린트 배선판위의 칩형회로요소 자동설치장치.
  4. 제1항에 있어서, 전기한 칩테이프(32)을 간헐적으로 운반하는 것이 상부프레임(48)의 매전향운동에 의하여 수행되는 것을 특징으로 하는 프린트 배선판위의 칩형회로요소 자동설치장치.
  5. 제1항에 있어서, 전기한 상부프레임(48)의 세로방향 및 축방향위치를 조정하기 위한 X-Y 테이블장치(136)로 구성된 것을 특징으로 하는 프린트 배선판위의 칩형회로요소 자동설치장치.
  6. 제1항에 있어서, 전기한 칩테이프(32)의 테이프 커버(28)를 감는 권선기(138)로 구성된 것을 특징으로 하는 프린트 배선판위의 칩형회로요소 자동설치장치.
  7. 제1항에 있어서, 전기한 칩테이프(32)로부터 전기한 칩형회로요소(34)를 쉽게 제거하기 위한 이젝터 핀 기계(140)로 구성된 것을 특징으로 하는 프린트 배선판위의 칩형회로요소 자동설치장치.
  8. 제1항에 있어서, 칩형회로요소(34) 장착작업 이전에 전기한 칩형회로요소를 전기한 칩테이프(32) 위에 정확하게 위치시키기 위한 샤터기계(142)로 구성된 것을 특징으로하는 프린트 배선판위의 칩형회로요소 자동설치장치.
  9. 제1항에 있어서, 전기한 칩형회로요소(34) 추출위치(X1)와 칩형회로요소 장착위치(X2) 사이에서 왕복할 수 있도록 상부프레이(48) 하부프레일(50)에 이동가능하게 지지된다는 것과, 또한 전기한 상부프레임과 헤드(46)를 상호 연결시켜 선회장치에 의해 함께 축방향으로 결합되며, 전기한 칩형회로요소 장착방향과 일직선상에 있게 될 때에 수직축상에 서로 수직하게 배치되는 2개의 링크(202),(204)와, 전기한 칩형회로요소 장착방향에 실제로 수직한 방향으로 선회장치를 이동시키는 기계로 구성된다는 것과, 전기한 링크가 서로 수직하게 배치될 때 선회장치가 링크에 의하여 제한된 수직축의 양측면 사이에서 운동할 수 있도록 전기한 기계에 의해 이동된 선회장치의 행정이 상부프레임의 행정보다 크게 된 것을 특징으로 하는 프린트 배선판위의 칩형회로요소 자동설치장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019840001791A 1983-05-13 1984-04-04 프린트 배선판위의 칩형회로 요소의 자동설치 장치 KR910009484B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP82803 1983-05-13
JP58082803A JPS59209729A (ja) 1983-05-13 1983-05-13 電子部品自動装着装置
JP83-247073 1983-05-13
JP58247073A JPS60137100A (ja) 1983-12-26 1983-12-26 電子部品の自動実装装置
JP83-82803 1983-12-26

Publications (2)

Publication Number Publication Date
KR850000171A true KR850000171A (ko) 1985-02-25
KR910009484B1 KR910009484B1 (ko) 1991-11-16

Family

ID=26423816

Family Applications (1)

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KR1019840001791A KR910009484B1 (ko) 1983-05-13 1984-04-04 프린트 배선판위의 칩형회로 요소의 자동설치 장치

Country Status (6)

Country Link
US (1) US4606117A (ko)
KR (1) KR910009484B1 (ko)
CA (1) CA1204519A (ko)
DE (1) DE3408920A1 (ko)
FR (1) FR2546024B1 (ko)
GB (1) GB2139597B (ko)

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DE10020748A1 (de) * 2000-04-27 2001-11-15 Siemens Ag Zuführeinrichtung für in einem Gurt aufgenommene elektrische Bauteile
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JP4840422B2 (ja) * 2008-09-04 2011-12-21 パナソニック株式会社 電子部品実装用装置及び電子部品実装用装置による作業方法
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Also Published As

Publication number Publication date
GB2139597B (en) 1986-07-09
FR2546024B1 (fr) 1988-08-05
GB2139597A (en) 1984-11-14
KR910009484B1 (ko) 1991-11-16
FR2546024A1 (fr) 1984-11-16
US4606117A (en) 1986-08-19
DE3408920A1 (de) 1984-11-15
GB8405385D0 (en) 1984-04-04
CA1204519A (en) 1986-05-13

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