TW202446185A - 配線形成用構件、配線層之形成方法及配線形成構件 - Google Patents

配線形成用構件、配線層之形成方法及配線形成構件 Download PDF

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Publication number
TW202446185A
TW202446185A TW113101104A TW113101104A TW202446185A TW 202446185 A TW202446185 A TW 202446185A TW 113101104 A TW113101104 A TW 113101104A TW 113101104 A TW113101104 A TW 113101104A TW 202446185 A TW202446185 A TW 202446185A
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TW
Taiwan
Prior art keywords
wiring
adhesive layer
wiring forming
conductive particles
layer
Prior art date
Application number
TW113101104A
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English (en)
Chinese (zh)
Inventor
大越將司
伊藤由佳
赤井邦彥
高野希
伊澤弘行
藤本大輔
Original Assignee
日商力森諾科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202446185A publication Critical patent/TW202446185A/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
TW113101104A 2023-01-10 2024-01-10 配線形成用構件、配線層之形成方法及配線形成構件 TW202446185A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-001504 2023-01-10
JP2023001504 2023-01-10

Publications (1)

Publication Number Publication Date
TW202446185A true TW202446185A (zh) 2024-11-16

Family

ID=91897001

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113101104A TW202446185A (zh) 2023-01-10 2024-01-10 配線形成用構件、配線層之形成方法及配線形成構件

Country Status (5)

Country Link
JP (1) JPWO2024150769A1 (https=)
KR (1) KR20250135215A (https=)
CN (3) CN118696608A (https=)
TW (1) TW202446185A (https=)
WO (1) WO2024150769A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62229714A (ja) * 1986-03-31 1987-10-08 日東電工株式会社 異方導電性シ−ト
JPS63102110A (ja) * 1986-10-17 1988-05-07 富士ゼロックス株式会社 異方導電体及びその製法
JP2001326469A (ja) * 2000-05-16 2001-11-22 Toshiba Chem Corp プリント配線板およびプリント配線板の製造方法
WO2009069273A1 (ja) * 2007-11-28 2009-06-04 Panasonic Corporation 導電性ペーストおよびこれを用いた電気電子機器
US8745860B2 (en) 2011-03-11 2014-06-10 Ibiden Co., Ltd. Method for manufacturing printed wiring board
CN110265174B (zh) * 2015-01-13 2022-06-28 迪睿合株式会社 各向异性导电性膜
TWI731986B (zh) * 2016-06-29 2021-07-01 日商迪愛生股份有限公司 苯酚酚醛清漆樹脂、硬化性樹脂組成物及其硬化物
JP6950233B2 (ja) * 2017-03-28 2021-10-13 昭和電工マテリアルズ株式会社 ビルドアップフィルム接着用熱硬化性樹脂組成物、熱硬化性樹脂組成物、プリプレグ、積層体、積層板、多層プリント配線板及び半導体パッケージ
WO2022030634A1 (ja) * 2020-08-07 2022-02-10 昭和電工マテリアルズ株式会社 配線形成用部材、配線形成用部材を用いた配線層の形成方法、及び、配線形成部材

Also Published As

Publication number Publication date
CN118661476A (zh) 2024-09-17
JPWO2024150769A1 (https=) 2024-07-18
WO2024150769A1 (ja) 2024-07-18
KR20250135215A (ko) 2025-09-12
CN118696608A (zh) 2024-09-24
CN120435921A (zh) 2025-08-05

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