JPWO2024150769A1 - - Google Patents
Info
- Publication number
- JPWO2024150769A1 JPWO2024150769A1 JP2024570200A JP2024570200A JPWO2024150769A1 JP WO2024150769 A1 JPWO2024150769 A1 JP WO2024150769A1 JP 2024570200 A JP2024570200 A JP 2024570200A JP 2024570200 A JP2024570200 A JP 2024570200A JP WO2024150769 A1 JPWO2024150769 A1 JP WO2024150769A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023001504 | 2023-01-10 | ||
| PCT/JP2024/000316 WO2024150769A1 (ja) | 2023-01-10 | 2024-01-10 | 配線形成用部材、配線層の形成方法、及び、配線形成部材 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024150769A1 true JPWO2024150769A1 (https=) | 2024-07-18 |
Family
ID=91897001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024570200A Pending JPWO2024150769A1 (https=) | 2023-01-10 | 2024-01-10 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024150769A1 (https=) |
| KR (1) | KR20250135215A (https=) |
| CN (3) | CN118696608A (https=) |
| TW (1) | TW202446185A (https=) |
| WO (1) | WO2024150769A1 (https=) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62229714A (ja) * | 1986-03-31 | 1987-10-08 | 日東電工株式会社 | 異方導電性シ−ト |
| JPS63102110A (ja) * | 1986-10-17 | 1988-05-07 | 富士ゼロックス株式会社 | 異方導電体及びその製法 |
| JP2001326469A (ja) * | 2000-05-16 | 2001-11-22 | Toshiba Chem Corp | プリント配線板およびプリント配線板の製造方法 |
| WO2009069273A1 (ja) * | 2007-11-28 | 2009-06-04 | Panasonic Corporation | 導電性ペーストおよびこれを用いた電気電子機器 |
| US8745860B2 (en) | 2011-03-11 | 2014-06-10 | Ibiden Co., Ltd. | Method for manufacturing printed wiring board |
| CN110265174B (zh) * | 2015-01-13 | 2022-06-28 | 迪睿合株式会社 | 各向异性导电性膜 |
| TWI731986B (zh) * | 2016-06-29 | 2021-07-01 | 日商迪愛生股份有限公司 | 苯酚酚醛清漆樹脂、硬化性樹脂組成物及其硬化物 |
| JP6950233B2 (ja) * | 2017-03-28 | 2021-10-13 | 昭和電工マテリアルズ株式会社 | ビルドアップフィルム接着用熱硬化性樹脂組成物、熱硬化性樹脂組成物、プリプレグ、積層体、積層板、多層プリント配線板及び半導体パッケージ |
| WO2022030634A1 (ja) * | 2020-08-07 | 2022-02-10 | 昭和電工マテリアルズ株式会社 | 配線形成用部材、配線形成用部材を用いた配線層の形成方法、及び、配線形成部材 |
-
2023
- 2023-02-08 CN CN202380020683.4A patent/CN118696608A/zh active Pending
- 2023-02-08 CN CN202380020824.2A patent/CN118661476A/zh active Pending
-
2024
- 2024-01-10 CN CN202480002376.8A patent/CN120435921A/zh active Pending
- 2024-01-10 WO PCT/JP2024/000316 patent/WO2024150769A1/ja not_active Ceased
- 2024-01-10 JP JP2024570200A patent/JPWO2024150769A1/ja active Pending
- 2024-01-10 KR KR1020257025244A patent/KR20250135215A/ko active Pending
- 2024-01-10 TW TW113101104A patent/TW202446185A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN118661476A (zh) | 2024-09-17 |
| WO2024150769A1 (ja) | 2024-07-18 |
| KR20250135215A (ko) | 2025-09-12 |
| CN118696608A (zh) | 2024-09-24 |
| CN120435921A (zh) | 2025-08-05 |
| TW202446185A (zh) | 2024-11-16 |