CN118696608A - 配线形成用部件、使用了配线形成用部件的配线层的形成方法及配线形成部件 - Google Patents

配线形成用部件、使用了配线形成用部件的配线层的形成方法及配线形成部件 Download PDF

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Publication number
CN118696608A
CN118696608A CN202380020683.4A CN202380020683A CN118696608A CN 118696608 A CN118696608 A CN 118696608A CN 202380020683 A CN202380020683 A CN 202380020683A CN 118696608 A CN118696608 A CN 118696608A
Authority
CN
China
Prior art keywords
wiring
adhesive layer
wiring forming
forming member
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380020683.4A
Other languages
English (en)
Chinese (zh)
Inventor
大越将司
伊藤由佳
高木俊辅
赤井邦彦
高野希
伊泽弘行
藤本大辅
小竹智彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Priority claimed from PCT/JP2023/004213 external-priority patent/WO2023153445A1/ja
Publication of CN118696608A publication Critical patent/CN118696608A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
CN202380020683.4A 2022-02-09 2023-02-08 配线形成用部件、使用了配线形成用部件的配线层的形成方法及配线形成部件 Pending CN118696608A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPPCT/JP2022/005184 2022-02-09
JP2023-001504 2023-01-10
JP2023001504 2023-01-10
PCT/JP2023/004213 WO2023153445A1 (ja) 2022-02-09 2023-02-08 配線形成用部材、配線形成用部材を用いた配線層の形成方法、及び、配線形成部材

Publications (1)

Publication Number Publication Date
CN118696608A true CN118696608A (zh) 2024-09-24

Family

ID=91897001

Family Applications (3)

Application Number Title Priority Date Filing Date
CN202380020683.4A Pending CN118696608A (zh) 2022-02-09 2023-02-08 配线形成用部件、使用了配线形成用部件的配线层的形成方法及配线形成部件
CN202380020824.2A Pending CN118661476A (zh) 2022-02-09 2023-02-08 配线形成用部件、使用了配线形成用部件的配线层的形成方法及配线形成部件
CN202480002376.8A Pending CN120435921A (zh) 2023-01-10 2024-01-10 配线形成用部件、配线层的形成方法及配线形成部件

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN202380020824.2A Pending CN118661476A (zh) 2022-02-09 2023-02-08 配线形成用部件、使用了配线形成用部件的配线层的形成方法及配线形成部件
CN202480002376.8A Pending CN120435921A (zh) 2023-01-10 2024-01-10 配线形成用部件、配线层的形成方法及配线形成部件

Country Status (5)

Country Link
JP (1) JPWO2024150769A1 (https=)
KR (1) KR20250135215A (https=)
CN (3) CN118696608A (https=)
TW (1) TW202446185A (https=)
WO (1) WO2024150769A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62229714A (ja) * 1986-03-31 1987-10-08 日東電工株式会社 異方導電性シ−ト
JPS63102110A (ja) * 1986-10-17 1988-05-07 富士ゼロックス株式会社 異方導電体及びその製法
JP2001326469A (ja) * 2000-05-16 2001-11-22 Toshiba Chem Corp プリント配線板およびプリント配線板の製造方法
WO2009069273A1 (ja) * 2007-11-28 2009-06-04 Panasonic Corporation 導電性ペーストおよびこれを用いた電気電子機器
US8745860B2 (en) 2011-03-11 2014-06-10 Ibiden Co., Ltd. Method for manufacturing printed wiring board
CN110265174B (zh) * 2015-01-13 2022-06-28 迪睿合株式会社 各向异性导电性膜
TWI731986B (zh) * 2016-06-29 2021-07-01 日商迪愛生股份有限公司 苯酚酚醛清漆樹脂、硬化性樹脂組成物及其硬化物
JP6950233B2 (ja) * 2017-03-28 2021-10-13 昭和電工マテリアルズ株式会社 ビルドアップフィルム接着用熱硬化性樹脂組成物、熱硬化性樹脂組成物、プリプレグ、積層体、積層板、多層プリント配線板及び半導体パッケージ
WO2022030634A1 (ja) * 2020-08-07 2022-02-10 昭和電工マテリアルズ株式会社 配線形成用部材、配線形成用部材を用いた配線層の形成方法、及び、配線形成部材

Also Published As

Publication number Publication date
CN118661476A (zh) 2024-09-17
JPWO2024150769A1 (https=) 2024-07-18
WO2024150769A1 (ja) 2024-07-18
KR20250135215A (ko) 2025-09-12
CN120435921A (zh) 2025-08-05
TW202446185A (zh) 2024-11-16

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