JP7637320B1 - 樹脂組成物及び接続構造体の製造方法 - Google Patents

樹脂組成物及び接続構造体の製造方法 Download PDF

Info

Publication number
JP7637320B1
JP7637320B1 JP2024566007A JP2024566007A JP7637320B1 JP 7637320 B1 JP7637320 B1 JP 7637320B1 JP 2024566007 A JP2024566007 A JP 2024566007A JP 2024566007 A JP2024566007 A JP 2024566007A JP 7637320 B1 JP7637320 B1 JP 7637320B1
Authority
JP
Japan
Prior art keywords
resin composition
solder
electrode
connection
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024566007A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025005036A1 (https=
JPWO2025005036A5 (https=
Inventor
雄太 山中
周治郎 定永
淳 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of JPWO2025005036A1 publication Critical patent/JPWO2025005036A1/ja
Application granted granted Critical
Publication of JP7637320B1 publication Critical patent/JP7637320B1/ja
Publication of JPWO2025005036A5 publication Critical patent/JPWO2025005036A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
JP2024566007A 2023-06-26 2024-06-24 樹脂組成物及び接続構造体の製造方法 Active JP7637320B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023104437 2023-06-26
JP2023104437 2023-06-26
PCT/JP2024/022796 WO2025005036A1 (ja) 2023-06-26 2024-06-24 樹脂組成物及び接続構造体の製造方法

Publications (3)

Publication Number Publication Date
JPWO2025005036A1 JPWO2025005036A1 (https=) 2025-01-02
JP7637320B1 true JP7637320B1 (ja) 2025-02-27
JPWO2025005036A5 JPWO2025005036A5 (https=) 2025-06-04

Family

ID=93939098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024566007A Active JP7637320B1 (ja) 2023-06-26 2024-06-24 樹脂組成物及び接続構造体の製造方法

Country Status (5)

Country Link
JP (1) JP7637320B1 (https=)
KR (1) KR20260027109A (https=)
CN (1) CN121002591A (https=)
TW (1) TW202511413A (https=)
WO (1) WO2025005036A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012102077A1 (ja) * 2011-01-27 2012-08-02 日立化成工業株式会社 導電性接着剤組成物、接続体及び太陽電池モジュール
WO2013054869A1 (ja) * 2011-10-13 2013-04-18 コニカミノルタアドバンストレイヤー株式会社 太陽光反射用ミラー及び太陽熱発電用反射装置
WO2016067966A1 (ja) * 2014-10-28 2016-05-06 デクセリアルズ株式会社 熱硬化性接着組成物、及び熱硬化性接着シート
WO2023054259A1 (ja) * 2021-09-29 2023-04-06 デクセリアルズ株式会社 フィラー含有フィルム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012102077A1 (ja) * 2011-01-27 2012-08-02 日立化成工業株式会社 導電性接着剤組成物、接続体及び太陽電池モジュール
WO2013054869A1 (ja) * 2011-10-13 2013-04-18 コニカミノルタアドバンストレイヤー株式会社 太陽光反射用ミラー及び太陽熱発電用反射装置
WO2016067966A1 (ja) * 2014-10-28 2016-05-06 デクセリアルズ株式会社 熱硬化性接着組成物、及び熱硬化性接着シート
WO2023054259A1 (ja) * 2021-09-29 2023-04-06 デクセリアルズ株式会社 フィラー含有フィルム

Also Published As

Publication number Publication date
JPWO2025005036A1 (https=) 2025-01-02
TW202511413A (zh) 2025-03-16
CN121002591A (zh) 2025-11-21
WO2025005036A1 (ja) 2025-01-02
KR20260027109A (ko) 2026-02-27

Similar Documents

Publication Publication Date Title
JP7730856B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
WO2018225800A1 (ja) 半導体用フィルム状接着剤、半導体装置の製造方法及び半導体装置
JP7356217B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP2019140101A (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7518602B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP2023138947A (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7637320B1 (ja) 樹脂組成物及び接続構造体の製造方法
JP7526371B2 (ja) 導電ペースト及び接続構造体
JP7497136B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP2019175844A (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7617347B1 (ja) 樹脂組成物及び接続構造体の製造方法
JP2021002446A (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7698417B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP2019131634A (ja) 硬化性材料、接続構造体及び接続構造体の製造方法
JP7352353B2 (ja) 導電材料及び接続構造体
JP7372745B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP2019099610A (ja) 接続構造体の製造方法、導電材料及び接続構造体
JP2019096549A (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP2020170591A (ja) 導電材料及び接続構造体
JP2020092087A (ja) 導電フィルム及び接続構造体
JP2021012758A (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7425561B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP2019204784A (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP2020119955A (ja) 接続構造体、接続構造体の製造方法、導電材料及び導電材料の製造方法
JP2019212467A (ja) 導電材料、接続構造体及び接続構造体の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20241107

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20241107

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20241107

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20241203

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250110

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250121

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250214

R150 Certificate of patent or registration of utility model

Ref document number: 7637320

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150