JPWO2025005036A1 - - Google Patents

Info

Publication number
JPWO2025005036A1
JPWO2025005036A1 JP2024566007A JP2024566007A JPWO2025005036A1 JP WO2025005036 A1 JPWO2025005036 A1 JP WO2025005036A1 JP 2024566007 A JP2024566007 A JP 2024566007A JP 2024566007 A JP2024566007 A JP 2024566007A JP WO2025005036 A1 JPWO2025005036 A1 JP WO2025005036A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024566007A
Other languages
Japanese (ja)
Other versions
JP7637320B1 (ja
JPWO2025005036A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2025005036A1 publication Critical patent/JPWO2025005036A1/ja
Application granted granted Critical
Publication of JP7637320B1 publication Critical patent/JP7637320B1/ja
Publication of JPWO2025005036A5 publication Critical patent/JPWO2025005036A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
JP2024566007A 2023-06-26 2024-06-24 樹脂組成物及び接続構造体の製造方法 Active JP7637320B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023104437 2023-06-26
JP2023104437 2023-06-26
PCT/JP2024/022796 WO2025005036A1 (ja) 2023-06-26 2024-06-24 樹脂組成物及び接続構造体の製造方法

Publications (3)

Publication Number Publication Date
JPWO2025005036A1 true JPWO2025005036A1 (https=) 2025-01-02
JP7637320B1 JP7637320B1 (ja) 2025-02-27
JPWO2025005036A5 JPWO2025005036A5 (https=) 2025-06-04

Family

ID=93939098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024566007A Active JP7637320B1 (ja) 2023-06-26 2024-06-24 樹脂組成物及び接続構造体の製造方法

Country Status (5)

Country Link
JP (1) JP7637320B1 (https=)
KR (1) KR20260027109A (https=)
CN (1) CN121002591A (https=)
TW (1) TW202511413A (https=)
WO (1) WO2025005036A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5900349B2 (ja) * 2011-01-27 2016-04-06 日立化成株式会社 導電性接着剤組成物、接続体及び太陽電池モジュール
WO2013054869A1 (ja) * 2011-10-13 2013-04-18 コニカミノルタアドバンストレイヤー株式会社 太陽光反射用ミラー及び太陽熱発電用反射装置
JP6611424B2 (ja) * 2014-10-28 2019-11-27 デクセリアルズ株式会社 熱硬化性接着組成物、及び熱硬化性接着シート
WO2023054259A1 (ja) * 2021-09-29 2023-04-06 デクセリアルズ株式会社 フィラー含有フィルム

Also Published As

Publication number Publication date
TW202511413A (zh) 2025-03-16
CN121002591A (zh) 2025-11-21
WO2025005036A1 (ja) 2025-01-02
KR20260027109A (ko) 2026-02-27
JP7637320B1 (ja) 2025-02-27

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