KR20250135215A - 배선 형성용 부재, 배선층의 형성 방법, 및, 배선 형성 부재 - Google Patents

배선 형성용 부재, 배선층의 형성 방법, 및, 배선 형성 부재

Info

Publication number
KR20250135215A
KR20250135215A KR1020257025244A KR20257025244A KR20250135215A KR 20250135215 A KR20250135215 A KR 20250135215A KR 1020257025244 A KR1020257025244 A KR 1020257025244A KR 20257025244 A KR20257025244 A KR 20257025244A KR 20250135215 A KR20250135215 A KR 20250135215A
Authority
KR
South Korea
Prior art keywords
wiring
adhesive layer
forming
layer
forming member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257025244A
Other languages
English (en)
Korean (ko)
Inventor
마사시 오코시
유카 이토
구니히코 아카이
노조무 다카노
히로유키 이자와
다이스케 후지모토
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20250135215A publication Critical patent/KR20250135215A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
KR1020257025244A 2023-01-10 2024-01-10 배선 형성용 부재, 배선층의 형성 방법, 및, 배선 형성 부재 Pending KR20250135215A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2023-001504 2023-01-10
JP2023001504 2023-01-10
PCT/JP2024/000316 WO2024150769A1 (ja) 2023-01-10 2024-01-10 配線形成用部材、配線層の形成方法、及び、配線形成部材

Publications (1)

Publication Number Publication Date
KR20250135215A true KR20250135215A (ko) 2025-09-12

Family

ID=91897001

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257025244A Pending KR20250135215A (ko) 2023-01-10 2024-01-10 배선 형성용 부재, 배선층의 형성 방법, 및, 배선 형성 부재

Country Status (5)

Country Link
JP (1) JPWO2024150769A1 (https=)
KR (1) KR20250135215A (https=)
CN (3) CN118696608A (https=)
TW (1) TW202446185A (https=)
WO (1) WO2024150769A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012191204A (ja) 2011-03-11 2012-10-04 Ibiden Co Ltd プリント配線板の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62229714A (ja) * 1986-03-31 1987-10-08 日東電工株式会社 異方導電性シ−ト
JPS63102110A (ja) * 1986-10-17 1988-05-07 富士ゼロックス株式会社 異方導電体及びその製法
JP2001326469A (ja) * 2000-05-16 2001-11-22 Toshiba Chem Corp プリント配線板およびプリント配線板の製造方法
WO2009069273A1 (ja) * 2007-11-28 2009-06-04 Panasonic Corporation 導電性ペーストおよびこれを用いた電気電子機器
CN110265174B (zh) * 2015-01-13 2022-06-28 迪睿合株式会社 各向异性导电性膜
TWI731986B (zh) * 2016-06-29 2021-07-01 日商迪愛生股份有限公司 苯酚酚醛清漆樹脂、硬化性樹脂組成物及其硬化物
JP6950233B2 (ja) * 2017-03-28 2021-10-13 昭和電工マテリアルズ株式会社 ビルドアップフィルム接着用熱硬化性樹脂組成物、熱硬化性樹脂組成物、プリプレグ、積層体、積層板、多層プリント配線板及び半導体パッケージ
WO2022030634A1 (ja) * 2020-08-07 2022-02-10 昭和電工マテリアルズ株式会社 配線形成用部材、配線形成用部材を用いた配線層の形成方法、及び、配線形成部材

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012191204A (ja) 2011-03-11 2012-10-04 Ibiden Co Ltd プリント配線板の製造方法

Also Published As

Publication number Publication date
CN118661476A (zh) 2024-09-17
JPWO2024150769A1 (https=) 2024-07-18
WO2024150769A1 (ja) 2024-07-18
CN118696608A (zh) 2024-09-24
CN120435921A (zh) 2025-08-05
TW202446185A (zh) 2024-11-16

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