KR20260027109A - 수지 조성물 및 접속 구조체의 제조 방법 - Google Patents

수지 조성물 및 접속 구조체의 제조 방법

Info

Publication number
KR20260027109A
KR20260027109A KR1020257026721A KR20257026721A KR20260027109A KR 20260027109 A KR20260027109 A KR 20260027109A KR 1020257026721 A KR1020257026721 A KR 1020257026721A KR 20257026721 A KR20257026721 A KR 20257026721A KR 20260027109 A KR20260027109 A KR 20260027109A
Authority
KR
South Korea
Prior art keywords
electrode
resin composition
solder
particles
target member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257026721A
Other languages
English (en)
Korean (ko)
Inventor
유타 야마나카
슈지로 사다나가
아츠시 하세가와
Original Assignee
세키스이가가쿠 고교가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세키스이가가쿠 고교가부시키가이샤 filed Critical 세키스이가가쿠 고교가부시키가이샤
Publication of KR20260027109A publication Critical patent/KR20260027109A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
KR1020257026721A 2023-06-26 2024-06-24 수지 조성물 및 접속 구조체의 제조 방법 Pending KR20260027109A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2023-104437 2023-06-26
JP2023104437 2023-06-26
PCT/JP2024/022796 WO2025005036A1 (ja) 2023-06-26 2024-06-24 樹脂組成物及び接続構造体の製造方法

Publications (1)

Publication Number Publication Date
KR20260027109A true KR20260027109A (ko) 2026-02-27

Family

ID=93939098

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257026721A Pending KR20260027109A (ko) 2023-06-26 2024-06-24 수지 조성물 및 접속 구조체의 제조 방법

Country Status (5)

Country Link
JP (1) JP7637320B1 (https=)
KR (1) KR20260027109A (https=)
CN (1) CN121002591A (https=)
TW (1) TW202511413A (https=)
WO (1) WO2025005036A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5900349B2 (ja) * 2011-01-27 2016-04-06 日立化成株式会社 導電性接着剤組成物、接続体及び太陽電池モジュール
WO2013054869A1 (ja) * 2011-10-13 2013-04-18 コニカミノルタアドバンストレイヤー株式会社 太陽光反射用ミラー及び太陽熱発電用反射装置
JP6611424B2 (ja) * 2014-10-28 2019-11-27 デクセリアルズ株式会社 熱硬化性接着組成物、及び熱硬化性接着シート
WO2023054259A1 (ja) * 2021-09-29 2023-04-06 デクセリアルズ株式会社 フィラー含有フィルム

Also Published As

Publication number Publication date
JPWO2025005036A1 (https=) 2025-01-02
TW202511413A (zh) 2025-03-16
CN121002591A (zh) 2025-11-21
WO2025005036A1 (ja) 2025-01-02
JP7637320B1 (ja) 2025-02-27

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Legal Events

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PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)