CN121002591A - 树脂组合物以及连接结构体的制造方法 - Google Patents

树脂组合物以及连接结构体的制造方法

Info

Publication number
CN121002591A
CN121002591A CN202480011775.0A CN202480011775A CN121002591A CN 121002591 A CN121002591 A CN 121002591A CN 202480011775 A CN202480011775 A CN 202480011775A CN 121002591 A CN121002591 A CN 121002591A
Authority
CN
China
Prior art keywords
electrode
resin composition
solder
particles
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480011775.0A
Other languages
English (en)
Chinese (zh)
Inventor
山中雄太
定永周治郎
长谷川淳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN121002591A publication Critical patent/CN121002591A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
CN202480011775.0A 2023-06-26 2024-06-24 树脂组合物以及连接结构体的制造方法 Pending CN121002591A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023-104437 2023-06-26
JP2023104437 2023-06-26
PCT/JP2024/022796 WO2025005036A1 (ja) 2023-06-26 2024-06-24 樹脂組成物及び接続構造体の製造方法

Publications (1)

Publication Number Publication Date
CN121002591A true CN121002591A (zh) 2025-11-21

Family

ID=93939098

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480011775.0A Pending CN121002591A (zh) 2023-06-26 2024-06-24 树脂组合物以及连接结构体的制造方法

Country Status (5)

Country Link
JP (1) JP7637320B1 (https=)
KR (1) KR20260027109A (https=)
CN (1) CN121002591A (https=)
TW (1) TW202511413A (https=)
WO (1) WO2025005036A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5900349B2 (ja) * 2011-01-27 2016-04-06 日立化成株式会社 導電性接着剤組成物、接続体及び太陽電池モジュール
WO2013054869A1 (ja) * 2011-10-13 2013-04-18 コニカミノルタアドバンストレイヤー株式会社 太陽光反射用ミラー及び太陽熱発電用反射装置
JP6611424B2 (ja) * 2014-10-28 2019-11-27 デクセリアルズ株式会社 熱硬化性接着組成物、及び熱硬化性接着シート
WO2023054259A1 (ja) * 2021-09-29 2023-04-06 デクセリアルズ株式会社 フィラー含有フィルム

Also Published As

Publication number Publication date
JPWO2025005036A1 (https=) 2025-01-02
TW202511413A (zh) 2025-03-16
WO2025005036A1 (ja) 2025-01-02
KR20260027109A (ko) 2026-02-27
JP7637320B1 (ja) 2025-02-27

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